Latest available FRAM and high density REAM solutions | Heisener Electronics
Contattaci
SalesDept@heisener.com 86-755-83210559-819
Language Translation

* Please refer to the English Version as our Official Version.

Latest available FRAM and high density REAM solutions

Technology Cover
Data di Pubblicazione: 2021-10-03, Molex - Temp Flex

    Mouser currently distributes Fujitsu Semiconductor Memory Solutions' FRAM and High-density ReRAM products.

    These FRAMS are a new generation of nonvolatile memory, which meet the needs of engineers for higher read-write endurance, faster write speed and lower power consumption than EEPROM. Fram has serial (SPI and I ² C) And parallel interfaces, as well as a variety of compact and high-density packaging types. Memory sizes are available from 4kbits to 8mbits. The company began mass production of FRAM in 1999. Its fram products can be found in many key applications, including automotive, industrial, medical and consumer products.

    The REAM provides an SPI interface and operates in the supply voltage range of 1.6V to 3.6V.  Eeprom compatible devices offer very low power consumption, with a read state of just 0.15mA and a write state of just 1.5mA. This, combined with its 8Mbit density, makes it ideal for small, battery-powered wearables such as smartwatches, hearing AIDS, and smart glasses.  

Prodotti Correlati