Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
IDT, Integrated Device Technology Inc |
IC CLK BUFFER 2:4 1.2GHZ 16VQFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione7.280 |
|
1 | 2:4 | Yes/Yes | CML, LVDS | LVDS | 1.2GHz | 1.71 V ~ 1.89 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 16-VFQFN Exposed Pad |
Azione3.264 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVCMOS, LVPECL | 1GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
IC NETWORK TIMING
|
pacchetto: 20-VFQFN Exposed Pad |
Azione3.440 |
|
1 | 1:4 | Yes/Yes | LVCMOS, LVTTL | LVPECL | 1GHz | 1.65 V ~ 1.95 V | -40°C ~ 85°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione2.592 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione3.456 |
|
1 | 1:6 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
IC CLK BUFF LVCMOS/LVTTL 32VFQFP
|
pacchetto: 32-VFQFN Exposed Pad |
Azione3.504 |
|
1 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione6.944 |
|
1 | 2:8 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 32-VFQFN Exposed Pad |
Azione6.064 |
|
1 | 3:10 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.35 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 16-VFQFPN
|
pacchetto: 16-WFQFN Exposed Pad |
Azione6.032 |
|
- | - | - | - | - | - | - | - | Surface Mount | 16-WFQFN Exposed Pad | 16-VFQFPN (3x3) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione3.120 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.928 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-UFDFN |
Azione5.360 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.736 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.208 |
|
1 | 1:4 | No/No | Clock | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.976 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-UFDFN |
Azione4.864 |
|
1 | 1:5 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-UFDFN |
Azione4.000 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-UFDFN | 8-VFQFN (2x2) |
||
IDT, Integrated Device Technology Inc |
NETWORK TIMING
|
pacchetto: 24-VFQFN Exposed Pad |
Azione3.296 |
|
1 | 1:5 | Yes/No | HCSL, LVCMOS, LVDS, LVPECL, LVTTL, Crystal | LVCMOS, LVTTL | 200MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 24-VFQFN Exposed Pad | 24-VFQFPN (4x4) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione6.640 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 16-UFQFN |
Azione6.624 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 16-UFQFN | 16-QFN (2.5x2.5) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: - |
Azione4.352 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: - |
Azione5.664 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 140MHz | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | - | - | - |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione6.752 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 10-WFDFN Exposed Pad |
Azione4.768 |
|
1 | 1:3 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C (TA) | Surface Mount | 10-WFDFN Exposed Pad | 10-DFN (2x2) |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.808 |
|
1 | 1:10 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
MULTIMKT-TIMING
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.472 |
|
1 | 1:2 | No/No | LVCMOS | LVCMOS | 200MHz | 1.71 V ~ 3.465 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione7.888 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
IDT, Integrated Device Technology Inc |
IC CLOCK BUFFER 20-VFQFPN
|
pacchetto: 20-VFQFN Exposed Pad |
Azione2.464 |
|
1 | 1:10 | No/No | LVTTL | CMOS, TTL | 200MHz | 1.71 V ~ 3.45 V | -40°C ~ 105°C | Surface Mount | 20-VFQFN Exposed Pad | 20-VFQFPN (3x3) |