Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Logic Elements/Cells | Total RAM Bits | Number of I/O | Number of Gates | Voltage - Supply | Mounting Type | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC FPGA 804 I/O 1156FBGA
|
pacchetto: 1156-BBGA |
Azione9.468 |
|
43200 | 655360 | 804 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione5.328 |
|
43200 | 655360 | 404 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione6.064 |
|
43200 | 655360 | 404 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 660 I/O 860FBGA
|
pacchetto: 860-BGA |
Azione5.440 |
|
43200 | 655360 | 660 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 660 I/O 860FBGA
|
pacchetto: 860-BGA |
Azione3.280 |
|
43200 | 655360 | 660 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 860-BGA | 860-FBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 512 I/O 680FBGA
|
pacchetto: 680-LBGA Exposed Pad |
Azione4.976 |
|
43200 | 655360 | 512 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 512 I/O 680FBGA
|
pacchetto: 680-LBGA Exposed Pad |
Azione4.880 |
|
43200 | 655360 | 512 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 680-LBGA Exposed Pad | 680-FTEBGA (40x40) |
||
Xilinx Inc. |
IC FPGA 804 I/O 1156FBGA
|
pacchetto: 1156-BBGA |
Azione2.848 |
|
43200 | 655360 | 804 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 804 I/O 1156FBGA
|
pacchetto: 1156-BBGA |
Azione6.320 |
|
43200 | 655360 | 804 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 1156-BBGA | 1156-FBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione7.904 |
|
43200 | 655360 | 404 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | -40°C ~ 100°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 404 I/O 560MBGA
|
pacchetto: 560-LBGA, Metal |
Azione6.416 |
|
43200 | 655360 | 404 | 2541952 | 1.71 V ~ 1.89 V | Surface Mount | 0°C ~ 85°C (TJ) | 560-LBGA, Metal | 560-MBGA (42.5x42.5) |
||
Xilinx Inc. |
IC FPGA 166 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione6.608 |
|
5292 | 57344 | 166 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 284 I/O 456FBGA
|
pacchetto: 456-BBGA |
Azione6.944 |
|
5292 | 57344 | 284 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione5.648 |
|
5292 | 57344 | 176 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 260 I/O 352MBGA
|
pacchetto: 352-LBGA, Metal |
Azione6.048 |
|
5292 | 57344 | 260 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 180 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione7.200 |
|
5292 | 57344 | 180 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 166 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione7.800 |
|
5292 | 57344 | 166 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 166 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione6.832 |
|
5292 | 57344 | 166 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 284 I/O 456FBGA
|
pacchetto: 456-BBGA |
Azione3.376 |
|
5292 | 57344 | 284 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 456-BBGA | 456-FBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 284 I/O 456FBGA
|
pacchetto: 456-BBGA |
Azione3.104 |
|
5292 | 57344 | 284 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 456-BBGA | 456-FBGA (23x23) |
||
Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione5.376 |
|
5292 | 57344 | 176 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BGA | 256-FBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 176 I/O 256FBGA
|
pacchetto: 256-BGA |
Azione27.036 |
|
5292 | 57344 | 176 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BGA | 256-FBGA (17x17) |
||
Xilinx Inc. |
IC FPGA 260 I/O 352MBGA
|
pacchetto: 352-LBGA, Metal |
Azione6.288 |
|
5292 | 57344 | 260 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 260 I/O 352MBGA
|
pacchetto: 352-LBGA, Metal |
Azione4.144 |
|
5292 | 57344 | 260 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 352-LBGA, Metal | 352-MBGA (35x35) |
||
Xilinx Inc. |
IC FPGA 180 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione5.248 |
|
5292 | 57344 | 180 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 180 I/O 256BGA
|
pacchetto: 256-BBGA |
Azione7.792 |
|
5292 | 57344 | 180 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 256-BBGA | 256-PBGA (27x27) |
||
Xilinx Inc. |
IC FPGA 166 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione11.340 |
|
5292 | 57344 | 166 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | -40°C ~ 100°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |
||
Xilinx Inc. |
IC FPGA 166 I/O 240QFP
|
pacchetto: 240-BFQFP |
Azione11.184 |
|
5292 | 57344 | 166 | 236666 | 2.375 V ~ 2.625 V | Surface Mount | 0°C ~ 85°C (TJ) | 240-BFQFP | 240-PQFP (32x32) |