Prodotti NXP

AFT05MP075NR1

NXP

FET RF 2CH 40V 520MHZ TO270-4

• Transistor Type: LDMOS (Dual)
• Frequency: 520MHz
• Gain: 18.5dB
• Voltage - Test: 12.5V
• Current Rating: -
• Noise Figure: -
• Current - Test: 400mA
• Power - Output: 70W
• Voltage - Rated: 40V
• Package / Case: TO-270AB
• Supplier Device Package: TO-270 WB-4

pacchetto: TO-270AB

BZX284-B16,115

NXP

DIODE ZENER 16V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 16V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 20 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 11.2V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

pacchetto: SOD-110

HEF4072BT,653

NXP

IC GATE OR 2CH 4-INP 14-SO

• Logic Type: OR Gate
• Number of Circuits: 2
• Number of Inputs: 4
• Features: -
• Voltage - Supply: 3 V ~ 15 V
• Current - Quiescent (Max): 4µA
• Current - Output High, Low: 3mA, 3mA
• Logic Level - Low: 1.5 V ~ 4 V
• Logic Level - High: 3.5 V ~ 11 V
• Max Propagation Delay @ V, Max CL: 55ns @ 15V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

pacchetto: 14-SOIC (0.154", 3.90mm Width)

74LVT32D,118

NXP

IC GATE OR 4CH 2-INP 14-SO

• Logic Type: OR Gate
• Number of Circuits: 4
• Number of Inputs: 2
• Features: -
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Max): -
• Current - Output High, Low: 20mA, 32mA
• Logic Level - Low: 0.8V
• Logic Level - High: 2V
• Max Propagation Delay @ V, Max CL: 3.2ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-SO
• Package / Case: 14-SOIC (0.154", 3.90mm Width)

pacchetto: 14-SOIC (0.154", 3.90mm Width)

74ABT648D,602

NXP

IC TRANSCVR 3-ST 8BIT INV 24SOIC

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

pacchetto: 24-SOIC (0.295", 7.50mm Width)

PTN3392BS/F1,518

NXP

IC DISPLAYPORT TO VGA 48HVQFN

• Applications: Desktop, Notebook PCs
• Interface: I2C
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-HVQFN (7x7)
• Mounting Type: Surface Mount

pacchetto: 48-VFQFN Exposed Pad

UJA1023T/2R04/C;51

NXP

IC CAN/LIN I/O SLAVE 16-SOIC

• Protocol: LIN
• Function: I/O Slave
• Interface: LIN
• Standards: LIN 2.0
• Voltage - Supply: 6.5 V ~ 27 V
• Current - Supply: 45µA
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

pacchetto: 16-SOIC (0.154", 3.90mm Width)

KMPC8358EZQAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 668-BBGA Exposed Pad
• Supplier Device Package: 668-PBGA-PGE (29x29)

pacchetto: 668-BBGA Exposed Pad

MC68040RC40V

NXP

IC MPU M680X0 40MHZ 182PGA

• Core Processor: 68040
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 40MHz
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 5.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 182-BEPGA
• Supplier Device Package: 182-PGA (47.24x47.24)

pacchetto: 182-BEPGA

KMPC8275CZQMIBA

NXP

IC MPU MPC82XX 266MHZ 516BGA

• Core Processor: PowerPC G2_LE
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

pacchetto: 516-BBGA

MK60DN256VMC10

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 100
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 42x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-LFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

pacchetto: 121-LFBGA

LPC1112FHN33/101,5

NXP

IC MCU 32BIT 16KB FLASH 33HVQFN

• Core Processor: ARM? Cortex?-M0
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, WDT
• Number of I/O: 28
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-VQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (7x7)

pacchetto: 32-VQFN Exposed Pad

KMSC7118VM1200

NXP

DSP 16BIT W/DDR CTRLR 400-MAPBGA

• Type: Fixed Point
• Interface: Host Interface, I2C, UART
• Clock Rate: 300MHz
• Non-Volatile Memory: ROM (8 kB)
• On-Chip RAM: 464kB
• Voltage - I/O: 3.30V
• Voltage - Core: 1.20V
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

pacchetto: 400-LFBGA

TDA8777HL/14/C1,15

NXP

IC VIDEO DAC 10BIT TRIPLE 48LQFP

• Number of Bits: 10
• Number of D/A Converters: 3
• Settling Time: -
• Output Type: Current - Unbuffered
• Differential Output: Yes
• Data Interface: Parallel
• Reference Type: Internal
• Voltage - Supply, Analog: 3 V ~ 3.6 V
• Voltage - Supply, Digital: 3 V ~ 3.6 V
• INL/DNL (LSB): ±1.8 (Max), ±0.9 (Max)
• Architecture: String DAC
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)
• Mounting Type: -

pacchetto: 48-LQFP

PCK111BD,151

NXP

IC CLK BUFFER 2:10 1.5GHZ 32LQFP

• Type: Fanout Buffer (Distribution)
• Number of Circuits: 1
• Ratio - Input:Output: 2:10
• Differential - Input:Output: Yes/Yes
• Input: ECL, HSTL, PECL
• Output: PECL
• Frequency - Max: 1.5GHz
• Voltage - Supply: 2.25 V ~ 3.8 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacchetto: 32-LQFP

MPXM2053GST1

NXP

SENS PRESSURE 7.25 PSI MAX MPAK

• Pressure Type: Vented Gauge
• Operating Pressure: 7.25 PSI (50 kPa)
• Output Type: Wheatstone Bridge
• Output: 0 mV ~ 40 mV (10V)
• Accuracy: -0.6% ~ 0.4%
• Voltage - Supply: 10 V ~ 16 V
• Port Size: Male - 0.12" (2.97mm) Tube
• Port Style: Barbless
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 29.01 PSI (200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 5-SMD Module
• Supplier Device Package: 5-MPAK

pacchetto: 5-SMD Module

MF3D8201DUF/00V

NXP

MIFARE DESFIRE EV2

• Type: RFID Reader
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: Die
• Supplier Device Package: Die

pacchetto: Die

NT2H0301F0DTL,125

NXP

IC SMART TAG NFC TYPE 2 4HXSON

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: 4-XFDFN
• Supplier Device Package: 4-HXSON (2x1.5)

pacchetto: 4-XFDFN

MFEV700/HAB,122

NXP

KIT EVAL MIFARE RFID 13.56MHZ

• Type: Reader Module
• Frequency: 13.56MHz
• For Use With/Related Products: MFRD700
• Supplied Contents: Board

pacchetto: -

T4161NXN7QTB

NXP

QORIQ 64B POWER 16X 1.67GHZ TH

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MCIMX6L8DVN10ACR

NXP

I.MX 6SL ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (3)
• Voltage - I/O: 1.2V, 1.8V, 3.0V
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 432-TFBGA
• Supplier Device Package: 432-MAPBGA (13x13)

pacchetto: 432-TFBGA

S912XET256BCAL

NXP

16-BIT MCU S12X CORE 256KB FLA

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

pacchetto: 112-LQFP

S9S08QD4J2MSC

NXP

8-BIT MCU S08 CORE 4KB FLASH

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 16MHz
• Connectivity: -
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC

pacchetto: 8-SOIC (0.154", 3.90mm Width)

MC32PF8121F1EP

NXP

IC POWER MANAGEMENT I.MX8M MINI

• Applications: Industrial, IoT
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 5.5V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

pacchetto: 56-VFQFN Exposed Pad

MCIMX537CVP8C2

NXP

IC MPU I.MX53 800MHZ 529FBGA

• Core Processor: ARM® Cortex®-A8
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: LPDDR2, DDR2, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD, LVDS
• Ethernet: 10/100Mbps (1)
• SATA: SATA 1.5Gbps (1)
• USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
• Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
• Operating Temperature: -40°C ~ 125°C (TJ)
• Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
• Package / Case: 529-FBGA
• Supplier Device Package: 529-FBGA (19x19)

pacchetto: -

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S9S12ZVLS1AMFM

NXP

S12Z CPU, 16K FLASH

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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PTN36242LBS

NXP

CONSUMER CIRCUIT, PQCC32

• Type: -
• Applications: -
• Input: -
• Output: -
• Data Rate (Max): -
• Number of Channels: -
• Delay Time: -
• Signal Conditioning: -
• Capacitance - Input: -
• Voltage - Supply: -
• Current - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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S9S12GN48J1VLC

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacchetto: -

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