Isolated Power Module in Micromodule Packaging | Heisener Electronics
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Isolated Power Module in Micromodule Packaging

Technology Cover
Data di Pubblicazione: 2022-11-12, Wurth Electronics Inc.

W ü rth Elektronik via MagI ³ C - fimm fixed isolation micro module expands its MagI ³ C Product series of power modules. The module is ideal for data acquisition, testing and measurement technology applications, providing interfaces and microcontrollers, as well as other requirements of industrial electronics. It provides functional isolation for overvoltage protection and minimizes noise in ground loops, position shifts, and signal paths or sensor systems.

TYPICAL CIRCUIT DIAGRAM

         

PINOUT (PACKAGE TYPE F)

      

It is small in size, high in efficiency, and the working environment temperature can be extended to 125 ℃. The module can provide continuous short circuit protection and overvoltage protection up to 3000V. According to the manufacturer's measurement, the combination of low radiation electromagnetic interference and test filter is limited in EN55032 class B/CISPR-32. Adopt the current American UL standard UL62368-1 for certification

Recommended External Circuit for Best Performance

    

It combines the option of isolating power modules with the option of micromodules in the LGA-7 package and is only 9mm x 7mm x 3.1mm in size. The isolation capacitance between the primary winding and the secondary winding is generally only 8pF. The output power of 1W is kept at the ambient temperature of 100C without derating. It provides one of the best modules in the total isolation module combination, and the efficiency is up to 91%.

These power modules are fully integrated DC-DC converters with switching power stages, controllers, inductors, and input/output capacitors. It does not require external circuits, because all components, including CIN and COUT, are integrated and can achieve fast and simple circuit design without transformer expertise.

PHYSICAL DIMENSIONS

     

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