In LED lighting applications, if the profile is too high, the component sometimes produces shadows. Achieving the lowest outline helps to minimize any shadow effects while saving more space to meet the miniaturization needs in all applications. Previous interconnect methods for lighting applications include two-piece housing systems that have a higher profile and require higher component and assembly costs. Or direct welding can save space, but it is not allowed to cancel the fit, and it will cause the risk of soft solder joints and signal errors. In addition, some applications require wire-to-board and board-to-board solutions, which traditionally require separate board-to-board and wire-to-board mating components.
Molex meets these needs with a new TermiMate connector system by providing an ultra-thin terminal-specific system to prevent shadows and wire-to-board and board-to-board options using the same plug terminals to provide design flexibility and components . And savings in assembly costs.
