TDK SESUB-PAN-T2541 Bluetooth v4.0 module, ultra-compact Bluetooth low energy module, covers an area of only 4.6mx 5.6mm x 1mm.
The module is based on a proprietary semiconductor with embedded substrate (SESUB) technology. The Bluetooth chip is embedded in a thin substrate together with a quartz resonator, bandpass filter and capacitor. The module requires only power and antenna. The Bluetooth v4.0 LE specification greatly reduces the power consumption of battery-powered devices and is ideal for wireless healthcare, sports, fitness, home entertainment, and wearable devices.
