Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
pacchetto: - |
Azione2.032 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Texas Instruments |
IC CLK BUF 1:10 400MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione127.812 |
|
1 | 1:10 | Yes/Yes | LVDS, LVPECL, PECL | LVDS | 400MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.608 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 166MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.904 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.240 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC FANOUT BUFF LVPECL 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.664 |
|
- | - | - | Clock | LVPECL | - | - | - | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione5.664 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.592 |
|
1 | 2:8 | Yes/Yes | ECL | TTL | 160MHz | ±4.2 V ~ 5.5 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione3.584 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.048 |
|
1 | 1:2 | Yes/Yes | ECL, LVECL, LVPECL. PECL | ECL, LVECL, LVPECL. PECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 700MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione2.688 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Texas Instruments |
IC CLK BUFFER 1:8 1.6GHZ 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.792 |
|
1 | 1:8 | Yes/Yes | Clock | LVDS | 1.6GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:12 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.712 |
|
1 | 1:12 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 1.6 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:10 16MHZ 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.800 |
|
1 | 2:10 | Yes/Yes | LVDS, LVPECL | LVDS | 16MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 16QFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.432 |
|
1 | 1:9 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUF 1:8/1:6 3.1GHZ 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.176 |
|
2 | 1:8, 1:6 | Yes/Yes | LVCMOS, LVDS, LVPECL, RF Sinewave | LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione7.080 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 3:10 3.1GHZ 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione12.132 |
|
1 | 3:11 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.944 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.848 |
|
1 | 1:4 | No/No | Clock | Clock | 200MHz | 1.425 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione22.836 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:2 8DFN
|
pacchetto: 8-UFDFN |
Azione68.928 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 8-UFDFN | 8-DFN (2x2) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.368 |
|
1 | 2:8 | Yes/Yes | - | CML, HCSL, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-QSOP
|
pacchetto: - |
Azione2.560 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | - | - | - |
||
onsemi |
IC CLK BUFFER TRANSLA 1:2 8-SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:2 | - | - | - | - | - | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Renesas Electronics Corporation |
IC CLK MULTIPLX 2:1/1:2 16VFQFPN
|
pacchetto: - |
Request a Quote |
|
2 | 2:1, 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Quality Semiconductor |
LOW SKEW CLOCK DRIVER/BUFFER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLOCK MANANGEMENT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |