Data di Pubblicazione: 2015-07-07
Laird Technologies' CoolZorb 400 series of thermal and EMI absorbing materials. CoolZorb 400 is a sponge-like material suitable for electronic components, which can effectively dissipate and absorb electromagnetic interference (EMI). The usage of CoolZorb 400 is similar to traditional heat sink compounds and is applied between IC and heat sinks, and it has demonstrated significant advantages over traditional heat sink compounds, including improved heat transfer and EMI suppression.
This new material is intended for IC thermal management and EMI mitigation in electronic devices. Electromagnetic interference is an important issue for modern high-speed electronic equipment. EMI can interfere with the normal operation of many electronic systems by inducing unnecessary current into the wiring and PC board traces and causing the magnetically conductive metal to self-heat. Another problem with high-speed electronics is the heat generated by ICs running at high clock speeds. All high-speed ICs must dissipate heat, otherwise the device may malfunction or even be permanently damaged.
The Laird CoolZorb 400 series is a hybrid of EMI absorbers and thermal management materials and is used in the same way as traditional absorber compounds. CoolZorb is composed of a silicone adhesive that gives the material the unique tack of a standard thermal gap filler. CoolZorb's material shows a thermal conductivity of 2.0W / mK, and suppresses EMI from the microwave frequency range, and has higher EMI suppression at 5GHz or higher.
The company said that the CoolZorb suppressor is well-suited for compact electronic devices such as medical devices, Wi-Fi and other RF modules, power supplies, and low-power consumer electronics.
