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Prodotti Xilinx Inc.

Record 7.167
Pagina  165/256
Immagine
Numero di parte
Produttore
Descrizione
pacchetto
Azione
Quantità
XC17S150AVO8I
Xilinx Inc.

IC PROM SER 150K 8-SOIC

  • Programmable Type: OTP
  • Memory Size: 1.5Mb
  • Voltage - Supply: 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-TSOP
pacchetto: 8-SOIC (0.154", 3.90mm Width)
Azione2.100
XCZU19EG-L2FFVE1924E
Xilinx Inc.

IC FPGA 668 I/O 1924FCBGA

  • Architecture: MCU, FPGA
  • Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
  • Flash Size: -
  • RAM Size: 256KB
  • Peripherals: DMA, WDT
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed: 600MHz, 1.5GHz
  • Primary Attributes: Zynq?UltraScale+? FPGA, 1143K+ Logic Cells
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
pacchetto: 1924-BBGA, FCBGA
Azione5.152
XC6SLX75T-N3FGG676I
Xilinx Inc.

IC FPGA 348 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
pacchetto: 676-BGA
Azione5.840
XC6SLX25-N3FTG256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione6.752
XC2V80-4CSG144C
Xilinx Inc.

IC FPGA 92 I/O 144CSBGA

  • Number of LABs/CLBs: 128
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 147456
  • Number of I/O: 92
  • Number of Gates: 80000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione4.096
hot XC2V1000-5FGG456I
Xilinx Inc.

IC FPGA 324 I/O 456FBGA

  • Number of LABs/CLBs: 1280
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 737280
  • Number of I/O: 324
  • Number of Gates: 1000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
pacchetto: 456-BBGA
Azione3.712
XC5VFX200T-2FF1738CES
Xilinx Inc.

IC FPGA 960 I/O 1738FCBGA

  • Number of LABs/CLBs: 15360
  • Number of Logic Elements/Cells: 196608
  • Total RAM Bits: 16809984
  • Number of I/O: 960
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1738-BBGA, FCBGA
  • Supplier Device Package: 1738-FCBGA (42.5x42.5)
pacchetto: 1738-BBGA, FCBGA
Azione4.336
hot XCV200-6BG256C
Xilinx Inc.

IC FPGA 180 I/O 256BGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 180
  • Number of Gates: 236666
  • Voltage - Supply: 2.375 V ~ 2.625 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BBGA
  • Supplier Device Package: 256-PBGA (27x27)
pacchetto: 256-BBGA
Azione7.200
XCV1000E-7HQ240C
Xilinx Inc.

IC FPGA 158 I/O 240HQFP

  • Number of LABs/CLBs: 6144
  • Number of Logic Elements/Cells: 27648
  • Total RAM Bits: 393216
  • Number of I/O: 158
  • Number of Gates: 1569178
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
pacchetto: 240-BFQFP Exposed Pad
Azione4.608
XC4052XL-1BG560I
Xilinx Inc.

IC FPGA 352 I/O 560MBGA

  • Number of LABs/CLBs: 1936
  • Number of Logic Elements/Cells: 4598
  • Total RAM Bits: 61952
  • Number of I/O: 352
  • Number of Gates: 52000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
pacchetto: 560-LBGA, Metal
Azione2.544
XC4036XL-09HQ208C
Xilinx Inc.

IC FPGA 160 I/O 208HQFP

  • Number of LABs/CLBs: 1296
  • Number of Logic Elements/Cells: 3078
  • Total RAM Bits: 41472
  • Number of I/O: 160
  • Number of Gates: 36000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 208-BFQFP Exposed Pad
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP Exposed Pad
Azione5.856
hot XC4010E-4PQ160I
Xilinx Inc.

IC FPGA 129 I/O 160QFP

  • Number of LABs/CLBs: 400
  • Number of Logic Elements/Cells: 950
  • Total RAM Bits: 12800
  • Number of I/O: 129
  • Number of Gates: 10000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 160-BQFP
  • Supplier Device Package: 160-PQFP (28x28)
pacchetto: 160-BQFP
Azione3.360
XC4005E-2PG156C
Xilinx Inc.

IC FPGA 112 I/O 156CPGA

  • Number of LABs/CLBs: 196
  • Number of Logic Elements/Cells: 466
  • Total RAM Bits: 6272
  • Number of I/O: 112
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Through Hole
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 156-BCPGA
  • Supplier Device Package: 156-CPGA (42.17x42.17)
pacchetto: 156-BCPGA
Azione5.680
hot XC6VLX240T-2FFG1759I
Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

  • Number of LABs/CLBs: 18840
  • Number of Logic Elements/Cells: 241152
  • Total RAM Bits: 15335424
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1760-BBGA, FCBGA
  • Supplier Device Package: 1759-FCBGA (42.5x42.5)
pacchetto: 1760-BBGA, FCBGA
Azione15.996
hot XC4VFX60-10FFG1152C
Xilinx Inc.

IC FPGA 576 I/O 1152FCBGA

  • Number of LABs/CLBs: 6320
  • Number of Logic Elements/Cells: 56880
  • Total RAM Bits: 4276224
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-FCBGA (35x35)
pacchetto: 1152-BBGA, FCBGA
Azione11.304
XC7A75T-2FG484I
Xilinx Inc.

IC FPGA 285 I/O 484FCBGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 285
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
pacchetto: 484-BBGA
Azione5.264
XC7A75T-L1FTG256I
Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

  • Number of LABs/CLBs: 5900
  • Number of Logic Elements/Cells: 75520
  • Total RAM Bits: 3870720
  • Number of I/O: 170
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione2.848
XC6SLX45-3CSG484I
Xilinx Inc.

IC FPGA 320 I/O 484CSBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 320
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-FBGA, CSPBGA
  • Supplier Device Package: 484-CSPBGA (19x19)
pacchetto: 484-FBGA, CSPBGA
Azione7.632
hot XA6SLX9-2FTG256Q
Xilinx Inc.

IC FPGA 186 I/O 256FTGBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione4.960
XC6SLX16-N3FTG256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
pacchetto: 256-LBGA
Azione5.008
hot XC6SLX45T-2CSG324C
Xilinx Inc.

IC FPGA 190 I/O 324CSBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 190
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 324-LFBGA, CSPBGA
  • Supplier Device Package: 324-CSPBGA (15x15)
pacchetto: 324-LFBGA, CSPBGA
Azione6.336
hot XC9572XL-10PC44I
Xilinx Inc.

IC CPLD 72MC 10NS 44PLCC

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 10.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 4
  • Number of Macrocells: 72
  • Number of Gates: 1600
  • Number of I/O: 34
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
pacchetto: 44-LCC (J-Lead)
Azione4.464
XC9536XV-5CS48C
Xilinx Inc.

IC CPLD 36MC 5NS 48CSP

  • Programmable Type: In System Programmable
  • Delay Time tpd(1) Max: 5.0ns
  • Voltage Supply - Internal: 2.37 V ~ 2.62 V
  • Number of Logic Elements/Blocks: 2
  • Number of Macrocells: 36
  • Number of Gates: 800
  • Number of I/O: -
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-FBGA, CSPBGA
  • Supplier Device Package: 48-CSBGA (7x7)
pacchetto: 48-FBGA, CSPBGA
Azione5.136
XC95216-15BG352I
Xilinx Inc.

IC CPLD 216MC 15NS 352BGA

  • Programmable Type: In System Programmable (min 10K program/erase cycles)
  • Delay Time tpd(1) Max: 15.0ns
  • Voltage Supply - Internal: 4.5 V ~ 5.5 V
  • Number of Logic Elements/Blocks: 12
  • Number of Macrocells: 216
  • Number of Gates: 4800
  • Number of I/O: 166
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 352-LBGA, Metal
  • Supplier Device Package: 352-MBGA (35x35)
pacchetto: 352-LBGA, Metal
Azione3.104
hot XCR3256XL-7PQ208C
Xilinx Inc.

IC CPLD 256MC 7NS 208QFP

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 7.0ns
  • Voltage Supply - Internal: 3 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 16
  • Number of Macrocells: 256
  • Number of Gates: 6000
  • Number of I/O: 164
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
pacchetto: 208-BFQFP
Azione3.536
XCR3128XL-10CSG144I
Xilinx Inc.

IC CPLD 128MC 9.1NS 144BGA

  • Programmable Type: In System Programmable (min 1K program/erase cycles)
  • Delay Time tpd(1) Max: 9.1ns
  • Voltage Supply - Internal: 2.7 V ~ 3.6 V
  • Number of Logic Elements/Blocks: 8
  • Number of Macrocells: 128
  • Number of Gates: 3000
  • Number of I/O: 108
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-TFBGA, CSPBGA
  • Supplier Device Package: 144-LCSBGA (12x12)
pacchetto: 144-TFBGA, CSPBGA
Azione6.512
XCVU9P-3FLGA2104E
Xilinx Inc.

XCVU9P-3FLGA2104E

  • Number of LABs/CLBs: 147780
  • Number of Logic Elements/Cells: 2586150
  • Total RAM Bits: 391168000
  • Number of I/O: 832
  • Number of Gates: -
  • Voltage - Supply: 0.873 V ~ 0.927 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 2104-BBGA, FCBGA
  • Supplier Device Package: 2104-FCBGA (47.5x47.5)
pacchetto: 2104-BBGA, FCBGA
Azione3.600
XCVU125-H1FLVD1517E
Xilinx Inc.

IC FPGA

  • Number of LABs/CLBs: 89520
  • Number of Logic Elements/Cells: 1566600
  • Total RAM Bits: 90726400
  • Number of I/O: 338
  • Number of Gates: -
  • Voltage - Supply: 0.922 V ~ 1.030 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 100°C (TJ)
  • Package / Case: 1517-BBGA, FCBGA
  • Supplier Device Package: 1517-FCBGA (40x40)
pacchetto: 1517-BBGA, FCBGA
Azione6.128