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On June 27, South Korean media Business Korea reported on June 24 that Samsung Electronics' semiconductor packaging industry has made significant progress and will lead TSMC in the field of panel-level packaging (PLP).

The artificial intelligence (AI) revolution is changing the way we design and manufacture everything from data centers to servers and chips. Chip technology is also shifting from traditional analog circuit integration to using multiple chips or chiplets in a single package.

XP Power officially announced on June 19th the launch of a new compact 550W AC-DC power supply that can be used for natural convection cooling, conduction cooling, and forced air cooling. This new PSU can meet medical and industrial applications and is suitable for a wide range of applications - including sealed enclosure environments.

On June 20, IT Home quoted Nikkei Asia as saying that TSMC is studying a new advanced chip packaging method that uses rectangular substrates instead of traditional round wafers to place more chips on each wafer.

ASML delivered the world's first High NA EUV extreme ultraviolet lithography machine to Intel at the end of last year. At the same time, it is researching a more powerful Hyper NA EUV lithography machine, which is expected to advance the semiconductor process to about 0.2nm, or 2 angstroms. The aperture value of ASML's first-generation Low NA EUV lithography machine is only 0.33, and the corresponding product is named NXE series, including the existing 3400B/C, 3600D, 3800E, and the future 4000F, 4200G, and 4X00.

On June 18, according to the Korea Economic Daily, Samsung Electronics will launch SAINT-D technology within this year, which can integrate HBM memory with processor chips in 3D. SAINT-D is a 3DIC advanced packaging technology of Samsung Electronics, which aims to vertically integrate logic die and DRAM memory die. The specific implementation of this technology is reported to be establishing a silicon interposer between the processor and the HBM chip.

Recently, based on TC-SAW technology, Zuolan Microelectronics released high-performance, small-size Band26 and Band20 duplexers. The package size of the TC-SAW high-performance Band26/20 duplexer released this time is 1.6mm × 1.2mm, which is about 24% smaller than the 1814 package size, which can effectively reduce the board area. Its small size is more suitable for terminal customers who are becoming increasingly miniaturized in the 5G era, and provides more flexible solutions for application providers of various wireless communication systems.

ROHM, a world-renowned semiconductor manufacturer (headquartered in Kyoto, Japan), has developed a CMOS operational amplifier "TLR377GYZ" with an ultra-small package, which is ideal for amplifying sensor detection signals such as temperature, pressure, and flow in applications such as smartphones and small IoT devices.

On June 5, according to Nikkei News today, the draft of the basic policy for economic and fiscal operations and reforms that the Japanese government will finalize in late June has now been made public. In order to promote the mass production of next-generation semiconductors, the local government has included a policy to improve relevant laws. The draft mentioned that in order to achieve mass production of next-generation semiconductors, "Necessary and Legal" measures will be studied.

According to reports, since the resumption of growth in November of last year, ending the 15-month year-on-year decline, South Korea's monthly semiconductor exports have continued to grow year-on-year, including in May.