LEMO announced that it would expand its field proven M-series connector, introduce a new HY vacuum seal model, and provide various sizes and pin core configurations. This new fixed socket model is designed for applications requiring vacuum sealing in harsh environments.
Thanks to innovative potting materials, the new HY model can achieve vacuum sealing with ultra-low leakage rate in a wider temperature range. At the same time, the tail end of PCB is optimized, so PCB wiring can be easier even with high-density pin core configuration. The grounding pins have also been improved and can now be fixed using standard grounding pins or special vibration resistant threaded holes.
This new member of the M product series provides customers who need vacuum seal integration with the highest density ratchet coupling connectors. The combination of ultra-low leakage rate and wide temperature range enables it to show unparalleled performance in optical terminal housing or high altitude applications.
