Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.776 |
|
1 | 2:1 | Yes/Yes | HCSL, LVDS, LVPECL | HCSL | 500MHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.416 |
|
1 | 2:8 | Yes/Yes | HCSL, LVCMOS, LVDS, LVHSTL, LVPECL | LVCMOS, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 40-VFQFN Exposed Pad |
Azione3.792 |
|
2 | 2:12 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 2.7 V | -40°C ~ 85°C (TA) | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 36-WFQFN Exposed Pad |
Azione4.720 |
|
1 | 3:6 | Yes/Yes | HCSL, HSTL, LVDS, LVPECL, Crystal | HCSL, LVDS, LVPECL | 2GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 36-WFQFN Exposed Pad | 36-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.840 |
|
1 | 4:1 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2.5GHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 48-VFQFN Exposed Pad |
Azione2.464 |
|
1 | 1:12 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL | HCSL | 250MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 48-VFQFN Exposed Pad | 48-VFQFPN (7x7) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-TQFP Exposed Pad |
Azione2.592 |
|
1 | 1:10 | Yes/Yes | HSTL, LVPECL | LVPECL | 2.7GHz | 2.5V, 3.3V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-TQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.480 |
|
2 | 1:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.7 V ~ 1.9 V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione5.872 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32TQFP
|
pacchetto: 32-LQFP |
Azione3.600 |
|
1 | 1:18 | No/No | LVCMOS, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.640 |
|
2 | 2:4 | Yes/Yes | LVCMOS, LVDS, LVPECL | LVDS | 2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 64-TQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione5.440 |
|
1 | 1:20 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 650MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 16VFQFPN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.120 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVCMOS, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.888 |
|
2 | 3:3 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.368 |
|
1 | 2:8 | Yes/Yes | - | CML, HCSL, LVDS, LVPECL | 700MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 40-VFQFN Exposed Pad |
Azione2.160 |
|
1 | 1:12 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-VFQFPN (6x6) |
||
IDT, Integrated Device Technology Inc |
IC CLK DIVIDER/BUFFER 64-TQFP
|
pacchetto: 64-LQFP Exposed Pad |
Azione2.224 |
|
1 | 1:20 | Yes/Yes | CML, LVDS, LVPECL, SSTL | LVDS, LVPECL | 650MHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 64-LQFP Exposed Pad | 64-TQFP-EP (10x10) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 28-WFQFN Exposed Pad |
Azione7.664 |
|
2 | 1:4 | No/No | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 28-LCC (J-Lead) |
Azione6.224 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL, SSTL | ECL, LVPECL | 2GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 16-VFQFPN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione7.040 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-WFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.760 |
|
2 | 2:4 | Yes/Yes | LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.240 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.784 |
|
1 | 1:4 | Yes/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 1.65 V ~ 1.95 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione5.168 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione2.592 |
|
1 | 1:8 | Yes/Yes | HCSL, LVPECL | HCSL | 350MHz | 3.6V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 28-VFQFPN
|
pacchetto: 28-WFQFN Exposed Pad |
Azione4.000 |
|
1 | 2:8 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 28-WFQFN Exposed Pad | 28-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER MUX 2:4 24-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.432 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING 32VFQFPN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.520 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |