Data di Pubblicazione: 2017-02-11
Texas Instruments offers more available memory, Bluetooth 5 enabled hardware, automotive certification, and new ultra-compact wafer chip-scale package (WCSP) options. Two of its scalable SimpleLink Bluetooth low-power wireless MCU families New device. The new devices will continue to feature advanced integration features, including complete single-chip hardware and ARM Cortex-M3-based MCU unified software solutions, automatic power management, highly flexible full-featured Bluetooth-compatible radios, and low-power sensor controllers.
The new SimpleLink CC2640R2F wireless MCU enhances the capabilities of IoT applications, providing more available memory for richer, more responsive and high-performance applications. The device uses a slim 2.7mm x 2.7mm chip scale package (WCSP) option, less than half of TI ’s smallest 4mm x 4mm QFN package, but still offers the longest range with the lowest power consumption. This new device is ready to support the Bluetooth 5 core specification, which provides longer range, higher speed and more data for enhanced connectionless in building automation, medical, commercial and industrial automation application.
Using SimpleLink CC2640R2F-Q1 wireless MCU on the road, it can realize the connection of smart phones for car access, including passive entry passive start (PEPS) and remote keyless entry (RKE), and emerging cars with AEC-Q100 certification and level 2 temperature Use case scoring. In addition, the CC2640R2F-Q1 device is the industry's first solution using a wettable side QFN package, which helps reduce production line costs and improves reliability by optically inspecting solder joints.
