Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC BUFF HEX ENBL N-INV 16SOEIAJ
|
pacchetto: 16-SOIC (0.209", 5.30mm Width) |
Azione43.200 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFF HEX ENBL N-INV 16SOEIAJ
|
pacchetto: 16-SOIC (0.209", 5.30mm Width) |
Azione6.528 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 16-SOIC (0.209", 5.30mm Width) | 16-SOEIAJ |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 16CDIP
|
pacchetto: 16-CDIP (0.300", 7.62mm) |
Azione13.644 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Through Hole | 16-CDIP (0.300", 7.62mm) | 16-CDIP |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione2.352 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione12.528 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione3.392 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC BUFFER HEX ENBL N-INV 20PLCC
|
pacchetto: 20-LCC (J-Lead) |
Azione4.912 |
|
1 | 6 | - | Push-Pull | - | -4.94 V ~ -5.46 V | 0°C ~ 75°C (TA) | Surface Mount | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
ON Semiconductor |
IC BUFF/DVR 9BIT N-INV 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione2.544 |
|
9 | 1 | - | Push-Pull | - | -4.2 V ~ -5.7 V | 0°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC DRIVER 9BIT ECL N-INV 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione146.640 |
|
9 | 1 | - | Push-Pull | - | -4.2 V ~ -5.7 V | 0°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC BUFF/DVR 9BIT N-INV 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione5.776 |
|
9 | 1 | - | Push-Pull | - | -4.2 V ~ -5.7 V | 0°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC DRIVER 9BIT ECL N-INV 28PLCC
|
pacchetto: 28-LCC (J-Lead) |
Azione10.128 |
|
9 | 1 | - | Push-Pull | - | -4.2 V ~ -5.7 V | 0°C ~ 85°C (TA) | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
ON Semiconductor |
IC TXRX 16BIT CMOS BIDIR 48TSSOP
|
pacchetto: 48-TFSOP (0.240", 6.10mm Width) |
Azione10.488 |
|
2 | 8 | - | Push-Pull | 24mA, 24mA | 1.65 V ~ 3.6 V | -40°C ~ 85°C (TA) | Surface Mount | 48-TFSOP (0.240", 6.10mm Width) | 48-TSSOP |
||
ON Semiconductor |
IC BUS BUFF TRI-ST QUAD 14TSSOP
|
pacchetto: 14-TSSOP (0.173", 4.40mm Width) |
Azione24.000 |
|
4 | 1 | - | Push-Pull | 8mA, 8mA | 2 V ~ 5.5 V | -55°C ~ 125°C (TA) | Surface Mount | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST DUAL 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.328 |
|
2 | 4 | - | Push-Pull | 8mA, 8mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione7.696 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUS TRANSCVR 3-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione21.408 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFF/DVR/RCVR 3ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione2.080 |
|
2 | 4 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.784 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC INVERTER 8-INPUT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione6.720 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUS TRANSCVR 3ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.688 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFF/DVR/RCVR 3ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.624 |
|
2 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC INVERTER DUAL 4-INPUT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.936 |
|
2 | 4 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFFER TRI-ST QD N-INV 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione4.512 |
|
4 | 1 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
ON Semiconductor |
IC BUFFER TRI-ST QD N-INV 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione7.600 |
|
4 | 1 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -55°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-PDIP |
||
ON Semiconductor |
IC TRANSCEIVER 3ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione2.528 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione3.344 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC TRANSCEIVER 3ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.616 |
|
1 | 8 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
ON Semiconductor |
IC BUFF/DVR TRI-ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione2.544 |
|
2 | 4 | - | Push-Pull | 24mA, 24mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |