THGBMJG6C1LBAIL e-MMC: Pinout, Model and Features | Heisener Electronics
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THGBMJG6C1LBAIL e-MMC: Pinout, Model and Features

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Data di Pubblicazione: 2024-09-23

THGBMJG6C1LBAIL Introduction

THGBMFG6C1LBAIL is an 8GB density e-MMC (embedded MultiMediaCard) module, housed in a compact 153-ball BGA (Ball Grid Array) package. This module utilizes advanced Toshiba NAND flash memory and a dedicated controller chip, which are integrated into a Multi Chip Module (MCM) design. The THGBMFG6C1LBAIL follows the industry-standard MMC protocol. It offers high data storage capacity, fast read/write speeds, and improved durability, making it suitable for applications that require reliable and efficient memory solutions.

THGBMJG6C1LBAIL Pinout

Power Supply Pins:

VCC: Power supply for the chip.

VSS: Ground reference.

Data Pins:

D0 to D3: Data lines for data transfer (4-bit data bus).

D4 to D7: Additional data lines (if applicable for specific configurations).

Command and Control Pins:

CMD: Command line for sending commands to the e-MMC.

CLK: Clock signal for synchronizing data transfer.

Other Pins:

RST_n: Reset pin to initialize the device.

BUSY: Indicates the status of the device (busy or ready).

Chip Select/Enable Pins (if applicable).

THGBMJG6C1LBAIL Footprint

THGBMJG6C1LBAIL 3D Model

THGBMJG6C1LBAIL Block Diagram

THGBMJG6C1LBAIL Specification

Specification Details
Density 8 GB
Package Type 153-WFBGA
Memory Size 64Gbit
NAND Flash Type TOSHIBA NAND Flash
Memory Organization 8G x 8
Supply Voltage (VCC) 2.7V ~ 3.6V
Memory Interface eMMC
Protocol Industry-standard MMC protocol
Operating Temperature -25°C ~ 85°C
Read Speed Up to 200 MB/s
Write Speed Up to 50 MB/s

THGBMJG6C1LBAIL Features

High Density

Advanced NAND Technology

Integrated Controller

MMC Protocol Support

High Data Transfer Rates

Wide Operating Temperature Range

Low Power Consumption

JEDEC/MMCA Version 5.1interface with 1-I/O, 4-I/O and 8-I/O 

THGBMJG6C1LBAIL Applications

Mobile Devices

Automotive Systems

Consumer Electronics

Industrial Applications

Embedded Systems

Medical Devices

THGBMJG6C1LBAIL Package

THGBMJG6C1LBAIL features a 153-ball WFBGA (Wafer-Level Ball Grid Array) package, designed for high-density applications that significantly enhance the integration of electronic components. Each ball-shaped pin is arranged in a specific configuration, making it suitable for environments where space is limited. Additionally, the ball grid array structure of the WFBGA package allows for quick soldering using standard surface mount technology (SMT), facilitating efficient large-scale production and assembly.

How to Use THGBMJG6C1LBAIL?

When using the THGBMJG6C1LBAIL, start by disconnecting the device's power supply. Next, align the THGBMJG6C1LBAIL module with the motherboard, ensuring that the pins are correctly aligned. After that, you can use a hot air gun or reflow soldering equipment to solder the module in place. Once the soldering is complete, allow the module to cool.

Next, reconnect the power supply and check the operational status of the THGBMJG6C1LBAIL. Use relevant testing tools, such as an oscilloscope or logic analyzer, to monitor signal output and power voltage. Finally, configure the software according to your application needs, setting the relevant parameters to fully leverage the performance of the THGBMJG6C1LBAIL.

FAQs

What is the role of the controller chip in THGBMJG6C1LBAIL?

The controller chip manages the interaction between the NAND flash memory and the host system, ensuring proper data management, wear leveling, and efficient communication.

How is THGBMJG6C1LBAIL programmed?

The module is programmed using standard e-MMC commands, which can be implemented through the host processor's interface, allowing easy integration into embedded systems.

What are the alternatives to THGBMJG6C1LBAIL?

Alternatives to the THGBMJG6C1LBAIL include other e-MMC modules like the Samsung KLM8G1GEMB-B041 and Micron MTFC8GAKAJCN-1M WT. 

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