The Diodes PI7C9X3G1632GP offers flexible multi-port and lane-width configurations for increased performance and usability levels. PCIe 3.0 packet switching ICs were introduced by Diodes Incorporated. This will play an advantage in systems handling AI/deep learning workloads, data storage devices, data center servers, wireless/wired telecommunications infrastructure, and various forms of modern embedded hardware.
The basic architecture of the device consists of two tiles, each with 8 ports and 16 channels, which enables it to support 32 SERDES channels in configuration options from two ports to 16 ports. Different port types can be assigned to handle various potential applications, such as port fan out and connecting to multiple hosts. These include upstream, downstream, and CDEP ports.
Multiple DMA channels are embedded in the device to allow more efficient data communication between the host/host and connected endpoints. The demonstrated low packet forwarding latency (<150ns typical) means high performance data transfer is possible. Integrated PCIe 3.0 clock buffers help reduce overall BOM cost and simplify implementation.
Further features, such as advanced error reporting, error handling and end-to-end data protection, are key to providing continuous transmission reliability. Additionally, operating conditions are monitored with built-in thermal sensors. Advanced power management features allow significant energy savings, enabling the device to perform over the industrial temperature range of -40°C to 85°C and enabling it to be used in a wide range of applications.
