TDK introduced a new VLS5030EX-D inductor for automobile power circuit | Heisener Electronics
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TDK introduced a new VLS5030EX-D inductor for automobile power circuit

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Data di Pubblicazione: 2022-10-27, TDK Corporation

     TDK introduced a new VLS5030EX-D inductor (5.3 x 5.0 x 3.0 mm (L x W x H)) as part of the VLS-EX-D series wound ferrite power inductor for automotive power circuits. These small components have excellent DC superposition characteristics and can also guarantee performance at operating temperatures up to 150 ℃. The inductor is applicable to headlamp, airbag, electric power steering system (EPS), advanced driving assistance system (ADAS), engine control unit (ECU) and various other power circuit applications

     Recently, the number of ECUs installed under the hood has increased. These ECUs are used for the electrification of various vehicle control functions, as well as information entertainment, automatic driving and other applications. This small component provides support for the realization of automobile coaxial transmission power (PoC), and has excellent DC superposition characteristics. It can be used for data transmission and power supply, meeting the requirements of Advanced Driving Assistance System (ADAS) using Low Voltage Differential Signal (LVDS) transmission, for example. In addition, with the improvement of integrated circuit processing capacity, higher current is required, and VLS-EX-D series helps to meet these specifications.

      Compared with the standard VLS-EX-H series of TDK, the rated current of the new VLS-EX-D series inductor is higher. These improvements are attributed to the use of TDK's innovative metal magnetic materials for magnetic shielding functions. Specifically, for VLS5030EX-D inductor, the rated Isat is 4.7 μ 3.3 A at H, an increase of about 6% compared to standard elements of the same size 5.3 x 5.0 x 3.0 mm (L x W x H). In addition, thanks to the welding method of connecting the winding wire to the external electrode, high reliability is achieved when used in the reflow and high temperature environment.

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