Prodotti Xilinx Inc.

XQ17V16CK44M

Xilinx Inc.

IC MEM PROM 16MB 3.3V 44CCC

• Programmable Type: OTP
• Memory Size: 16Mb
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -55°C ~ 125°C (TC)
• Package / Case: 44-CCC (J-Lead)
• Supplier Device Package: 44-CCCP (16.51x16.51)

pacchetto: 44-CCC (J-Lead)

XCZU19EG-1FFVC1760I

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1760-BBGA, FCBGA
• Supplier Device Package: 1760-FCBGA (42.5x42.5)

pacchetto: 1760-BBGA, FCBGA

XCZU7EG-2FBVB900I

Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

pacchetto: 900-BBGA, FCBGA

XC7Z045-1FFG900I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

• Architecture: MCU, FPGA
• Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 667MHz
• Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 900-BBGA, FCBGA
• Supplier Device Package: 900-FCBGA (31x31)

pacchetto: 900-BBGA, FCBGA

XCZU2EG-1SBVA484E

Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

• Architecture: MCU, FPGA
• Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
• Flash Size: -
• RAM Size: 256KB
• Peripherals: DMA, WDT
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Speed: 600MHz, 1.5GHz
• Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 484-BBGA, FCBGA
• Supplier Device Package: 484-FCBGA (19x19)

pacchetto: 484-BBGA, FCBGA

XC2V8000-5FFG1152C

Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

• Number of LABs/CLBs: 11648
• Number of Logic Elements/Cells: -
• Total RAM Bits: 3096576
• Number of I/O: 824
• Number of Gates: 8000000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1152-BBGA, FCBGA
• Supplier Device Package: 1152-FCBGA (35x35)

pacchetto: 1152-BBGA, FCBGA

XC2V1500-4FFG896I

Xilinx Inc.

IC FPGA 528 I/O 896FCBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: -
• Total RAM Bits: 884736
• Number of I/O: 528
• Number of Gates: 1500000
• Voltage - Supply: 1.425 V ~ 1.575 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 896-BBGA, FCBGA
• Supplier Device Package: 896-FCBGA (31x31)

pacchetto: 896-BBGA, FCBGA

XC4020E-4HQ208C

Xilinx Inc.

IC FPGA 160 I/O 208HQFP

• Number of LABs/CLBs: 784
• Number of Logic Elements/Cells: 1862
• Total RAM Bits: 25088
• Number of I/O: 160
• Number of Gates: 20000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 208-BFQFP Exposed Pad
• Supplier Device Package: 208-PQFP (28x28)

pacchetto: 208-BFQFP Exposed Pad

XC4005XL-1PC84I

Xilinx Inc.

IC FPGA 61 I/O 84PLCC

• Number of LABs/CLBs: 196
• Number of Logic Elements/Cells: 466
• Total RAM Bits: 6272
• Number of I/O: 61
• Number of Gates: 5000
• Voltage - Supply: 3 V ~ 3.6 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 84-LCC (J-Lead)
• Supplier Device Package: 84-PLCC (29.31x29.31)

pacchetto: 84-LCC (J-Lead)

XCVU3P-2FFVC1517E

Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

• Number of LABs/CLBs: 49260
• Number of Logic Elements/Cells: 862050
• Total RAM Bits: 118067200
• Number of I/O: 520
• Number of Gates: -
• Voltage - Supply: 0.825 V ~ 0.876 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1517-BBGA, FCBGA
• Supplier Device Package: 1517-FCBGA (40x40)

pacchetto: 1517-BBGA, FCBGA

XC7VX690T-L2FFG1926E

Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

• Number of LABs/CLBs: 54150
• Number of Logic Elements/Cells: 693120
• Total RAM Bits: 54190080
• Number of I/O: 720
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 100°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1926-FCBGA (45x45)

pacchetto: 1924-BBGA, FCBGA

XC6VHX380T-2FF1924C

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

• Number of LABs/CLBs: 29880
• Number of Logic Elements/Cells: 382464
• Total RAM Bits: 28311552
• Number of I/O: 640
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1924-BBGA, FCBGA
• Supplier Device Package: 1924-FCBGA (45x45)

pacchetto: 1924-BBGA, FCBGA

XC7VX485T-2FFG1158C

Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

• Number of LABs/CLBs: 37950
• Number of Logic Elements/Cells: 485760
• Total RAM Bits: 37969920
• Number of I/O: 350
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1158-FCBGA (35x35)

pacchetto: 1156-BBGA, FCBGA

XC6VSX315T-1FF1156I

Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

• Number of LABs/CLBs: 24600
• Number of Logic Elements/Cells: 314880
• Total RAM Bits: 25952256
• Number of I/O: 600
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1156-FCBGA (35x35)

pacchetto: 1156-BBGA, FCBGA

XC7VX415T-1FFG1158C

Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

• Number of LABs/CLBs: 32200
• Number of Logic Elements/Cells: 412160
• Total RAM Bits: 32440320
• Number of I/O: 350
• Number of Gates: -
• Voltage - Supply: 0.97 V ~ 1.03 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 1156-BBGA, FCBGA
• Supplier Device Package: 1158-FCBGA (35x35)

pacchetto: 1156-BBGA, FCBGA

XC6VCX75T-2FFG484C

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

• Number of LABs/CLBs: 5820
• Number of Logic Elements/Cells: 74496
• Total RAM Bits: 5750784
• Number of I/O: 240
• Number of Gates: -
• Voltage - Supply: 0.95 V ~ 1.05 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

pacchetto: 484-BBGA

XC4VLX15-11FF668C

Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

• Number of LABs/CLBs: 1536
• Number of Logic Elements/Cells: 13824
• Total RAM Bits: 884736
• Number of I/O: 320
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 668-BBGA, FCBGA
• Supplier Device Package: 668-FCBGA (27x27)

pacchetto: 668-BBGA, FCBGA

XC6SLX100T-3FGG484I

Xilinx Inc.

IC FPGA 296 I/O 484FBGA

• Number of LABs/CLBs: 7911
• Number of Logic Elements/Cells: 101261
• Total RAM Bits: 4939776
• Number of I/O: 296
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 484-BBGA
• Supplier Device Package: 484-FBGA (23x23)

pacchetto: 484-BBGA

XC6SLX75T-2FG676C

Xilinx Inc.

IC FPGA 348 I/O 676FCBGA

• Number of LABs/CLBs: 5831
• Number of Logic Elements/Cells: 74637
• Total RAM Bits: 3170304
• Number of I/O: 348
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

pacchetto: 676-BBGA, FCBGA

XC3S1000-5FGG676C

Xilinx Inc.

IC FPGA 391 I/O 676FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 391
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BGA
• Supplier Device Package: 676-FBGA (27x27)

pacchetto: 676-BGA

XC3S50A-4FT256I

Xilinx Inc.

IC FPGA 144 I/O 256FTBGA

• Number of LABs/CLBs: 176
• Number of Logic Elements/Cells: 1584
• Total RAM Bits: 55296
• Number of I/O: 144
• Number of Gates: 50000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 100°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

pacchetto: 256-LBGA

XCKU040-1FBVA676C

Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

• Number of LABs/CLBs: 30300
• Number of Logic Elements/Cells: 530250
• Total RAM Bits: 21606000
• Number of I/O: 312
• Number of Gates: -
• Voltage - Supply: 0.922 V ~ 0.979 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 676-BBGA, FCBGA
• Supplier Device Package: 676-FCBGA (27x27)

pacchetto: 676-BBGA, FCBGA

XC3S1000-4FGG456C

Xilinx Inc.

IC FPGA 333 I/O 456FBGA

• Number of LABs/CLBs: 1920
• Number of Logic Elements/Cells: 17280
• Total RAM Bits: 442368
• Number of I/O: 333
• Number of Gates: 1000000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 456-BBGA
• Supplier Device Package: 456-FBGA (23x23)

pacchetto: 456-BBGA

XC6SLX25-3FTG256C

Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

• Number of LABs/CLBs: 1879
• Number of Logic Elements/Cells: 24051
• Total RAM Bits: 958464
• Number of I/O: 186
• Number of Gates: -
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C (TJ)
• Package / Case: 256-LBGA
• Supplier Device Package: 256-FTBGA (17x17)

pacchetto: 256-LBGA

XCR3032XL-7PC44I

Xilinx Inc.

IC CPLD 32MC 7NS 44PLCC

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 7.0ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 32
• Number of Gates: 750
• Number of I/O: 36
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

pacchetto: 44-LCC (J-Lead)

XC9536-5CS48C

Xilinx Inc.

IC CPLD 36MC 5NS 48CSP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 5.0ns
• Voltage Supply - Internal: 4.75 V ~ 5.25 V
• Number of Logic Elements/Blocks: 2
• Number of Macrocells: 36
• Number of Gates: 800
• Number of I/O: 34
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-FBGA, CSPBGA
• Supplier Device Package: 48-CSBGA (7x7)

pacchetto: 48-FBGA, CSPBGA

XCR3256XL-10TQ144I

Xilinx Inc.

IC CPLD 256MC 9NS 144TQFP

• Programmable Type: In System Programmable (min 1K program/erase cycles)
• Delay Time tpd(1) Max: 9.1ns
• Voltage Supply - Internal: 2.7 V ~ 3.6 V
• Number of Logic Elements/Blocks: 16
• Number of Macrocells: 256
• Number of Gates: 6000
• Number of I/O: 120
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 144-LQFP
• Supplier Device Package: 144-TQFP (20x20)

pacchetto: 144-LQFP

XC9572XL-7TQ100C

Xilinx Inc.

IC CPLD 72MC 7.5NS 100TQFP

• Programmable Type: In System Programmable (min 10K program/erase cycles)
• Delay Time tpd(1) Max: 7.5ns
• Voltage Supply - Internal: 3 V ~ 3.6 V
• Number of Logic Elements/Blocks: 4
• Number of Macrocells: 72
• Number of Gates: 1600
• Number of I/O: 72
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP
• Supplier Device Package: 100-TQFP (14x14)

pacchetto: 100-LQFP