Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 350MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.168 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVDS | 350MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:5 700MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.320 |
|
1 | 2:5 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL | HSTL | 700MHz | 3.135 V ~ 3.465 V | 0°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 27MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.592 |
|
1 | 1:4 | No/No | Clock, Crystal | Clock | 27MHz | 2.375 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
IC CLK BUFFER 2:5 250MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione4.944 |
|
1 | 2:5 | No/Yes | LVDS, LVTTL | Clock | 250MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Microchip Technology |
IC CLK BUFFER 1:8 5.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione3.888 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDR 2:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.896 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK MULTIPLEXR 4:2 5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.000 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFF 2:1:4 LVPECL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione2.576 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL | LVDS | 650MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione4.896 |
|
2 | 2:1 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 100MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.504 |
|
1 | 1:10 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Silicon Labs |
IC CLK BUFFER 1:3 52MHZ 10TDFN
|
pacchetto: 10-WFDFN |
Azione3.744 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 52MHz | 1.7 V ~ 3.65 V | -40°C ~ 85°C | Surface Mount | 10-WFDFN | 10-TDFN (2.5x1.4) |
||
Texas Instruments |
IC CLK BUFFER 1:2 2.9GHZ 8VSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.528 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 2.9GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-VSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 6:1 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.360 |
|
1 | 6:1 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:6 250MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione11.976 |
|
1 | 2:6 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK MULTIPLEXR 4:2 8GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.072 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 2:8 2GHZ 28VQFN
|
pacchetto: 28-VFQFN Exposed Pad |
Azione4.832 |
|
1 | 2:8 | Yes/Yes | LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-VFQFN Exposed Pad | 28-VQFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:2 800MHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione15.012 |
|
2 | 1:2 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 800MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.672 |
|
1 | 2:2 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:2 2GHZ 16VFQFPN
|
pacchetto: - |
Azione7.467 |
|
2 | 1:2 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2 GHz | 1.71V ~ 1.89V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
Cypress Semiconductor Corp |
IC ZD BUFFER 8SOIC
|
pacchetto: - |
Request a Quote |
|
- | 1:5 | No/No | - | - | - | 2.97V ~ 3.63V | 0°C ~ 70°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 250MHZ 8VDFN
|
pacchetto: - |
Azione10.659 |
|
1 | 1:2 | Yes/Yes | HCSL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 8-VFDFN | 8-VDFN (1.6x1.4) |
||
Renesas Electronics Corporation |
MULTIMKT-TIMING
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Quality Semiconductor |
PROG SKEW PLL CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 2:4 100MHZ 32QFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:4 | Yes/Yes | HCSL | HCSL | 100 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Renesas Electronics Corporation |
5PB1104 MIXED SIGNAL
|
pacchetto: - |
Azione12.000 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200 MHz | 1.71V ~ 1.89V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:6 200MHZ 16TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 200 MHz | 1.71V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
CLOCK BUFFER V-QFN9090-64 T&R 3K
|
pacchetto: - |
Request a Quote |
|
1 | 1:12 | Yes/Yes | HCSL | HCSL | 400 MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 64-VFQFN Exposed Pad | 64-TQFN (9x9) |
||
Renesas Electronics Corporation |
IC CLK BUFFER 1:4 2GHZ 16VFQFPN
|
pacchetto: - |
Request a Quote |
|
1 | 1:4 | Yes/Yes | LVDS, LVPECL, SSTL | LVDS | 2 GHz | 2.375V ~ 2.625V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |