Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Cypress Semiconductor Corp |
ROBOCLOCK MGMT
|
pacchetto: 32-LCC (J-Lead) |
Azione7.488 |
|
- | - | - | - | - | - | - | - | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Silicon Labs |
IC CLK BUFFER 1:4 710MHZ 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.232 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVDS, LVPECL | LVPECL | 710MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:4 750MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.208 |
|
1 | 1:4 | Yes/Yes | Clock | Clock | 750MHz | 4.2 V ~ 5.7 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.352 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione6.864 |
|
1 | 8:8 | Yes/Yes | 3-State, TTL | TTL | 80MHz | 4.5 V ~ 5.5 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
NXP |
IC CLK BUFFER 1:10 125MHZ 24SO
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione6.544 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 125MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC CLK BUFFER 2:10 150MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.416 |
|
1 | 2:10 | No/No | LVCMOS, LVTTL | CMOS | 150MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.920 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione16.320 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 12GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.456 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:24 100MHZ 48TQFP
|
pacchetto: 48-LQFP |
Azione2.272 |
|
1 | 2:24 | Yes/No | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVCMOS, LVTTL | 100MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
Maxim Integrated |
IC CLK BUFFER 2:10 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione22.128 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP/32-TQFP (7x7) |
||
Microsemi Corporation |
IC CLK BUFFER 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.904 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microsemi Corporation |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.432 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione10.188 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
ON Semiconductor |
IC FANOUT BUFFER 1:4 HCSL
|
pacchetto: - |
Azione7.088 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 3.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.608 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 5.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.304 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione390.804 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:10 20VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione7.884 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione8.208 |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Diodes Incorporated |
IC CLOCK
|
pacchetto: - |
Azione5.872 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.976 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Nexperia USA Inc. |
74AVC9112DC/SOT765/VSSOP8
|
pacchetto: 8-VFSOP (0.091", 2.30mm Width) |
Azione3.504 |
|
1 | 1:4 | No/No | Clock | Clock | - | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-VFSOP (0.091", 2.30mm Width) | 8-VSSOP |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione3.232 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
pacchetto: - |
Azione8.520 |
|
1 | 1:4 | No/No | Clock | Clock | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
SiTime |
-40C TO 85C, 32PIN, 5050, 1.8V-3
|
pacchetto: - |
Request a Quote |
|
3 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, SSTL, XTAL | LVCMOS | 250 MHz | 1.8V ~ 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:4 250MHZ 8TSSOP
|
pacchetto: - |
Azione20.112 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 250 MHz | 1.71V, 2.375V, 3.135V ~ 1.89V, 2.625V, 3.465V | -40°C ~ 125°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |