Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUF 1:10 166MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.952 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 166MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTIPLX 4:1/2:1 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.808 |
|
1 | 4:1, 2:1 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 750MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:2/1:6 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione5.952 |
|
2 | 1:2, 1:6 | No/No | GTLP, TTL | GTLP, TTL | - | 4.75 V ~ 5.25 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC CLK BUFFER 1:10 150MHZ 28SSOP
|
pacchetto: 28-SSOP (0.209", 5.30mm Width) |
Azione3.632 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 150MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 28-SSOP (0.209", 5.30mm Width) | 28-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.048 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Fairchild/ON Semiconductor |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.908 |
|
1 | 1:2 | Yes/Yes | ECL | ECL | - | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUF 1:6/1:3 3GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.576 |
|
1 or 2 | 1:6, 1:3 | Yes/Yes | LVCMOS, LVPECL | LVPECL | 3GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Texas Instruments |
IC CLK BUFFER 1:10 100MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione2.608 |
|
1 | 1:10 | No/No | LVTTL | LVTTL, TRI-State | 100MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:20 1GHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione5.408 |
|
1 | 2:20 | Yes/Yes | ECL, HSTL, LVPECL | ECL, PECL | 1GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:10 200MHZ 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione4.416 |
|
1 | 1:10 | No/No | LVCMOS, LVTTL | AVCMOS | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 2GHZ 32MLF
|
pacchetto: 32-VFQFN Exposed Pad, 32-MLF? |
Azione2.480 |
|
1 | 2:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:6 266MHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.040 |
|
1 | 2:6 | No/Yes | LVCMOS, LVTTL, Crystal | LVCMOS, LVPECL | 266MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Silicon Labs |
IC CLK BUFFER 1:8 HSTL 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.904 |
|
1 | 1:8 | Yes/No | CML, HCSL, LVDS, LVPECL | HSTL | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Silicon Labs |
IC CLK BUFFER 1:4 LVDS 24QFN
|
pacchetto: 24-VFQFN Exposed Pad |
Azione5.552 |
|
1 | 1:4 | No/Yes | CMOS, HSTL, LVTTL, SSTL | LVDS | 350MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
LOW SKEW, LVTTL FANOUT BUFFER
|
pacchetto: - |
Azione6.208 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Silicon Labs |
2:6 LVPECL BUFFER (1.25GHZ), 2:1
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.120 |
|
1 | 2:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 1.25GHz | 2.38 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione2.992 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 133MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 133MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione53.772 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 133MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:10 156MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione15.876 |
|
1 | 1:10 | No/No | CMOS, TTL | CMOS, TTL | 156MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.732 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione60.000 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVPECL | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:22 1GHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione48.528 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFF LVCMOS/LVTTL 32VFQFP
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.504 |
|
1 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC TIMING CLOCK
|
pacchetto: - |
Azione3.696 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:6 750MHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.032 |
|
1 | 1:6 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
onsemi |
IC CLK BUFF DRIVER XLATOR 8TSSOP
|
pacchetto: - |
Request a Quote |
|
- | 1:1 | - | - | - | - | - | - | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
Rochester Electronics, LLC |
DUAL MARKED (7800802GA)
|
pacchetto: - |
Request a Quote |
|
2 | 1:1 | No/No | TTL | MOS | 10 MHz | 10V ~ 20V | 0°C ~ 70°C (TA) | Through Hole | TO-99-8 Metal Can | TO-99-8 |
||
IDT, Integrated Device Technology Inc |
3.3V LOW SKEW PLL CLOCK DRIVER
|
pacchetto: - |
Request a Quote |
|
- | - | - | - | - | - | - | - | - | - | - |