Prodotti NXP

BUK7C1R2-40EJ

NXP

MOSFET N-CH 40V 200A D2PAK-7

• FET Type: N-Channel
• Technology: MOSFET (Metal Oxide)
• Drain to Source Voltage (Vdss): 40V
• Current - Continuous Drain (Id) @ 25°C: -
• Drive Voltage (Max Rds On, Min Rds On): -
• Vgs(th) (Max) @ Id: -
• Gate Charge (Qg) (Max) @ Vgs: -
• Input Capacitance (Ciss) (Max) @ Vds: -
• Vgs (Max): -
• FET Feature: -
• Power Dissipation (Max): -
• Rds On (Max) @ Id, Vgs: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Supplier Device Package: D2PAK (7-Lead)
• Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

pacchetto: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

MRF6S19100NBR1

NXP

FET RF 68V 1.99GHZ TO272-4

• Transistor Type: LDMOS
• Frequency: 1.99GHz
• Gain: 14.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 950mA
• Power - Output: 22W
• Voltage - Rated: 68V
• Package / Case: TO-272BB
• Supplier Device Package: TO-272 WB-4

pacchetto: TO-272BB

MRF5S9150HR5

NXP

FET RF 68V 880MHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 19.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 33W
• Voltage - Rated: 68V
• Package / Case: NI-780
• Supplier Device Package: NI-780

pacchetto: NI-780

BYD17G,115

NXP

DIODE AVALANCHE 400V 1.5A MELF

• Diode Type: Avalanche
• Voltage - DC Reverse (Vr) (Max): 400V
• Current - Average Rectified (Io): 1.5A
• Voltage - Forward (Vf) (Max) @ If: 1.05V @ 1A
• Speed: Standard Recovery >500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 3µs
• Current - Reverse Leakage @ Vr: 1µA @ 400V
• Capacitance @ Vr, F: 21pF @ 0V, 1MHz
• Mounting Type: Surface Mount
• Package / Case: SOD-87
• Supplier Device Package: MELF
• Operating Temperature - Junction: -65°C ~ 175°C

pacchetto: SOD-87

TDA3681J/N2C,112

NXP

IC VOLT REG W/SW & IGNIT 17-SIL

• Applications: Ignition Buffer, Regulator
• Current - Supply: 110µA
• Voltage - Supply: 9.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 17-SIP Formed Leads
• Supplier Device Package: 17-PDBS

pacchetto: 17-SIP Formed Leads

74LVCH32244AEC/G:5

NXP

IC BUFF DVR TRI-ST 32BIT 96LFBGA

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 8
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 24mA, 24mA
• Voltage - Supply: 1.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 96-LFBGA
• Supplier Device Package: 96-LFBGA (13.5x5.5)

pacchetto: 96-LFBGA

74ABT16543BB,518

NXP

IC TRANSCVR TRI-ST 16BIT 52QFP

• Logic Type: Transceiver, Non-Inverting
• Number of Elements: 2
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 52-QFP
• Supplier Device Package: 52-QFP (10x10)

pacchetto: 52-QFP

SC16C652BIB48,128

NXP

IC ENCODER/DECODER IRDA 48LQFP

• Features: -
• Number of Channels: 2, DUART
• FIFO's: 32 Byte
• Protocol: -
• Data Rate (Max): 5Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: 48-LQFP

MCIMX257CVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: LPDDR, DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD, Touchscreen
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

pacchetto: 400-LFBGA

MCIMX253CVM4

NXP

IC MPU I.MX25 400MHZ 400MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 400MHz
• Co-Processors/DSP: -
• RAM Controllers: LPDDR, DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad
• Ethernet: 10/100 Mbps (1)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Operating Temperature: -40°C ~ 85°C (TA)
• Security Features: -
• Package / Case: 400-LFBGA
• Supplier Device Package: 400-MAPBGA (17x17)

pacchetto: 400-LFBGA

XPC850ZT66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BGA
• Supplier Device Package: 256-PBGA (23x23)

pacchetto: 256-BGA

MPC8541VTAQF

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 783-BBGA, FCBGA

MPC8540VT833LB

NXP

IC MPU MPC85XX 833MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 833MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 784-BBGA, FCBGA

SPC5748GK1MMN6

NXP

IC MCU 32BIT 6MB FLASH 324MAPBGA

• Core Processor: e200z2, e200z4, e200z4
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz/160MHz
• Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
• Peripherals: DMA, LVD, POR, WDT
• Number of I/O: 246
• Program Memory Size: 6MB (6M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 768K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 80x10b, 64x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 324-LFBGA
• Supplier Device Package: 324-MAPBGA (19x19)

pacchetto: 324-LFBGA

P80C32UFAA,512

NXP

IC MCU 8BIT ROMLESS 44PLCC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 33MHz
• Connectivity: UART/USART
• Peripherals: POR
• Number of I/O: 32
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-LCC (J-Lead)
• Supplier Device Package: 44-PLCC (16.59x16.59)

pacchetto: 44-LCC (J-Lead)

P87LPC764BDH,512

NXP

IC MCU 8BIT 4KB OTP 20TSSOP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number of I/O: 18
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: OTP
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

NE1617DS,112

NXP

SENSOR TEMPERATURE SMBUS 16SSOP

• Sensor Type: Digital, Local/Remote
• Sensing Temperature - Local: 0°C ~ 120°C
• Sensing Temperature - Remote: -55°C ~ 127°C
• Output Type: SMBus
• Voltage - Supply: 3 V ~ 5.5 V
• Resolution: 7 b
• Features: One-Shot, Output Switch, Programmable Limit, Standby Mode
• Accuracy - Highest (Lowest): ±2°C (±3°C)
• Test Condition: 60°C ~ 100°C (0°C ~ 125°C)
• Operating Temperature: 0°C ~ 120°C
• Mounting Type: Surface Mount
• Package / Case: 16-SSOP (0.154", 3.90mm Width)
• Supplier Device Package: 16-SSOP

pacchetto: 16-SSOP (0.154", 3.90mm Width)

MPXV7025DP

NXP

PRESSURE SENSOR DUAL PORT 8-SOP

• Pressure Type: Differential
• Operating Pressure: ±3.63 PSI (±25 kPa)
• Output Type: Analog Voltage
• Output: 0.2 V ~ 4.7 V
• Accuracy: ±5%
• Voltage - Supply: 4.75 V ~ 5.25 V
• Port Size: Male - 0.13" (3.3mm) Tube, Dual
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: ±29.01 PSI (±200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD Module
• Supplier Device Package: -

pacchetto: 8-SMD Module

MF0MOU2001DA4,118

NXP

IC MIFARE ULTRALIGHT FCP PLLMC

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443, MIFARE, NFC
• Interface: -
• Voltage - Supply: -
• Operating Temperature: -25°C ~ 70°C
• Package / Case: MOA4, Smart Card Module
• Supplier Device Package: PLLMC

pacchetto: MOA4, Smart Card Module

BGU8H1X

NXP

IC AMP LNA 5V 2500MHZ

• Frequency: 2.3GHz ~ 2.7GHz
• P1dB: -3dBm
• Gain: 13dB
• Noise Figure: 0.9dB
• RF Type: LTE, WiMax
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 5mA
• Test Frequency: 2.3GHz
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT1232 (1.1x0.7)

pacchetto: 6-XFDFN

TFA9872CUK/N1Z

NXP

3.6W/8OHM PDM I/O SPEAKER DRIVER

• Type: Class D
• Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
• Max Output Power x Channels @ Load: 5.1W x 1 @ 8 Ohm; 5.9W x 2 @ 6 Ohm
• Voltage - Supply: 1.65 V ~ 1.95 V
• Features: Depop, I²C, I²S, Mute, PWM, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 42-WLSCP (3.13x2.46)
• Package / Case: 42-UFBGA, WLCSP

pacchetto: 42-UFBGA, WLCSP

SPC5668GAVMG

NXP

NXP 32-BIT MCU POWER ARCH 2MB

• Core Processor: e200z650
• Core Size: 32-Bit
• Speed: 116MHz
• Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 155
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 592K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
• Data Converters: A/D 36x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

pacchetto: 208-BGA

SAF7751HV-N208W-KK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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TJA1042T-3-1U

NXP

IC TRANSCEIVER HALF 1/1 8SO

• Type: Transceiver
• Protocol: CANbus
• Number of Drivers/Receivers: 1/1
• Duplex: Half
• Receiver Hysteresis: 120 mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.5V ~ 5.5V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

pacchetto: -

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MC33772CTA1AER2

NXP

BATTERY CELL CONTROLLER, ADVANCE

• Function: Battery Cell Controller
• Battery Chemistry: Lithium Ion
• Number of Cells: 3 ~ 6
• Fault Protection: Over/Under Voltage
• Interface: I2C, SPI
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

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SAF4000EL-101S47AY

NXP

SOFTWARE DEFINED RADIO

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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MC33FS6600M2KSR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: -
• Current - Supply: -
• Voltage - Supply: 2.7V ~ 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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FD32K116LFT0MFMT

NXP

IC

• Core Processor: -
• Core Size: -
• Speed: -
• Connectivity: -
• Peripherals: -
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: -
• EEPROM Size: -
• RAM Size: -
• Voltage - Supply (Vcc/Vdd): -
• Data Converters: -
• Oscillator Type: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

Request a Quote