Vishay Intertechnology, Inc has introduced a new line of lead-free NTC thermistor chips -- top to bottom contact -- offering designers a variety of installation options. Vishay BCcomponents NTCC201E4 devices with silver metallization support aluminum wire bonding and are compatible with vacuum reflow welding or formic acid/synthetic gas, SAC or SMP welding, and nano silver paste sintering.
Aec-q200 compliant devices operate in a wide temperature range from -55C to +175C and are optimized for temperature sensing, control and compensation in automotive and alternative energy applications. End products include IGBTs and power MOSFET modules and power inverters for EVs and HEVs, solar panels and wind turbines.
The thermistor has two layers of top and bottom metallization. The outer layer provides superior solder leaching resistance compared to previous generation devices, especially when using high melting point solder materials at temperatures of +360C. The inner layer prevents board formic acid corrosion when solder preforms are used and H2/N2 gas is formed.
The device has a maximum power consumption of 50mW, a response time of 3 seconds, and is packaged with PS plastic tape. And rohs compliant, halogen free and Vishay Green, thermistors provide resistance at +25C (R25), from 2.7 kohm to 20kOhm, tolerance down to ±1%, beta (B25/85) from 3435K to 3865K, tolerance down to ±1%.
