Prodotti NXP

BFR92A,235

NXP

TRANS NPN 15V 25MA 5GHZ SOT23

• Transistor Type: NPN
• Voltage - Collector Emitter Breakdown (Max): 15V
• Frequency - Transition: 5GHz
• Noise Figure (dB Typ @ f): 2.1dB ~ 3dB @ 1GHz ~ 2GHz
• Gain: -
• Power - Max: 300mW
• DC Current Gain (hFE) (Min) @ Ic, Vce: 65 @ 15mA, 10V
• Current - Collector (Ic) (Max): 25mA
• Operating Temperature: 175°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacchetto: TO-236-3, SC-59, SOT-23-3

TDA3602/N3,112

NXP

IC REG LIN 8.5V/5V/5V 9SIL MPF

• Output Configuration: Positive
• Output Type: Fixed
• Number of Regulators: 3
• Voltage - Input (Max): 18V
• Voltage - Output (Min/Fixed): 8.5V, 5V, 5V
• Voltage - Output (Max): -
• Voltage Dropout (Max): 0.4V @ 250mA, 1.2V @ 140mA (Typ), 0.4V @ 50mA
• Current - Output: 250mA, 140mA, 50mA
• Current - Quiescent (Iq): -
• Current - Supply (Max): 360µA
• PSRR: 60dB (200Hz)
• Control Features: Reset
• Protection Features: Load Dump, Over Current, Over Temperature, Reverse Polarity, Short Circuit
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: 9-SIP Exposed Tab
• Supplier Device Package: 9-SIL MPF

pacchetto: 9-SIP Exposed Tab

DC6M501X6/15S,135

NXP

IC REG BCK 1.5V 0.5A SYNC 6WLCSP

• Function: Step-Down
• Output Configuration: Positive
• Topology: Buck
• Output Type: Fixed
• Number of Outputs: 1
• Voltage - Input (Min): 2.3V
• Voltage - Input (Max): 5.5V
• Voltage - Output (Min/Fixed): 1.5V
• Voltage - Output (Max): -
• Current - Output: 500mA
• Frequency - Switching: 6MHz
• Synchronous Rectifier: Yes
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 6-XFBGA, WLCSP
• Supplier Device Package: 6-WLCSP (1.36x0.96)

pacchetto: 6-XFBGA, WLCSP

TEA1716T/1,518

NXP

IC CTLR PFC/HBC 24SOIC

• Mode: Discontinuous Conduction (DCM)
• Frequency - Switching: -
• Current - Startup: -
• Voltage - Supply: 70 ~ 276 VAC
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

pacchetto: 24-SOIC (0.295", 7.50mm Width)

MC33887PNB

NXP

IC MOTOR DRIVER PAR 36PQFN

• Motor Type - Stepper: -
• Motor Type - AC, DC: Brushed DC
• Function: Driver - Fully Integrated, Control and Power Stage
• Output Configuration: Half Bridge (2)
• Interface: Parallel
• Technology: Power MOSFET
• Step Resolution: -
• Applications: General Purpose
• Current - Output: 5A
• Voltage - Supply: 5 V ~ 28 V
• Voltage - Load: 5 V ~ 28 V
• Operating Temperature: -40°C ~ 150°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 36-PowerQFN
• Supplier Device Package: 36-PWR QFN (9x9)

pacchetto: 36-PowerQFN

PCA9620U/5GA/Q1,01

NXP

IC LCD SEGMENT DVR 60X8 WAFER

• Display Type: LCD
• Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
• Interface: I2C, 2-Wire Serial
• Digits or Characters: 30 Characters, 60 Characters, 480 Elements
• Current - Supply: 250µA
• Voltage - Supply: 2.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: -
• Package / Case: Die
• Supplier Device Package: Die

pacchetto: Die

74HC221D,652

NXP

IC MULTIVIBRATR DUAL MONO 16SOIC

• Logic Type: Monostable
• Independent Circuits: 2
• Schmitt Trigger Input: Yes
• Propagation Delay: 19ns
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO

pacchetto: 16-SOIC (0.154", 3.90mm Width)

TDA8034T/C1,112

NXP

IC SMART CARD INTERFACE 16SOIC

• Applications: -
• Interface: Analog
• Voltage - Supply: 3V, 5V
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 16-SO
• Mounting Type: Surface Mount

pacchetto: 16-SOIC (0.154", 3.90mm Width)

MC8641VU1250HC

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

pacchetto: 994-BCBGA, FCCBGA

S912ZVML12F1MKH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CAN, LIN, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 42
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP EP (10x10)

pacchetto: 64-LQFP Exposed Pad

MCF5232CVM100J

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
• Peripherals: DMA, WDT
• Number of I/O: 97
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
• Data Converters: -
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 196-LBGA
• Supplier Device Package: 196-MAPBGA (15x15)

pacchetto: 196-LBGA

MC9S12DJ128MFUE

NXP

IC MCU 16BIT 128KB FLASH 80QFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 59
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 80-QFP
• Supplier Device Package: 80-QFP (14x14)

pacchetto: 80-QFP

MC908GP16CBE

NXP

IC MCU 8BIT 16KB FLASH 42PSDIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 31
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 42-SDIP (0.600", 15.24mm)
• Supplier Device Package: 42-PSDIP

pacchetto: 42-SDIP (0.600", 15.24mm)

MPC5554MZP132R2

NXP

IC MCU 32BIT 2MB FLASH 416BGA

• Core Processor: e200z6
• Core Size: 32-Bit
• Speed: 132MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 256
• Program Memory Size: 2MB (2M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 1.35 V ~ 1.65 V
• Data Converters: A/D 40x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 416-BBGA
• Supplier Device Package: 416-PBGA (27x27)

pacchetto: 416-BBGA

MVF60NN152CMK50

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

• Core Processor: ARM? Cortex?-A5 + Cortex?-M4
• Core Size: 32-Bit Dual-Core
• Speed: 500MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
• Peripherals: DMA, LVD, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 1.5MB
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D Dual x 12b, D/A Dual x 12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

LPC1833JET256,551

NXP

IC MCU 32BIT 512KB FLASH 256LBGA

• Core Processor: ARM? Cortex?-M3
• Core Size: 32-Bit
• Speed: 180MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
• Number of I/O: 164
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 16K x 8
• RAM Size: 136K x 8
• Voltage - Supply (Vcc/Vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 256-LBGA
• Supplier Device Package: 256-LBGA (17x17)

pacchetto: 256-LBGA

MCF51AC128ACFUE

NXP

IC MCU 32BIT 128KB FLASH 64QFP

• Core Processor: Coldfire V1
• Core Size: 32-Bit
• Speed: 50MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: LVD, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 32K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 20x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 64-QFP
• Supplier Device Package: 64-QFP (14x14)

pacchetto: 64-QFP

MC9RS08KA1CDB

NXP

IC MCU 8BIT 1KB FLASH 6QFN

• Core Processor: RS08
• Core Size: 8-Bit
• Speed: 10MHz
• Connectivity: -
• Peripherals: LVD, POR, WDT
• Number of I/O: 2
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 63 x 8
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 6-VDFN Exposed Pad
• Supplier Device Package: 6-QFN-EP (3x3)

pacchetto: 6-VDFN Exposed Pad

MM912IP812AMAF

NXP

IC DRVR INJECTOR/IGN 100LQFP

• Applications: Engine Control
• Core Processor: S12P
• Program Memory Type: FLASH (96 KB)
• Controller Series: HCS12
• RAM Size: 6K x 8
• Interface: CAN, SCI, SPI
• Number of I/O: 8
• Voltage - Supply: 4.7 V ~ 36 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 100-LQFP Exposed Pad
• Supplier Device Package: 100-LQFP-EP (14x14)

pacchetto: 100-LQFP Exposed Pad

MPC961PFA

NXP

IC ZDB PECL LV 1:18 32-LQFP

• Type: Fanout Buffer (Distribution), Zero Delay Buffer
• PLL: Yes
• Input: LVPECL
• Output: LVCMOS
• Number of Circuits: 1
• Ratio - Input:Output: 1:17
• Differential - Input:Output: Yes/No
• Frequency - Max: 200MHz
• Divider/Multiplier: No/No
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacchetto: 32-LQFP

BGU8010,115

NXP

IC MMIC LNA XSON6

• Frequency: 1.559GHz ~ 1.61GHz
• P1dB: -9dBm
• Gain: 16.1dB
• Noise Figure: 0.85dB
• RF Type: GPS/GNSS
• Voltage - Supply: 1.5 V ~ 3.1 V
• Current - Supply: 5mA
• Test Frequency: 1.575GHz
• Package / Case: 6-XFDFN
• Supplier Device Package: 6-XSON, SOT1230 (1.1x0.9)

pacchetto: 6-XFDFN

BGA7124,118

NXP

IC MMIC DRIVER AMP 1STAGE 8HVSON

• Frequency: 400MHz ~ 2.7GHz
• P1dB: 25dBm (316.2mW)
• Gain: 16dB
• Noise Figure: 5.4dB
• RF Type: ISM
• Voltage - Supply: 3.3V, 5V
• Current - Supply: 150mA
• Test Frequency: 2.4GHz
• Package / Case: 8-VFDFN Exposed Pad
• Supplier Device Package: 8-HVSON (3x3)

pacchetto: 8-VFDFN Exposed Pad

TFA9892AUK/N1BZ

NXP

12 V SMART POWER AMPLIFIER

• Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power x Channels @ Load: 6.6W x 1 @ 8 Ohm
• Voltage - Supply: 2.7 V ~ 5.5 V
• Features: Depop, Short-Circuit and Thermal Protection
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Supplier Device Package: 49-WLCSP (3.63x3.13)
• Package / Case: 49-UFBGA, WLCSP

pacchetto: 49-UFBGA, WLCSP

SAF7755HV/N205Y

NXP

DSP AUDIO MULTI-TUNER

• Type: Audio, Car Signal Processor
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 176-LQFP Exposed Pad
• Supplier Device Package: 176-HLQFP (24x24)

pacchetto: 176-LQFP Exposed Pad

MIMXRT1165XVM5A

NXP

IC MCU 32BIT EXT MEM 289LFBGA

• Core Processor: ARM® Cortex®-M4/M7
• Core Size: 32-Bit Dual-Core
• Speed: 240MHz, 500MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: -
• Program Memory Type: External Program Memory
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
• Data Converters: A/D 2x12b; D/A 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 289-LFBGA
• Supplier Device Package: 289-LFBGA (14x14)

pacchetto: -

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S9S12GA48J0MLF

NXP

IC MCU 16BIT 48KB FLASH 48LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 40
• Program Memory Size: 48KB (48K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 1.5K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: -

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TEF5000EL-V1K

NXP

IC

• Type: -
• Protocol: -
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: -
• Data Rate: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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MF0ULH3101DUDV

NXP

MF0ULH3101DUDV

• Applications: -
• Core Processor: -
• Program Memory Type: -
• Controller Series: -
• RAM Size: -
• Interface: -
• Number of I/O: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

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