With the ever-increasing number of mobile devices, laptops, and battery-operated devices, there is an ever-increasing need for charging power and fast charging. For engineers, this trend presents the challenge of achieving higher power levels in a smaller form factor while meeting thermal performance demands. To meet these contemporary design demands, Infineon Technologies has combined a hybrid flyback (HFB) controller, the XDP digital power controller XDPS2201 and a CoolGaN integrated power stage (IPS) 600V (IGI60F1414A1L) for high efficiency and high power Density charger and adapter design.
"By delivering superior power transfer efficiency, faster charging and portability, GaN has completely changed the way we charge electronics," said Steven Yang, CEO of Anker Innovations.
Anker selected Infineon's next-generation HFB controller and CoolGaN IPS for fast chargers above 100W, achieving market-leading power density. Adam White, President of Infineon's Power and Sensor Systems Division, said: "By combining Infineon's hybrid inverse-trans controller with the integrated CoolGaN devices in Anker's new charging lineup, we have achieved a superior system level of over 95 percent. Efficiency." "This architecture reduces energy loss by 21% compared to other charging solutions. This is the first time that Infineon's HFB controller and CoolGaN IPS device have been combined and commercially available in the consumer electronics market."
