Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ON Semiconductor |
IC CLK BUF 1:5 133.33MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione4.624 |
|
1 | 1:5 | No/No | CMOS | CMOS | 133.33MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:4 180MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione30.756 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 180MHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:4 8GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.732 |
|
1 | 1:4 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK DIVIDER 1:1 10GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione9.720 |
|
1 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 10GHz | 1.71 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLOCK BUFFER 160MHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione7.200 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 160MHz | 1.4 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
1:4 HCSL FANOUT BUFFER
|
pacchetto: 24-VFQFN Exposed Pad |
Azione7.312 |
|
1 | 1:4 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 350MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
ON Semiconductor |
1:2 HCSL FANOUT BUFFER
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.228 |
|
1 | 1:2 | Yes/Yes | HCSL, LVCMOS, LVDS, LVPECL, LVTTL | HCSL | 350MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:6 100MHZ 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione8.532 |
|
1 | 1:6 | No/No | LVCMOS, LVTTL, Crystal | LVCMOS, LVTTL | 100MHz | 1.6 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:10 5.5GHZ 52QFN
|
pacchetto: 52-VFQFN Exposed Pad |
Azione14.748 |
|
1 | 2:10 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | CML | 5.5GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 52-VFQFN Exposed Pad | 52-QFN (8x8) |
||
ON Semiconductor |
IC CLK BUFFER 1:5 3GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione8.184 |
|
2 | 1:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:3 1GHZ 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.228 |
|
2 | 1:3 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:10 3GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione20.544 |
|
1 | 2:10 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione23.832 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione498.180 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1GHz | 3 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 12GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione6.444 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL | RSECL, RSNECL, RSPECL | 12GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:5 1GHZ 32LQFP
|
pacchetto: 32-LQFP |
Azione3.808 |
|
2 | 1:5 | Yes/Yes | LVDS, LVPECL | LVDS | 1GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-LQFP | 32-LQFP (7x7) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 6GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione17.172 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | ECL | 6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 2:1 2.5GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione7.224 |
|
2 | 2:1 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione8.352 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione60.396 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | ECL, PECL | 3GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 4GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione9.660 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | LVPECL | 4GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
ON Semiconductor |
IC CLK BUFFER 1:2 1.5GHZ 8SOIC
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.232 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 1.5GHz | 4.2 V ~ 5.7 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
ON Semiconductor |
IC CLK BUFFER 1:2 6GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione4.064 |
|
1 | 1:2 | Yes/Yes | CML, LVCMOS, LVDS, LVNECL, LVPECL, LVTTL | ECL | 6GHz | 2.375 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:8 8GHZ 32QFN
|
pacchetto: 32-VFQFN Exposed Pad |
Azione4.784 |
|
1 | 1:8 | Yes/Yes | CML, LVCMOS, LVDS, LVPECL, LVTTL | CML | 8GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
ON Semiconductor |
IC CLK BUFFER 2:5 2.5GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.688 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVDS, PECL | ECL, PECL | 2.5GHz | 2.375 V ~ 3.8 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione4.112 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, PECL | ECL, PECL | 2GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione6.336 |
|
1 | 1:2 | Yes/Yes | ECL, PECL | ECL, PECL | 3GHz | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
ON Semiconductor |
IC CLK BUFFER 1:4 2GHZ 16QFN
|
pacchetto: 16-VFQFN Exposed Pad |
Azione8.100 |
|
1 | 1:4 | Yes/Yes | CML, HSCL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |