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Prodotti Xilinx Inc.

Record 7.167
Pagina  60/256
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Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
hot XC1736ESOG8C
Xilinx Inc.

IC PROM SERIAL CONFIG 36K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 36kb
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
pacchetto: 8-SOIC (0.154", 3.90mm Width)
Azione11.892
hot XC17S50APD8C
Xilinx Inc.

IC PROM SER 50000 C-TEMP 8-DIP

  • Programmable Type: OTP
  • Memory Size: 500kb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: 0°C ~ 70°C
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
pacchetto: 8-DIP (0.300", 7.62mm)
Azione12.840
XCZU3EG-1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 154K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione2.656
XC7Z030-3FFG676E
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 676FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 1GHz
  • Primary Attributes: Kintex?-7 FPGA, 125K Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione3.952
XCZU2EG-L1SFVC784I
Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 784-BBGA, FCBGA
  • Supplier Device Package: 784-FCBGA (23x23)
pacchetto: 784-BBGA, FCBGA
Azione5.376
hot XC7Z020-1CLG484C
Xilinx Inc.

IC SOC CORTEX-A9 ARTIX-7 484BGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-LFBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
pacchetto: 484-LFBGA, CSPBGA
Azione7.616
XC5VLX110-1FFG676CES
Xilinx Inc.

IC FPGA 440 I/O 676FCBGA

  • Number of LABs/CLBs: 8640
  • Number of Logic Elements/Cells: 110592
  • Total RAM Bits: 4718592
  • Number of I/O: 440
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione5.072
hot XCS30XL-4TQG144C
Xilinx Inc.

IC FPGA 113 I/O 144TQFP

  • Number of LABs/CLBs: 576
  • Number of Logic Elements/Cells: 1368
  • Total RAM Bits: 18432
  • Number of I/O: 113
  • Number of Gates: 30000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione6.024
hot XCV600E-8FG680C
Xilinx Inc.

IC FPGA 512 I/O 680FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 512
  • Number of Gates: 985882
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 680-LBGA Exposed Pad
  • Supplier Device Package: 680-FTEBGA (40x40)
pacchetto: 680-LBGA Exposed Pad
Azione6.272
XCV1600E-8BG560C
Xilinx Inc.

IC FPGA 404 I/O 560MBGA

  • Number of LABs/CLBs: 7776
  • Number of Logic Elements/Cells: 34992
  • Total RAM Bits: 589824
  • Number of I/O: 404
  • Number of Gates: 2188742
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione5.328
XC4028XL-2BG352I
Xilinx Inc.

IC FPGA 256 I/O 352MBGA

  • Number of LABs/CLBs: 1024
  • Number of Logic Elements/Cells: 2432
  • Total RAM Bits: 32768
  • Number of I/O: 256
  • Number of Gates: 28000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione6.832
XC4020E-4HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 193
  • Number of Gates: 20000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione7.024
XC4005XL-1PQ160I
Xilinx Inc.

IC FPGA 112 I/O 160QFP

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione5.168
XC5VFX200T-1FF1738I
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
pacchetto: 1738-BBGA, FCBGA
Azione3.152
XC5VLX155-3FF1153C
Xilinx Inc.

IC FPGA 800 I/O 1153FCBGA

  • Number of LABs/CLBs: 12160
  • Number of Logic Elements/Cells: 155648
  • Total RAM Bits: 7077888
  • Number of I/O: 800
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1153-BBGA, FCBGA
  • Supplier Device Package: 1153-FCBGA (35x35)
pacchetto: 1153-BBGA, FCBGA
Azione2.768
XCKU060-2FFVA1156E
Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

  • Number of LABs/CLBs: 41460
  • Number of Logic Elements/Cells: 725550
  • Total RAM Bits: 38912000
  • Number of I/O: 520
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione2.688
XQ7K325T-2RF676I
Xilinx Inc.

IC FPGA KINTEX-7 676-FBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione6.160
hot XC2VP7-6FFG672I
Xilinx Inc.

IC FPGA 396 I/O 672FCBGA

  • Number of LABs/CLBs: 1232
  • Number of Logic Elements/Cells: 11088
  • Total RAM Bits: 811008
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 672-BBGA, FCBGA
  • Supplier Device Package: 672-FCBGA (27x27)
pacchetto: 672-BBGA, FCBGA
Azione5.728
hot XC7A100T-L2FGG676E
Xilinx Inc.

IC FPGA 300 I/O 676FCBGA

  • Number of LABs/CLBs: 7925
  • Number of Logic Elements/Cells: 101440
  • Total RAM Bits: 4976640
  • Number of I/O: 300
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione5.664
XC7A50T-2FT256I
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 4075
  • Number of Logic Elements/Cells: 52160
  • Total RAM Bits: 2764800
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione2.208
XA6SLX25-2FTG256Q
Xilinx Inc.

IC FPGA 186 I/O 256FTGBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione3.520
hot XC3S500E-4FTG256I
Xilinx Inc.

IC FPGA 190 I/O 256FTBGA

  • Number of LABs/CLBs: 1164
  • Number of Logic Elements/Cells: 10476
  • Total RAM Bits: 368640
  • Number of I/O: 190
  • Number of Gates: 500000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione49.632
XC2S100-6FG256C
Xilinx Inc.

IC FPGA 176 I/O 256FBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 176
  • Number of Gates: 100000
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
pacchetto: 256-BGA
Azione3.344
XA3S250E-4CPG132Q
Xilinx Inc.

IC FPGA 92 I/O 132CSBGA

  • Number of LABs/CLBs: 612
  • Number of Logic Elements/Cells: 5508
  • Total RAM Bits: 221184
  • Number of I/O: 92
  • Number of Gates: 250000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 132-TFBGA, CSPBGA
  • Supplier Device Package: 132-CSPBGA (8x8)
pacchetto: 132-TFBGA, CSPBGA
Azione5.472
XC7A35T-1FGG484C
Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

  • Number of LABs/CLBs: 2600
  • Number of Logic Elements/Cells: 33208
  • Total RAM Bits: 1843200
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione4.368
XCR3512XL-10PQ208C
Xilinx Inc.

IC CPLD 512MC 9NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 32
  • Number of Macrocells: 512
  • Number of Gates: 12000
  • Number of I/O: 180
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione4.976
hot XC2C256-7FT256I
Xilinx Inc.

IC CPLD 256MC 6.7NS 256BGA

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 6.7ns
  • Voltage Supply - Internal: 1.7 V ~ 1.9 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 184
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione7.504
XC7S15-1CPGA196I
Xilinx Inc.

XC7S15-1CPGA196I

  • Number of LABs/CLBs: 1000
  • Number of Logic Elements/Cells: 12800
  • Total RAM Bits: 368640
  • Number of I/O: 100
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 196-TFBGA, CSBGA
  • Supplier Device Package: 196-CSPBGA (8x8)
pacchetto: 196-TFBGA, CSBGA
Azione6.864