Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLOCK BUFFER 1:1 125MHZ DIE
|
pacchetto: Die |
Azione5.376 |
|
1 | 1:1 | No/Yes | Crystal | LVPECL | 125MHz | 2.97 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | Die | Die |
||
CTS-Frequency Controls |
IC CLOCK BUFFER 1:2
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.512 |
|
1 | 1:2 | Yes/Yes | LVPECL | LVPECL | - | 3 V ~ 5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20LCC
|
pacchetto: 20-LCC (J-Lead) |
Azione5.712 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.5 V ~ 5.5 V | -55°C ~ 125°C | Surface Mount | 20-LCC (J-Lead) | 20-LCC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 700MHZ 48LQFP
|
pacchetto: 48-LQFP |
Azione4.752 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVDS | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 200MHZ 28TSSOP
|
pacchetto: 28-TSSOP (0.173", 4.40mm Width) |
Azione5.424 |
|
1 | 1:5 | No/No | LVTTL | LVCMOS, LVTTL | 200MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 28-TSSOP (0.173", 4.40mm Width) | 28-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 2:1/1:2 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.680 |
|
2 | 2:1, 1:2 | No/No | CML, LVDS, LVPECL | LVDS | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Texas Instruments |
IC CLK BUFFER 1:3 800MHZ 24VQFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione29.976 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVCMOS, LVDS, LVTTL, SSTL-2, VML | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-VQFN Exposed Pad (4x4) |
||
NXP |
IC CLK BUFFER 2:10 800MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione2.928 |
|
1 | 2:10 | Yes/Yes | LVDS | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:10 3GHZ 32TQFP
|
pacchetto: 32-TQFP |
Azione7.280 |
|
1 | 2:10 | Yes/Yes | HSTL, LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:7 156MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione5.968 |
|
1 | 1:7 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
Texas Instruments |
IC CLK BUFFER 1:8 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione295.140 |
|
1 | 1:8 | No/No | CMOS | CMOS | - | 2 V ~ 6 V | 0°C ~ 70°C | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:16 2GHZ 48VQFN
|
pacchetto: 48-VFQFN Exposed Pad |
Azione5.424 |
|
2 | 1:16 | Yes/Yes | LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-VQFN (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:21 400MHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione18.768 |
|
1 | 1:21 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 400MHz | 3 V ~ 3.6 V | -40°C ~ 70°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
Microchip Technology |
IC CLK BUFFER 2:6 3GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione5.568 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microsemi Corporation |
IC CLK BUFF MUX 2:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.216 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.480 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | ECL, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:8 200MHZ 28QSOP
|
pacchetto: 28-SSOP (0.154", 3.90mm Width) |
Azione8.604 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM3225
|
pacchetto: - |
Azione4.848 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:5 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.132 |
|
1 | 2:5 | Yes/Yes | LVCMOS, LVTTL | LVPECL | 1.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 16QSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione5.904 |
|
1 | 1:5 | No/No | CMOS, TTL | CMOS, TTL | 133MHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.696 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC FANOUT BUFF 1:4 LVPECL 16TQFN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione2.464 |
|
1 | 1:4 | Yes/Yes | LVCMOS | LVPECL | 6GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN-EP (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:12 350MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione7.932 |
|
1 | 2:12 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Diodes Incorporated |
IC CLK BUFFER 1:2 800MHZ 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione26.400 |
|
1 | 1:2 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.464 |
|
1 | 1:12 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
Diodes Incorporated |
CLOCK BUFFER W-QFN3030-16 T&R 3.
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.192 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL | LVPECL | 3GHz | 2.375V ~ 2.625V, 3V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
Analog Devices Inc. |
IC DIVIDER QFN
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
National Semiconductor |
IC CLOCK DRIVER 16SOP
|
pacchetto: - |
Request a Quote |
|
- | 3:4 | Yes/Yes | Clock | Clock | - | 4.2V ~ 5.7V | -55°C ~ 125°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |