Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione22.854 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione19.110 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-SSOPB |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione18.642 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP-J |
||
Rohm Semiconductor |
MICROWIRE BUS 1KBIT(64X16BIT) EE
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione25.878 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione27.456 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione23.088 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione21.756 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP-BJ |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione20.202 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP-BJ |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione25.428 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione28.206 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Rohm Semiconductor |
MICROWIRE BUS 1KBIT(64X16BIT) EE
|
pacchetto: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione25.284 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Rohm Semiconductor |
MICROWIRE BUS 1KBIT(64X16BIT) EE
|
pacchetto: 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) |
Azione49.086 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-MSOP |
||
Rohm Semiconductor |
MICROWIRE BUS 4KBIT(256X16BIT) E
|
pacchetto: 8-TSSOP (0.173", 4.40mm Width) |
Azione28.104 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP-B |
||
Rohm Semiconductor |
MICROWIRE BUS 2KBIT(128X16BIT) E
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione19.188 |
|
EEPROM | EEPROM | 2Kb (256 x 8, 128 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
MICROWIRE BUS 1KBIT(64X16BIT) EE
|
pacchetto: 8-UFDFN Exposed Pad |
Azione32.436 |
|
EEPROM | EEPROM | 1Kb (64 x 16) | SPI | 3MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 8-UFDFN Exposed Pad | VSON008X2030 |
||
Rohm Semiconductor |
EEPROMS MICROWIRE SERIAL BUS, HI
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione3.360 |
|
EEPROM | EEPROM | 4Kb (256 x 16) | SPI | 2MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
EEPROM SERIAL-I2C 32K-BIT 4K X 8
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione4.736 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
I2C BUS 64KBIT(8192X8BIT) EEPROM
|
pacchetto: 8-DIP (0.300", 7.62mm) |
Azione5.520 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | - | 1.6 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 8-DIP (0.300", 7.62mm) | 8-DIP-T |
||
Rohm Semiconductor |
FERAM / 1MBIT (128KB X 8) / SPI
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.136 |
|
FRAM | FRAM (Ferroelectric RAM) | 1Mb (128K x 8) | SPI | 40MHz | - | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Rohm Semiconductor |
I2C BUS 64KBIT(8192X8BIT) EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.664 |
|
EEPROM | EEPROM | 64Kb (8K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
I2C BUS 32KBIT(4096X8BIT) EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.104 |
|
EEPROM | EEPROM | 32Kb (4K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
I2C BUS 16KBIT(2048X8BIT) EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione4.720 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
IC EEPROM 8K SPI 10MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione3.248 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
IC EEPROM 4K SPI 10MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione4.544 |
|
EEPROM | EEPROM | 4Kb (512 x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
IC EEPROM 2K SPI 10MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione3.072 |
|
EEPROM | EEPROM | 2Kb (256 x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
WL-CSP EEPROM
|
pacchetto: 4-XFBGA, CSPBGA |
Azione6.992 |
|
EEPROM | EEPROM | 16Kb (2K x 8) | I²C | 1MHz | 5ms | - | 1.7 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 4-XFBGA, CSPBGA | UCSP30L1 |
||
Rohm Semiconductor |
I2C BUS 8KBIT(1024X8BIT) EEPROM
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.536 |
|
EEPROM | EEPROM | 8Kb (1K x 8) | I²C | 400kHz | 5ms | - | 2.5 V ~ 5.5 V | -40°C ~ 105°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Rohm Semiconductor |
IC EEPROM 128K SPI 10MHZ 8SOP
|
pacchetto: 8-SOIC (0.173", 4.40mm Width) |
Azione7.332 |
|
EEPROM | EEPROM | 128Kb (16K x 8) | SPI | 10MHz | 4ms | - | 2.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |