Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
FET Feature | Drain to Source Voltage (Vdss) | Current - Continuous Drain (Id) @ 25°C | Rds On (Max) @ Id, Vgs | Vgs(th) (Max) @ Id | Gate Charge (Qg) (Max) @ Vgs | Input Capacitance (Ciss) (Max) @ Vds | Power - Max | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Infineon Technologies |
MOSFET 2N-CH 55V 5.1A 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.872 |
|
Logic Level Gate | 55V | 5.1A | 50 mOhm @ 5.1A, 10V | 3V @ 250µA | 44nC @ 10V | 780pF @ 25V | 2.4W | -55°C ~ 175°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
ON Semiconductor |
MOSFET 2N-CH 40V 6.5A ECH8
|
pacchetto: 8-SMD, Flat Lead |
Azione4.096 |
|
Logic Level Gate | 40V | 6.5A | 30 mOhm @ 3.5A, 4.5V | - | 12nC @ 4.5V | 1130pF @ 20V | 1.5W | 150°C (TJ) | Surface Mount | 8-SMD, Flat Lead | 8-ECH |
||
Fairchild/ON Semiconductor |
MOSFET 2P-CH 20V 4.4A 8-TSSO
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione237.648 |
|
Logic Level Gate | 20V | 4.4A | 35 mOhm @ 4.4A, 4.5V | 1.5V @ 250µA | 21nC @ 5V | 1465pF @ 10V | 600mW | -55°C ~ 150°C (TJ) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microsemi Corporation |
MOSFET 4N-CH 600V 39A SP3
|
pacchetto: SP3 |
Azione5.520 |
|
Standard | 600V | 39A | 70 mOhm @ 39A, 10V | 3.9V @ 2.7mA | 259nC @ 10V | 7000pF @ 25V | 250W | -40°C ~ 150°C (TJ) | Chassis Mount | SP3 | SP3 |
||
Microsemi Corporation |
MOSFET 2N-CH 500V 51A SP3
|
pacchetto: SP3 |
Azione7.664 |
|
Standard | 500V | 51A | 78 mOhm @ 42A, 10V | 5V @ 2.5mA | 340nC @ 10V | 10800pF @ 25V | 390W | -40°C ~ 150°C (TJ) | Chassis Mount | SP3 | SP3 |
||
Diodes Incorporated |
MOSFET 2N-CH 12V 5.6A 6UDFN
|
pacchetto: 6-UDFN Exposed Pad |
Azione2.848 |
|
Standard | 12V | 5.6A | 29 mOhm @ 5A, 4.5V | 1V @ 250µA | 19.6nC @ 8V | 914pF @ 6V | 1.4W | -55°C ~ 150°C (TJ) | Surface Mount | 6-UDFN Exposed Pad | U-DFN2020-6 (Type B) |
||
ON Semiconductor |
MOSFET 2N-CH 20V 3.92A 8SO
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione534.024 |
|
Logic Level Gate | 20V | 3.92A | 35 mOhm @ 6A, 4.5V | 1.2V @ 250µA | 20nC @ 4.5V | 1100pF @ 16V | 730mW | -55°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Diodes Incorporated |
MOSFET N/P-CH 30V 8-MSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione1.954.092 |
|
Logic Level Gate | 30V | - | 135 mOhm @ 1.7A, 10V | 1V @ 250µA (Min) | 8nC @ 10V | 290pF @ 25V | 1.04W | -55°C ~ 150°C (TJ) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Diodes Incorporated |
MOSFET 2N-CH 30V 6.5A 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione64.968 |
|
Logic Level Gate | 30V | 6.5A | 20 mOhm @ 12.6A, 10V | 1V @ 250µA (Min) | 36.8nC @ 10V | 1890pF @ 15V | 1.81W | -55°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Diodes Incorporated |
MOSFET 2N-CH X1-WLB1818-4
|
pacchetto: 4-XFBGA, WLBGA |
Azione6.528 |
|
Logic Level Gate | - | - | - | - | 29nC @ 4.5V | - | 1.45W | -55°C ~ 150°C (TJ) | Surface Mount | 4-XFBGA, WLBGA | X1-WLB1818-4 |
||
Diodes Incorporated |
MOSFET 2P-CH 60V 2.9A 8-SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione512.964 |
|
Logic Level Gate | 60V | 2.9A | 85 mOhm @ 2.9A, 10V | 1V @ 250µA (Min) | 24.2nC @ 10V | 1021pF @ 30V | 1.81W | -55°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Fairchild/ON Semiconductor |
MOSFET 2N-CH 6-MLP
|
pacchetto: 6-WDFN Exposed Pad |
Azione158.748 |
|
Logic Level Gate | - | - | - | - | 28nC @ 5V | - | 800mW | -55°C ~ 150°C (TJ) | Surface Mount | 6-WDFN Exposed Pad | 6-MLP (2x3) |
||
Diodes Incorporated |
MOSFET 2N-CH 20V 5.2A 8UDFN
|
pacchetto: 8-PowerUDFN |
Azione25.908 |
|
Logic Level Gate | 20V | 5.2A | 18 mOhm @ 6A, 4.5V | 1.1V @ 250µA | 16nC @ 4.5V | 1472pF @ 10V | 770mW | -55°C ~ 150°C (TJ) | Surface Mount | 8-PowerUDFN | U-DFN3030-8 |
||
Toshiba Semiconductor and Storage |
MOSFET 2N-CH 30V 4A UDFN6
|
pacchetto: 6-WDFN Exposed Pad |
Azione180.000 |
|
Logic Level Gate, 1.8V Drive | 30V | 4A | 84 mOhm @ 2A, 4.5V | 1V @ 1mA | 1.8nC @ 4.5V | 129pF @ 15V | 1W | 150°C (TJ) | Surface Mount | 6-WDFN Exposed Pad | 6-UDFN (2x2) |
||
Microchip Technology |
SIC 2N-CH 1200V 947A
|
pacchetto: - |
Request a Quote |
|
- | 1200V (1.2kV) | 947A (Tc) | 2.6mOhm @ 480A, 20V | 2.8V @ 36mA | 2784nC @ 20V | 36200pF @ 1000V | 3.75kW (Tc) | -40°C ~ 175°C (TJ) | Chassis Mount | Module | - |
||
Microchip Technology |
SIC 2N-CH 1200V 73A SP3
|
pacchetto: - |
Request a Quote |
|
- | 1200V (1.2kV) | 73A (Tc) | 34mOhm @ 50A, 20V | 3V @ 12.5mA | 161nC @ 5V | 2788pF @ 1000V | 375W | -40°C ~ 150°C (TJ) | Chassis Mount | Module | SP3 |
||
Microchip Technology |
SIC 6N-CH 1700V 122A
|
pacchetto: - |
Azione15 |
|
- | 1700V (1.7kV) | 122A (Tc) | 22.5mOhm @ 60A, 20V | 3.2V @ 5mA | 356nC @ 20V | 6600pF @ 1000V | 588W (Tc) | -40°C ~ 175°C (TJ) | Chassis Mount | Module | - |
||
Rohm Semiconductor |
-100V 12.5A, DUAL PCH+PCH, HSOP8
|
pacchetto: - |
Request a Quote |
|
- | 100V | 4.5A (Ta), 12.5A (Tc) | 127mOhm @ 4.5A, 10V | 2.5V @ 1mA | 38nC @ 10V | 1370pF @ 50V | 3W (Ta), 21W (Tc) | 150°C (TJ) | Surface Mount | 8-PowerTDFN | 8-HSOP |
||
Microchip Technology |
SIC 2N-CH 1200V 805A
|
pacchetto: - |
Request a Quote |
|
- | 1200V (1.2kV) | 805A (Tc) | 3.1mOhm @ 400A, 20V | 2.8V @ 30mA | 2320nC @ 20V | 30200pF @ 1000V | 3.215kW (Tc) | -40°C ~ 175°C (TJ) | Chassis Mount | Module | - |
||
Taiwan Semiconductor Corporation |
MOSFET N/P-CH 20V 11.6A/9A 6TDFN
|
pacchetto: - |
Request a Quote |
|
Logic Level Gate, 1.8V Drive | 20V | 11.6A (Tc), 9A (Tc) | 30mOhm @ 6.4A, 4.5V, 55mOhm @ 5A, 4.5V | 1V @ 250µA | 9.1nC @ 4.5V, 9.8nC @ 4.5V | 677pF @ 10V, 744pF @ 10V | 6.25W | -55°C ~ 150°C (TJ) | Surface Mount | 6-VDFN Exposed Pad | 6-TDFN (2x2) |
||
Fairchild Semiconductor |
MOSFET 2N-CH 62V 3.3A 8SOIC
|
pacchetto: - |
Request a Quote |
|
Logic Level Gate | 62V | 3.3A (Ta) | 110mOhm @ 3.3A, 10V | 3V @ 250µA | 4.3nC @ 5V | 300pF @ 15V | 2.27W (Ta) | -55°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Taiwan Semiconductor Corporation |
MOSFET 2P-CH 30V 4.9A 8SOP
|
pacchetto: - |
Request a Quote |
|
- | 30V | 4.9A (Ta) | 60mOhm @ 4.9A, 10V | 3V @ 250µA | 28nC @ 10V | 745pF @ 15V | 2.5W (Ta) | -55°C ~ 150°C (TJ) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Diodes Incorporated |
MOSFET 2N-CH 100V 25A POWERDI50
|
pacchetto: - |
Request a Quote |
|
- | 100V | 25A (Tc) | 33mOhm @ 10A, 10V | 4V @ 250µA | 8nC @ 10V | 544pF @ 50V | 2.7W (Ta), 39W (Tc) | -55°C ~ 175°C (TJ) | Surface Mount | 8-PowerTDFN | PowerDI5060-8 (Type UXD) |
||
Nexperia USA Inc. |
MOSFET 2N-CH 40V 40A LFPAK56D
|
pacchetto: - |
Azione4.788 |
|
Logic Level Gate | 40V | 40A (Ta) | 6.1mOhm @ 10A, 10V | 2.1V @ 1mA | 22.2nC @ 5V | 3000pF @ 25V | 64W (Ta) | -55°C ~ 175°C (TJ) | Surface Mount | SOT-1205, 8-LFPAK56 | LFPAK56D |
||
Panjit International Inc. |
MOSFET N/P-CH 20V 1A SOT363
|
pacchetto: - |
Azione41.052 |
|
- | 20V | 1A (Ta), 700mA (Ta) | 150mOhm @ 1A, 4.5V , 325mOhm @ 700mA, 4.5V | 1V @ 250µA | 1.6nC @ 4.5V, 2.2nC @ 4.5V | 92pF @ 10V, 151pF @ 10V | 350mW (Ta) | -55°C ~ 150°C (TJ) | Surface Mount | 6-TSSOP, SC-88, SOT-363 | SOT-363 |
||
Nuvoton Technology Corporation |
DUAL NCH MOSFET 12V, 9.0A, 4.6MO
|
pacchetto: - |
Request a Quote |
|
- | 12V | 9A (Ta) | 5.5mOhm @ 4.5A, 4.5V | 1.4V @ 260µA | 15nC @ 4V | 1810pF @ 10V | 500mW (Ta) | -55°C ~ 150°C (TJ) | Surface Mount | 6-XFLGA, CSP | 6-CSP (1.24x1.89) |
||
Rohm Semiconductor |
MOSFET 2P-CH 60V 2.5A HUML2020L8
|
pacchetto: - |
Azione7.023 |
|
- | 60V | 2.5A (Ta) | 280mOhm @ 2.5A, 10V | 2.5V @ 1mA | 6.3nC @ 10V | 265pF @ 30V | 2W (Ta) | 150°C (TJ) | Surface Mount | 6-PowerUDFN | HUML2020L8 |
||
Vishay Siliconix |
MOSFET 2P-CH 30V 2.5A 6TSOP
|
pacchetto: - |
Azione27.000 |
|
- | 30V | 2.5A (Tc) | 155mOhm @ 400mA, 10V | 1.5V @ 250µA | 11.1nC @ 10V | - | 1.67W (Tc) | -55°C ~ 175°C (TJ) | Surface Mount | SOT-23-6 Thin, TSOT-23-6 | 6-TSOP |