Wi-Fi-4 (802.11b/g/n) and Bluetooth 5.2 low energy devices were created specifically for next-generation IoT products such as battery-powered medical devices, rugged handheld devices, industrial IoT sensors and other connectivity solution. It is the new Sterling-LWB+ modules that Mouser is currently supplying from Laird Connectivity.
This module is mechanically and pin-compatible with Sterling-LWB modules, providing a simplified upgrade path for existing designs. And these modules are powered by Infineon's AIROC CYW43439 chipset solution, which provides reliable and secure performance in IIoT settings and supports the full industrial temperature range (-40°C to +85°C). Including a full-featured Wi-Fi-4 radio-enabled software driver and support, the secure, high-performance SDIO solution can be easily integrated with any Linux or Android-based system.
The module supports the latest WPA3 security standard, and the device offers an MHF connector for an on-board chip antenna or an external antenna that can be connected to a range of Laird Connect certified internal antennas. At the same time the device's integrated power amplifier and LNA provide reliable connectivity even in challenging RF environments.
Mouser also stocks the Sterling LWB+ development Kit for development and evaluation, which can be supplied with an onboard chip antenna or MHF connector. Module certification FCC, ISED, CE, UKCA, RCM, MIC and Bluetooth SIG registrations further speed up time to market.
