Pagina 243 - Nuove Tecnologie | Heisener Electronics
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Nuove Tecnologie

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Technology Cover

2015-08-25, ON Semiconductor - Small-footprint single N-channel power MOSFETs for compact designs (NTMFS6)

ON Semiconductor’s NTMFS6 single N-channel power MOSFETs feature a small footprint of just 5mm x 6mm for compact designs. Their Low RDS(on) minimizes conduction losses and a low QG and capacitance minimizes driver losses. The devices are Pb-free, halogen free/BFR free and are RoHS compliant.

Technology Cover

2015-08-25, Vishay - Dual inductors target Class D audio amplifier systems (AEC-Q200)

Vishay’s AEC-Q200-qualified low-profile, high-current IHLD-4032KB-5A Series dual inductors feature two inductors in one package with a shielded construction and low coupling for minimal cross-talk between inductors.

Technology Cover

2015-08-25, Cypress - High-performance synchronous SRAMs integrate ECC for superior reliability

Cypress has introduced what it believes is the industry’s highest-density synchronous SRAMs with on-chip error-correcting code (ECC). The integrated ECC feature enables the new 36Mb synchronous SRAMs to provide the highest levels of data reliability, simplifying designs for a wide variety of military, communication and data processing applications.

Technology Cover

2015-08-25, Microchip - First proven automotive-ready in-car Ethernet physical layer (MOST150)

Microchip has announced that the Volvo Car Group has migrated from MOST25 to the latest MOST150 standard in its all-new Volvo XC90 model, using Microchip’s OS81110 Intelligent Network Interface Controllers (INICs). After many years of using Microchip’s MOST25 INICs, Volvo Cars needed to enable its latest infotainment systems with the ability to carry Ethernet packets.

Technology Cover

2015-08-25, Freescale - Tyre pressure monitors also suit ultra low-power wireless sensing systems (FXTH8715)

Freescale’s FXTH8715 Tire Pressure Monitoring Sensors (TPMS) are aimed at applications such as tyre pressure monitoring systems and ultra low-power wireless sensing. The highly-integrated TPMS offer the smallest package footprint on the market at 7mm x 7mm, says the company.

Technology Cover

2015-08-25, JAE Electronics - Waterproof micro connectors compatible with Micro-USB type 2.0 system (DX4 series)

JAE Electronics’ DX4 series waterproof micro connectors are compatible with the Micro-USB type 2.0 for small devices standardized by the USB Implementers Forum

Technology Cover

2015-08-25, Littelfuse - Self-protected devices can be used in outdoor and commercial LED lighting systems (LSP05)

The Littelfuse LSP05 and LSP10 SPD surge-protection modules are self-protected devices that can be used in outdoor and commercial LED lighting fixtures for transient over-voltage protection. They are constructed with Littelfuse thermally-protected varistor technology.

Technology Cover

2015-08-25, Rohm - New shunt resistors developed for products with higher rated power (PSR Series)

This rise in demand has been fuelled by increasing computerisation in the automotive and industrial markets, along with the rapidly expanding current control application sector and the trend towards high-current circuit designs.

Technology Cover

2015-08-25, Texas Instruments - Physical layer transceiver with integrated PMD sublayers for harsh environments (DP83867)

The rugged Texas Instruments DP83867 is a robust low-power fully-featured Physical Layer transceiver with integrated PMD sublayers to support 10BASE-T, 100BASE-TX and 1000BASE-T Ethernet protocols. Optimized for ESD protection, the device exceeds 8kV IEC 61000-4-2 (direct contact).

Technology Cover

2015-08-25, Micrel - Super-heterodyne image-reject RF receiver with automatic gain control (MICRF229 ASK/OOK)

The Micrel MICRF229 ASK/OOK receiver with auto-poll and RSSI is a 400-450MHz super-heterodyne, image-reject RF receiver with automatic gain control. The MICRF229 also features an ASK/OOK demodulator and analog RSSI output. It’s ideal for low-cost, low-power, RKE, TPMS and remote actuation applications and only requires a crystal and a minimum number of external components.

Technology Cover

2015-08-25, Rohm - Intelligent new power modules for high-performance switching

Rohm Semiconductor has introduced a new intelligent power module (IPM) family optimized for high speed and power-efficient operation in motor driving and inverter applications. The 600V modules integrate a range of components such as gate drivers, bootstrap diodes, IGBTs or ROHM’s proprietary Low Ron SuperJunction Power MOSFETs (PrestoMOS) as well as a fly wheel diode (FWD) within a single compact package.

Technology Cover

2015-08-25, Cypress - Touchscreen controller powers ZTE nubia Z7 Max smartphone

ZTE, a leading global provider of telecommunications equipment, network solutions and mobile devices, has selected a TrueTouch capacitive touchscreen controller from Cypress Semiconductor for its flagship nubia Z7 Max smartphone. The phone uses the TrueTouch TMA568 controller to implement an easy-wake gesture feature that enables the user to wake the phone’s screen from sleep-mode by simply double tapping on the screen with a finger.

Technology Cover

2015-08-25, Kyocera - Innovative TFT LCDs show bright colours clearly – even in intense sunlight

Kyocera has extended its product range with two new next-generation LCDs. The innovative TFT LCDs show bright colours clearly, even in intense sunlight. This makes them ideal for industrial applications, including medical, aerospace, aquatics, testing and measuring, as well as for Industry 4.0 equipment, says the company.

Technology Cover

2015-08-25, TDK - Ultra-compact Bluetooth Smart module from stock (SESUB-PAN-T2541)

The SESUB-PAN-T2541 Bluetooth v4.0 Module from TDK, an ultra-compact, Bluetooth 4.0 Low Energy (LE) micro module, is one of the world’s smallest modules for Bluetooth Smart devices, says the company.

Technology Cover

2015-08-25, Vishay - Low-profile high-current power inductors for high saturation currents

Latest from Vishay is a new series of low-profile, high-current power inductors featuring powdered iron cores for high saturation current up to 5.8A. Lowering costs and saving board space in computer, consumer, and telecom applications, Vishay Dale IHHP series devices are offered in the miniature 2mm by 1.6mm 0806 and 2.5mm by 2mm 1008 case sizes, each available with low profiles of 1mm and 1.2mm.

Technology Cover

2015-08-25, Molex - Micro-push connectors can boost operational efficiency and lower costs

Molex has launched the Brad Micro-Push M12 connector for factory automation and industrial lighting applications. Featuring an innovative push-on mating interface, the connectors reduce installation time up to 80% compared to screw-style connectors and facilitate simple blind-mate connections in tight locations.

Technology Cover

2015-08-25, Littelfuse - New TVS diode arrays combine high ESD protection with smaller footprints (SP1013)

Littelfuse has introduced four new solutions for general-purpose ESD protection TVS Diode Arrays (SPA Diode) that occupy less board space than similar industry offerings. The SP1013 and SP1014 TVS Diode Arrays fit into a standard 0201 footprint but offer a 30 percent reduction in the board space required over other 0201 outline solutions, allowing more clearance between components.

Technology Cover

2015-08-25, Cree - Latest MMICs target X-band and C-band high-frequency applications (CMPA5585025F)

Gallium nitride high electron mobility transistor (HEMT) monolithic microwave integrated circuits (MMICs) from Cree target X-band and C-band high-frequency applications. The transistors feature a wide bandgap material used for high-power high-performance semiconductors with electrical characteristics superior to conventional silicon devices, useful in many applications including power conversion systems.