Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
pacchetto: - |
Azione7.376 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
CTS-Frequency Controls |
IC CLOCK BUFFER 1:1 800MHZ
|
pacchetto: 6-TSSOP, SC-88, SOT-363 |
Azione7.616 |
|
1 | 1:1 | No/Yes | LVCMOS, Sine Wave | LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 6-TSSOP, SC-88, SOT-363 | SC-70-6 |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione12.696 |
|
1 | 1:2 | Yes/Yes | ECL | LVPECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:5 100MHZ 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione4.208 |
|
2 | 1:5 | No/No | TTL | TTL | 100MHz | 4.75 V ~ 5.25 V | 0°C ~ 70°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:10 166MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.728 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 166MHz | 2.3 V ~ 2.7 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK MULTPX 2:1 2.5GHZ 16VFQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.104 |
|
1 | 2:1 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.560 |
|
1 | 1:4 | No/No | LVTTL | Clock | 140MHz | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:16 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione4.656 |
|
1 | 1:16 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
pacchetto: 64-TQFP Exposed Pad |
Azione2.656 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:8 160MHZ 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione4.688 |
|
1 | 2:8 | Yes/Yes | PECL, TTL | TTL | 160MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2GHZ 16MLF
|
pacchetto: 16-VFQFN Exposed Pad, 16-MLF? |
Azione6.816 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione115.716 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:18 200MHZ 32TQFP
|
pacchetto: 32-LQFP |
Azione3.744 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-TQFP (7x7) |
||
Linear Technology |
IC CLK BUFFER DVR 1:2 12DFN
|
pacchetto: 12-WFDFN Exposed Pad |
Azione3.248 |
|
1 | 1:2 | Yes/Yes | CML, CMOS, LVDS, LVPECL | LVDS | 300MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 12-WFDFN Exposed Pad | 12-DFN (3x3) |
||
Diodes Incorporated |
CLOCK SAW OSCILLATOR SEAM7050
|
pacchetto: - |
Azione7.264 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Silicon Labs |
IC BUFFER 1:8 CMOS 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.000 |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Diodes Incorporated |
IC CLK BUFFER 1:5 50MHZ 20QSOP
|
pacchetto: 20-SSOP (0.154", 3.90mm Width) |
Azione5.856 |
|
2 | 1:5 | No/No | CMOS, TTL | CMOS | 50MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.154", 3.90mm Width) | 20-QSOP |
||
Texas Instruments |
IC CLK BUFFER 1:8 250MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.080 |
|
1 | 1:8 | No/No | LVCMOS | LVCMOS | 250MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 1:4 140MHZ 8TSSOP
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione17.436 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Texas Instruments |
IC CLK BUFFER 3:5 3.1GHZ 32WQFN
|
pacchetto: 32-WFQFN Exposed Pad |
Azione2.000 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, HSTL, LVDS, LVPECL, SSTL, Crystal | HCSL, LVCMOS, LVDS, LVPECL | 3.1GHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-WFQFN Exposed Pad | 32-WQFN (5x5) |
||
Texas Instruments |
IC CLK BUF 1:10 200MHZ 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione28.872 |
|
1 | 1:10 | No/No | LVTTL | LVTTL | 200MHz | 2.3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.160 |
|
1 | 1:12 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione3.120 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
Cypress Semiconductor Corp |
IC CLK ZD BUF 2:13 125MHZ 52TQFP
|
pacchetto: - |
Request a Quote |
|
1 | 2:13 | Yes/No | Crystal | Clock | 125 MHz | 2.97V ~ 3.63V, 2.9V ~ 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 52-LQFP | 52-TQFP (10x10) |
||
Microchip Technology |
IC CLK BUFFER 2:12 250MHZ 56VQFN
|
pacchetto: - |
Request a Quote |
|
1 | 2:12 | Yes/Yes | CML, HCSL, LVDS, PECL | HCSL | 250 MHz | 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-VQFN (8x8) |
||
Diodes Incorporated |
IC CLK BUFFER 1:4 250MHZ 8SOIC
|
pacchetto: - |
Azione9.555 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 250 MHz | 1.6V ~ 2V, 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Cypress Semiconductor Corp |
IC CLK BUFFER 1:7 320MHZ 24TSSOP
|
pacchetto: - |
Request a Quote |
|
1 | 1:7 | Yes/Yes | LVPECL | LVCMOS, LVPECL, LVTTL | 320 MHz | 2.375V ~ 2.625V | 0°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
Skyworks Solutions Inc. |
IC CLK BUFFER 1:2 170MHZ 32QFN
|
pacchetto: - |
Request a Quote |
|
1 | 1:2 | Yes/Yes | Clock | HCSL, LVCMOS, LVDS, LVPECL | 170 MHz | 1.71V ~ 3.46V | -40°C ~ 105°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |