Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Diodes Incorporated |
IC CLK BUFF 1:7 133.3MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione6.420 |
|
1 | 1:7 | No/No | TTL | TTL | 133.3MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 250MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.408 |
|
1 | 1:10 | Yes/No | LVCMOS, LVPECL | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:9 350MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.912 |
|
1 | 2:9 | No/No | LVCMOS | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLXR 2:1 3GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.560 |
|
2 | 2:1 | Yes/Yes | ECL, LVDS, PECL | ECL, LVDS, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.848 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:5 3GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.976 |
|
2 | 1:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione4.688 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 3.15 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 6:6 80MHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione13.644 |
|
1 | 6:6 | No/No | CMOS | CMOS | 80MHz | 4.75 V ~ 5.25 V | 25°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 8:8 80MHZ 32PLCC
|
pacchetto: 32-LCC (J-Lead) |
Azione17.820 |
|
1 | 8:8 | Yes/Yes | 3-State | LVTTL | 80MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione20.160 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Maxim Integrated |
IC CLK BUFFER 2:5 1.5GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione24.324 |
|
1 | 2:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 1.5GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
IC CLK BUFFER 2:12 350MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.320 |
|
1 | 2:12 | Yes/No | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione7.296 |
|
1 | 2:22 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVHSTL, LVPECL, SSTL | HSTL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
Analog Devices Inc. |
IC CLK BUFF 1:4 1.65GHZ 24LFCSP
|
pacchetto: 24-WFQFN Exposed Pad, CSP |
Azione5.712 |
|
1 | 1:4 | Yes/Yes | CMOS | CMOS, HSTL, LVDS | 1.2GHz | 2.375 V ~ 2.625 V | -55°C ~ 105°C | Surface Mount | 24-WFQFN Exposed Pad, CSP | 24-LFCSP-WQ (4x4) |
||
Maxim Integrated |
IC CLK BUFFER 1:5
|
pacchetto: 32-LQFP |
Azione7.792 |
|
2 | 1:5 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.25 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFF 2:1:4 LVPECL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.120 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL | LVPECL | 650MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC TRANSLATOR BUFF/LEVEL 44QFN
|
pacchetto: 44-VFQFN Exposed Pad |
Azione6.048 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | CML, HCSL, LVCMOS, LVDS, LVPECL | 1.25GHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad | 44-QFN (7x7) |
||
Silicon Labs |
IC CLK BUFFER 2:6 725MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione16.224 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVCMOS, LVDS, LVPECL | 725MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione7.808 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 133MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione8.712 |
|
1 | 1:5 | No/No | Clock | Clock | 133MHz | 2.3 V ~ 2.7 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
CLOCK VCXO
|
pacchetto: - |
Azione6.368 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.776 |
|
1 | 2:1 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 500MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Nexperia USA Inc. |
74AVC9112GT/SOT833/XSON8
|
pacchetto: 8-XFDFN |
Azione5.712 |
|
1 | 1:4 | No/No | Clock | Clock | - | 0.8 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 8-XFDFN | 8-XSON, SOT833-1 (1.95x1) |
||
Microchip Technology |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.064 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Renesas Electronics Corporation |
551S MIXED SIGNAL
|
pacchetto: - |
Azione7.500 |
|
1 | 1:4 | No/No | Clock | Clock | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Renesas Electronics Corporation |
IC CLOCK MANANGEMENT
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Cypress Semiconductor Corp |
IC CLOCK BUFFER 16SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:8 | No/No | LVCMOS, LVTTL | LVCMOS | - | 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Renesas Electronics Corporation |
IC CLK BUFFER 2:8 2GHZ 28VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 2:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2 GHz | 2.375V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 28-VQFN Exposed Pad | 28-VFQFPN (6x6) |