Molex, a global electronics industry leader and connectivity innovator, announced the first pluggable module solution for co-packaged optical components (CPOs). The new External Laser Source Interconnect System (ELSIS) is a complete system with enclosures, optical and electrical connectors, and pluggable modules, using proven technology to accelerate the development of hyperscale data centers.
Molex is piloting the ELSIS hybrid opto-electrical connector and enclosure system, allowing engineers to develop and test well ahead of current CPO industry applications. Companion design and development data for the pluggable module system is now available, including 3D models, technical drawings and detailed specifications. Molex aims to launch a fully integrated solution in the third quarter of 2023, enabling companies to commercialize their designs and ramp up production rapidly as CPO acceptance increases.
CPO is the next-generation technology that moves optical connections from the front panel to the inside of the host system, next to high-speed ICs. "From high-speed networking chips to graphics processing units (GPUs) and AI engines, the need for I/O bandwidth continues to escalate," said Tom Marrapode, director of advanced technology development for Molex Optical Solutions at Molex. "By placing optical components closer to these The location of the ASIC, the CPO will be able to address the complex issues associated with high-speed electrical traces, including signal integrity, density and power consumption.”
The optical connections of traditional pluggable modules are located at the user end of the module, raising eye safety concerns when used with high power laser light sources such as CPOs. As a blind-mate solution, ELSIS provides a complete external laser source system without user access to fiber optic ports and cables, with features such as safety, ease of implementation and maintenance. Using an external laser source also means removing a major source of heat from optoelectronics and IC packaging. In addition, the design eliminates high-speed electrical I/O drivers on the IC and pluggable modules, further reducing thermal loading and power consumption within the device.
