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Prodotti Xilinx Inc.

Record 7.167
Pagina  9/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
hot XC17S05PD8I
Xilinx Inc.

IC PROM PROG I-TEMP 3.3V 8-DIP

  • Programmable Type: OTP
  • Memory Size: 50kb
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione5.376
XCZU4EG-3SFVC784E
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 192K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione5.232
XC5VSX95T-3FFG1136C
Xilinx Inc.

IC FPGA 640 I/O 1136FCBGA

  • Number of LABs/CLBs: 7360
  • Number of Logic Elements/Cells: 94208
  • Total RAM Bits: 8994816
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1136-BBGA, FCBGA
  • Supplier Device Package: 1136-FCBGA (35x35)
pacchetto: 1136-BBGA, FCBGA
Azione6.432
hot XCS20XL-4TQG144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 113
  • Number of Gates: 20000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione40.896
hot XCV50E-7PQ240C
Xilinx Inc.

IC FPGA 158 I/O 240QFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 65536
  • Number of I/O: 158
  • Number of Gates: 71693
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP
Azione5.024
XC4025E-3PG299C
Xilinx Inc.

IC FPGA 256 I/O 299CPGA

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 25000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 299-BCPGA
  • Supplier Device Package: 299-CPGA (52.3x52.3)
pacchetto: 299-BCPGA
Azione6.256
XC4013XL-1HT144I
Xilinx Inc.

IC FPGA 113 I/O 144HQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 13000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP Exposed Pad
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP Exposed Pad
Azione5.040
XC4006E-1PG156C
Xilinx Inc.

IC FPGA 125 I/O 156CPGA

  • Number of LABs/CLBs: 256
  • Number of Logic Elements/Cells: 608
  • Total RAM Bits: 8192
  • Number of I/O: 125
  • Number of Gates: 6000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 156-BCPGA
  • Supplier Device Package: 156-CPGA (42.17x42.17)
pacchetto: 156-BCPGA
Azione7.056
hot XC4003E-1PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 61
  • Number of Gates: 3000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
pacchetto: 84-LCC (J-Lead)
Azione4.768
hot XC4VLX200-11FF1513C
Xilinx Inc.

IC FPGA 960 I/O 1513FCBGA

  • Number of LABs/CLBs: 22272
  • Number of Logic Elements/Cells: 200448
  • Total RAM Bits: 6193152
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1513-BBGA, FCBGA
  • Supplier Device Package: 1513-FCBGA (40x40)
pacchetto: 1513-BBGA, FCBGA
Azione3.520
XC6VSX475T-L1FF1156C
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 37200
  • Number of Logic Elements/Cells: 476160
  • Total RAM Bits: 39223296
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione6.832
XC4VLX160-12FF1148C
Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

  • Number of LABs/CLBs: 16896
  • Number of Logic Elements/Cells: 152064
  • Total RAM Bits: 5308416
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
pacchetto: 1148-BBGA, FCBGA
Azione4.768
XC6VLX365T-L1FF1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 28440
  • Number of Logic Elements/Cells: 364032
  • Total RAM Bits: 15335424
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.91 V ~ 0.97 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione4.160
XC6VLX240T-L1FF1759C
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.87 V ~ 0.93 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione5.904
hot XC4VLX80-12FF1148C
Xilinx Inc.

IC FPGA 768 I/O 1148FCBGA

  • Number of LABs/CLBs: 8960
  • Number of Logic Elements/Cells: 80640
  • Total RAM Bits: 3686400
  • Number of I/O: 768
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1148-BBGA, FCBGA
  • Supplier Device Package: 1148-FCPBGA (35x35)
pacchetto: 1148-BBGA, FCBGA
Azione6.432
XC6VCX195T-1FF784C
Xilinx Inc.

IC FPGA 400 I/O 784FCBGA

  • Number of LABs/CLBs: 15600
  • Number of Logic Elements/Cells: 199680
  • Total RAM Bits: 12681216
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
pacchetto: 784-BBGA, FCBGA
Azione4.768
XC6VLX75T-1FF784I
Xilinx Inc.

IC FPGA 360 I/O 784FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (29x29)
pacchetto: 784-BBGA, FCBGA
Azione5.328
hot XC6SLX100-2FGG484I
Xilinx Inc.

IC FPGA 326 I/O 484FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 326
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione96.600
XC7A50T-3FTG256E
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.912
XA6SLX25-3FGG484Q
Xilinx Inc.

IC FPGA 266 I/O 484FGGBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 266
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione2.208
XC7A15T-L2FTG256E
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 1300
  • Number of Logic Elements/Cells: 16640
  • Total RAM Bits: 921600
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione4.992
XA6SLX9-2CSG225Q
Xilinx Inc.

IC FPGA 160 I/O 225CSGBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 160
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 225-LFBGA, CSPBGA
  • Supplier Device Package: 225-CSPBGA (13x13)
pacchetto: 225-LFBGA, CSPBGA
Azione7.552
XC6SLX9-L1FTG256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione7.888
hot XC6SLX150T-3FGG484C
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione17.628
hot XC6SLX25-2CSG324I
Xilinx Inc.

IC FPGA 226 I/O 324CSBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 226
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione6.912
hot XC9572-15PC44C
Xilinx Inc.

IC CPLD 72MC 15NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacchetto: 44-LCC (J-Lead)
Azione7.464
XAZU3EG-1SFVA625I
Xilinx Inc.

XAZU3EG-1SFVA625I

  • Architecture: -
  • Core Processor: -
  • Flash Size: -
  • RAM Size: -
  • Peripherals: -
  • Connectivity: -
  • Speed: -
  • Primary Attributes: -
  • Operating Temperature: -
  • Package / Case: 625-BFBGA, FCBGA
  • Supplier Device Package: 625-FCBGA (21x21)
pacchetto: 625-BFBGA, FCBGA
Azione6.080
XC7S6-1CPGA196C
Xilinx Inc.

XC7S6-1CPGA196C

  • Number of LABs/CLBs: -
  • Number of Logic Elements/Cells: 6000
  • Total RAM Bits: 184320
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 196-TFBGA, CSBGA
  • Supplier Device Package: 196-CSPBGA (8x8)
pacchetto: 196-TFBGA, CSBGA
Azione7.176