An upgrade to the right-angle sensor family for functional safety applications | Heisener Electronics
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An upgrade to the right-angle sensor family for functional safety applications

Technology Cover
Data di Pubblicazione: 2022-02-03, TDK Corporation

   TDK has upgraded its Micronas 3D HAL Right-angle Hall effect sensor family with device rotation position detection for accelerator pedals, electronic throttle control, rotary shifters (with push and push functionality) and rear-axle steering. In addition, sensors detect linear positions in clutch or brake pedal, driveline, cylinder and valve position sensing applications. HAL 37XY (HAL 37XY, HAR 37XY and HAC 37XY) for functional safety aspects of automotive and industrial applications. According to ISO 26262, all members of HAL 37XY are now described as SEooC(Out-of-context security element)ASIL B-ready.

   The company incorporates vertical Hall plates into standard CMOS processes through its 3D HAL technology. This process makes it much easier to assess the relative strengths of horizontal and vertical magnetic field components, which is critical for huge angular properties. In contrast, traditional planar Hall technology is only sensitive to magnetic fields that are orthogonal to the chip surface. It offers sensor variants of three different right-angle sensors: a proven sensor family, a version with redundancy functionality through two integrated Hall sensor modules (HAR 37XY), and an integrated capacitor version (HAC 37XY).

   This powerful right-angle sensor family offers superior temperature stability, high electrical impedance air gap variation and magnet aging, a variety of diagnostic functions and very effective protection circuits. HAR 37XY series of dual templates, provides complete redundancy, two independent dies stacked on a separate package. The stacked mode structure ensures that the two modes occupy the same magnetic field position, thus producing synchronous measurement output. A packaged redundant sensor solution reduces system costs while improving system reliability with smaller PCBS and fewer solder joints. The HAC 37xy integrates a sensor family of chips and two three-lead to packages up to 330nF for up to 8kV ESD immunity. The encapsulated pins can be soldered or welded directly to the lead frame, eliminating the PCB requirement and reducing the overall size and cost of the system.

   The ASIL-B upgrade enables the company's sensor customers to use the product family in applications with functional safety requirements.

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