Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.376 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVPECL | ECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 3:15 200MHZ 52TQFP
|
pacchetto: 52-LQFP |
Azione17.940 |
|
1 | 3:15 | Yes/No | LVCMOS, LVPECL | LVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 133MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.696 |
|
1 | 1:10 | No/No | Clock | TTL | 133MHz | 1.425 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.440 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione2.416 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:9 133.33MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione6.592 |
|
1 | 1:9 | No/No | LVTTL | LVTTL | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Microchip Technology |
IC CLK BUFFER 2:9 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.856 |
|
1 | 2:9 | Yes/Yes | PECL, TTL | PECL | - | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 2:12 350MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione5.440 |
|
1 | 2:12 | Yes/Yes | LVCMOS, LVPECL | LVCMOS | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:9 135MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione7.536 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 135MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione3.072 |
|
1 | 2:8 | Yes/Yes | ECL | TTL | 160MHz | ±4.2 V ~ 5.5 V, 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 8GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.280 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | CML | 8GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 2:4 700MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.000 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 700MHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:8 80MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.656 |
|
1 | 1:8 | No/No | TTL | TTL | 80MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 266MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione4.608 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVCMOS, LVPECL | 266MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Texas Instruments |
IC CLK BUFFER 1:2 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.712 |
|
1 | 1:2 | Yes/Yes | LVCMOS, LVPECL, LVTTL | LVCMOS, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Texas Instruments |
IC CLK BUF 1:8/1:6 3.1GHZ 48WQFN
|
pacchetto: 48-WFQFN Exposed Pad |
Azione6.752 |
|
2 | 1:8, 1:6 | Yes/Yes | LVCMOS, LVDS, LVPECL, RF Sinewave | LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 48-WFQFN Exposed Pad | 48-WQFN (7x7) |
||
Microsemi Corporation |
LOW SKEW, LOW ADDITIVE JITTER 3
|
pacchetto: - |
Azione2.112 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 2:4 650MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.848 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 650MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
IC CLOCK BUFFER MUX 2:4 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.168 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL, Crystal | LVPECL | 500MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER SSOP-20
|
pacchetto: - |
Azione7.312 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:12 350MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione5.328 |
|
1 | 2:12 | Yes/No | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | LVCMOS, LVTTL | 350MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:5 133.33MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.352 |
|
1 | 1:5 | No/No | LVCMOS | LVCMOS | 133.33MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUF 1:9 133.3MHZ 16SOIC
|
pacchetto: 16-SOIC (0.154", 3.90mm Width) |
Azione19.104 |
|
1 | 1:9 | No/No | Clock | Clock | 133.3MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOIC |
||
Maxim Integrated |
IC INTEGRATED CIRCUIT
|
pacchetto: 32-LQFP |
Azione7.264 |
|
- | - | - | - | - | - | - | - | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione6.512 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:8 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.632 |
|
1 | 1:8 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.592 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:8 1GHZ 32VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1 GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |