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Prodotti Xilinx Inc.

Record 7.167
Pagina  93/256
Immagine
Numero di parte
Produttore
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pacchetto
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Quantità
hot XC17S30PD8I
Xilinx Inc.

IC PROM PROG I-TEMP 5V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 300kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione5.520
XCZU19EG-L1FFVE1924I
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione2.064
XCZU7EV-1FFVC1156E
Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione6.928
5962-9957201NNA
Xilinx Inc.

IC FPGA 2.5V HIREL VIRTEX 300

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 260
  • Number of Gates: 322970
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -55°C ~ 125°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione6.624
XC2V8000-5FF1517I
Xilinx Inc.

IC FPGA 1108 I/O 1517FCBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 3096576
  • Number of I/O: 1108
  • Number of Gates: 8000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione2.528
hot XC2V250-5FG256I
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 172
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione4.000
XC2V250-5CSG144I
Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 92
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione3.072
XCV1000E-6FG1156I
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione7.008
hot XCV1000E-6FG1156C
Xilinx Inc.

IC FPGA 660 I/O 1156FBGA

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 660
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA
  • Supplier Device Package: 1156-FBGA (35x35)
pacchetto: 1156-BBGA
Azione5.488
XC4020E-4PG223I
Xilinx Inc.

IC FPGA 192 I/O 223CPGA

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 192
  • Number of Gates: 20000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Through Hole
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 223-BCPGA
  • Supplier Device Package: 223-CPGA (47.25x47.25)
pacchetto: 223-BCPGA
Azione3.120
hot XC4010XL-3TQ144I
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 113
  • Number of Gates: 10000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione7.560
XCVU095-2FFVA2104E
Xilinx Inc.

IC FPGA 832 I/O 2104FCBGA

  • Number of LABs/CLBs: 67200
  • Number of Logic Elements/Cells: 1176000
  • Total RAM Bits: 62259200
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
pacchetto: 2104-BBGA, FCBGA
Azione5.040
XCKU095-1FFVB1760I
Xilinx Inc.

IC FPGA 702 I/O 1760FCBGA

  • Number of LABs/CLBs: 67200
  • Number of Logic Elements/Cells: 1176000
  • Total RAM Bits: 60518400
  • Number of I/O: 702
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione4.048
XC7VX690T-1FFG1158C
Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 350
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1158-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione5.904
hot XC6VSX315T-1FF1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione3.952
XC2VP40-7FF1152C
Xilinx Inc.

IC FPGA 692 I/O 1152FCBGA

  • Number of LABs/CLBs: 4848
  • Number of Logic Elements/Cells: 43632
  • Total RAM Bits: 3538944
  • Number of I/O: 692
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione3.776
XC7K325T-L2FFG676I
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione6.096
hot XC5VLX110-1FF676C
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione8.340
XC2VP20-7FF1152C
Xilinx Inc.

IC FPGA 564 I/O 1152FCBGA

  • Number of LABs/CLBs: 2320
  • Number of Logic Elements/Cells: 20880
  • Total RAM Bits: 1622016
  • Number of I/O: 564
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione6.464
XC4VFX12-11SF363C
Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

  • Number of LABs/CLBs: 1368
  • Number of Logic Elements/Cells: 12312
  • Total RAM Bits: 663552
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 363-FBGA, FCBGA
  • Supplier Device Package: 363-FCBGA (17x17)
pacchetto: 363-FBGA, FCBGA
Azione3.440
XC2VP4-5FG256I
Xilinx Inc.

IC FPGA 140 I/O 256FGBGA

  • Number of LABs/CLBs: 752
  • Number of Logic Elements/Cells: 6768
  • Total RAM Bits: 516096
  • Number of I/O: 140
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione5.424
XA3S1600E-4FGG484I
Xilinx Inc.

IC FPGA 376 I/O 1484FBGA

  • Number of LABs/CLBs: 3688
  • Number of Logic Elements/Cells: 33192
  • Total RAM Bits: 663552
  • Number of I/O: 376
  • Number of Gates: 1600000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione7.056
XC3S2000-4FGG900I
Xilinx Inc.

IC FPGA 565 I/O 900FBGA

  • Number of LABs/CLBs: 5120
  • Number of Logic Elements/Cells: 46080
  • Total RAM Bits: 737280
  • Number of I/O: 565
  • Number of Gates: 2000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
pacchetto: 900-BBGA
Azione6.368
hot XA3S200A-4FTG256I
Xilinx Inc.

IC FPGA 195 I/O 256FBGA

  • Number of LABs/CLBs: 448
  • Number of Logic Elements/Cells: 4032
  • Total RAM Bits: 294912
  • Number of I/O: 195
  • Number of Gates: 200000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.080
XA6SLX9-3CSG225Q
Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
pacchetto: 225-LFBGA, CSPBGA
Azione2.368
hot XC9572-7PC44C
Xilinx Inc.

IC CPLD 72MC 7.5NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacchetto: 44-LCC (J-Lead)
Azione4.448
hot XC95288-15HQ208I
Xilinx Inc.

IC CPLD 288MC 15NS 208HQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 288
  • Number of Gates: 6400
  • Number of I/O: 168
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP Exposed Pad
Azione5.216
XCVU9P-2FLGA2577E
Xilinx Inc.

IC FPGA VIRTEX-UP 2577FCBGA

  • Number of LABs/CLBs: 147780
  • Number of Logic Elements/Cells: 2586150
  • Total RAM Bits: 391168000
  • Number of I/O: 448
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2577-BBGA, FCBGA
  • Supplier Device Package: 2577-FCBGA (52.5x52.5)
pacchetto: 2577-BBGA, FCBGA
Azione5.776