Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.632 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:18 150MHZ 48SSOP
|
pacchetto: 48-BSSOP (0.295", 7.50mm Width) |
Azione3.408 |
|
1 | 1:18 | No/No | Clock | Clock | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione54.240 |
|
1 | 1:4 | No/No | Clock | Clock | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 4:1 3.2GHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.568 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVPECL | 3.2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:9 65MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione14.460 |
|
1 | 1:9 | Yes/Yes | PECL | TTL | 65MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
NXP |
IC CLK BUFFER 2:10 250MHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.840 |
|
1 | 2:10 | No/No | LVCMOS | LVCMOS | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 12GHZ 16FCBGA
|
pacchetto: 16-LBGA, FCBGA |
Azione6.752 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 70°C | Surface Mount | 16-LBGA, FCBGA | 16-FCBGA (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 12GHZ 16FCBGA
|
pacchetto: 16-LBGA, FCBGA |
Azione3.312 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, PECL, RSECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 70°C | Surface Mount | 16-LBGA, FCBGA | 16-FCBGA (4x4) |
||
ON Semiconductor |
IC CLK BUFFER 1:4 7GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.752 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 7GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 2GHZ 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione4.368 |
|
1 | 2:4 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.024 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8DFN
|
pacchetto: 8-VFDFN Exposed Pad |
Azione14.724 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-VFDFN Exposed Pad | 8-DFN (2x2) |
||
Diodes Incorporated |
CLOCK BUFFER QSOP-20
|
pacchetto: - |
Azione4.896 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:2 200MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione22.296 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:2 150MHZ 6DFN
|
pacchetto: 6-UFDFN Exposed Pad |
Azione3.792 |
|
1 | 1:2 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione13.212 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 1:5 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione7.680 |
|
2 | 1:5 | No/No | CMOS, LVTTL | CMOS, LVTTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione7.264 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione27.804 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:4 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione28.446 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione3.456 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione5.616 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3x3) |
||
Silicon Labs |
IC CLOCK BUFFER QFN
|
pacchetto: - |
Azione5.152 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Diodes Incorporated |
IC CLK BUFFER 1:20 400MHZ 80AQFN
|
pacchetto: - |
Azione9.000 |
|
1 | 1:20 | Yes/Yes | CMOS, HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 80-VFQFN Dual Rows, Exposed Pad | 80-aQFN (6x6) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 2GHZ 28VFQFPN
|
pacchetto: - |
Request a Quote |
|
2 | 1:4 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
Renesas Electronics Corporation |
IC CLK BUF 1:6 1.2GHZ 20VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | Yes/Yes | CML, LVDS | LVDS | 1.2 GHz | 1.71V ~ 1.89V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
National Semiconductor |
IC CLOCK DRIVER 28PLCC
|
pacchetto: - |
Request a Quote |
|
- | 1:4 | No/No | TTL | TTL | - | 4.5V ~ 5.5V | 0°C ~ 70°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.43x11.43) |
||
onsemi |
IC CLOCK BUFFER 1:2 3GHZ 8-TSSOP
|
pacchetto: - |
Request a Quote |
|
- | 1:2 | - | - | - | - | - | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |