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Prodotti Xilinx Inc.

Record 7.167
Pagina  246/256
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pacchetto
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XQ17V16CK44M
Xilinx Inc.

IC MEM PROM 16MB 3.3V 44CCC

  • Programmable Type: OTP
  • Memory Size: 16Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -55°C ~ 125°C (TC)
  • Package / Case: 44-CCC (J-Lead)
  • Supplier Device Package: 44-CCCP (16.51x16.51)
pacchetto: 44-CCC (J-Lead)
Azione7.072
XCZU19EG-1FFVC1760I
Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1760-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione5.568
XCZU7EG-2FBVB900I
Xilinx Inc.

IC FPGA 204 I/O 900FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione5.040
hot XC7Z045-1FFG900I
Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7 900FBGA

  • Architecture: MCU, FPGA
  • Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 667MHz
  • Primary Attributes: Kintex?-7 FPGA, 350K Logic Cells
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
pacchetto: 900-BBGA, FCBGA
Azione5.504
XCZU2EG-1SBVA484E
Xilinx Inc.

IC FPGA 82 I/O 484FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA, FCBGA
  • Supplier Device Package: 484-FCBGA (19x19)
pacchetto: 484-BBGA, FCBGA
Azione4.032
XC2V8000-5FFG1152C
Xilinx Inc.

IC FPGA 824 I/O 1152FCBGA

  • Number of LABs/CLBs: 11648
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 3096576
  • Number of I/O: 824
  • Number of Gates: 8000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione7.856
XC2V1500-4FFG896I
Xilinx Inc.

IC FPGA 528 I/O 896FCBGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 884736
  • Number of I/O: 528
  • Number of Gates: 1500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 896-BBGA, FCBGA
  • Supplier Device Package: 896-FCBGA (31x31)
pacchetto: 896-BBGA, FCBGA
Azione4.352
hot XC4020E-4HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 784
  • Number of Logic Elements/Cells: 1862
  • Total RAM Bits: 25088
  • Number of I/O: 160
  • Number of Gates: 20000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP Exposed Pad
Azione14.376
hot XC4005XL-1PC84I
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 61
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
pacchetto: 84-LCC (J-Lead)
Azione6.708
XCVU3P-2FFVC1517E
Xilinx Inc.

IC FPGA 520 I/O 1517FCBGA

  • Number of LABs/CLBs: 49260
  • Number of Logic Elements/Cells: 862050
  • Total RAM Bits: 118067200
  • Number of I/O: 520
  • Number of Gates: -
  • Voltage - Supply: 0.825 V ~ 0.876 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione3.168
XC7VX690T-L2FFG1926E
Xilinx Inc.

IC FPGA 720 I/O 1926FCBGA

  • Number of LABs/CLBs: 54150
  • Number of Logic Elements/Cells: 693120
  • Total RAM Bits: 54190080
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1926-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione7.200
XC6VHX380T-2FF1924C
Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

  • Number of LABs/CLBs: 29880
  • Number of Logic Elements/Cells: 382464
  • Total RAM Bits: 28311552
  • Number of I/O: 640
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione6.112
hot XC7VX485T-2FFG1158C
Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

  • Number of LABs/CLBs: 37950
  • Number of Logic Elements/Cells: 485760
  • Total RAM Bits: 37969920
  • Number of I/O: 350
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1158-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione4.800
hot XC6VSX315T-1FF1156I
Xilinx Inc.

IC FPGA 600 I/O 1156FCBGA

  • Number of LABs/CLBs: 24600
  • Number of Logic Elements/Cells: 314880
  • Total RAM Bits: 25952256
  • Number of I/O: 600
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1156-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione78.384
XC7VX415T-1FFG1158C
Xilinx Inc.

IC FPGA 350 I/O 1158FCBGA

  • Number of LABs/CLBs: 32200
  • Number of Logic Elements/Cells: 412160
  • Total RAM Bits: 32440320
  • Number of I/O: 350
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1156-BBGA, FCBGA
  • Supplier Device Package: 1158-FCBGA (35x35)
pacchetto: 1156-BBGA, FCBGA
Azione2.496
XC6VCX75T-2FFG484C
Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

  • Number of LABs/CLBs: 5820
  • Number of Logic Elements/Cells: 74496
  • Total RAM Bits: 5750784
  • Number of I/O: 240
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione6.896
XC4VLX15-11FF668C
Xilinx Inc.

IC FPGA 320 I/O 668FCBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 13824
  • Total RAM Bits: 884736
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 668-BBGA, FCBGA
  • Supplier Device Package: 668-FCBGA (27x27)
pacchetto: 668-BBGA, FCBGA
Azione4.000
hot XC6SLX100T-3FGG484I
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 7911
  • Number of Logic Elements/Cells: 101261
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione7.104
XC6SLX75T-2FG676C
Xilinx Inc.

IC FPGA 348 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione7.856
hot XC3S1000-5FGG676C
Xilinx Inc.

IC FPGA 391 I/O 676FBGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: 17280
  • Total RAM Bits: 442368
  • Number of I/O: 391
  • Number of Gates: 1000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione4.112
XC3S50A-4FT256I
Xilinx Inc.

IC FPGA 144 I/O 256FTBGA

  • Number of LABs/CLBs: 176
  • Number of Logic Elements/Cells: 1584
  • Total RAM Bits: 55296
  • Number of I/O: 144
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.224
XCKU040-1FBVA676C
Xilinx Inc.

IC FPGA 312 I/O 676FCBGA

  • Number of LABs/CLBs: 30300
  • Number of Logic Elements/Cells: 530250
  • Total RAM Bits: 21606000
  • Number of I/O: 312
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 0.979 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
pacchetto: 676-BBGA, FCBGA
Azione3.936
hot XC3S1000-4FGG456C
Xilinx Inc.

IC FPGA 333 I/O 456FBGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: 17280
  • Total RAM Bits: 442368
  • Number of I/O: 333
  • Number of Gates: 1000000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione22.860
hot XC6SLX25-3FTG256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione10.380
hot XCR3032XL-7PC44I
Xilinx Inc.

IC CPLD 32MC 7NS 44PLCC

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 32
  • Number of Gates: 750
  • Number of I/O: 36
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacchetto: 44-LCC (J-Lead)
Azione7.548
hot XC9536-5CS48C
Xilinx Inc.

IC CPLD 36MC 5NS 48CSP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 4.75 V ~ 5.25 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: 34
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
pacchetto: 48-FBGA, CSPBGA
Azione4.128
hot XCR3256XL-10TQ144I
Xilinx Inc.

IC CPLD 256MC 9NS 144TQFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 120
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
pacchetto: 144-LQFP
Azione6.752
hot XC9572XL-7TQ100C
Xilinx Inc.

IC CPLD 72MC 7.5NS 100TQFP

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 7.5ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 72
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-TQFP (14x14)
pacchetto: 100-LQFP
Azione67.140