Pagina 749 - Prodotti NXP | Heisener Electronics

Numero di parte	Produttore	Descrizione	pacchetto	Azione
BUK951R8-40EQ	NXP	MOSFET N-CH 40V TO-220AB FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 40V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Through Hole Supplier Device Package: TO-220AB Package / Case: TO-220-3	pacchetto: TO-220-3	Azione6.608
BB207,215	NXP	DIODE FM VAR CAP 15V SOT-23 Capacitance @ Vr, F: 26.3pF @ 8V, 1MHz Capacitance Ratio: 3.3 Capacitance Ratio Condition: C1/C7.5 Voltage - Peak Reverse (Max): 15V Diode Type: 1 Pair Common Cathode Q @ Vr, F: - Operating Temperature: -55°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	pacchetto: TO-236-3, SC-59, SOT-23-3	Azione2.304
1PS75SB45,135	NXP	DIODE ARRAY SCHOTTKY 40V SC75 Diode Configuration: 1 Pair Common Cathode Diode Type: Schottky Voltage - DC Reverse (Vr) (Max): 40V Current - Average Rectified (Io) (per Diode): 120mA (DC) Voltage - Forward (Vf) (Max) @ If: 1V @ 40mA Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): - Current - Reverse Leakage @ Vr: 10µA @ 40V Operating Temperature - Junction: 150°C (Max) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	pacchetto: SC-75, SOT-416	Azione5.792
74AHC240D-Q100J	NXP	IC BUFFER/LINE DVR OCT 20SOIC Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 2 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	pacchetto: 20-SOIC (0.295", 7.50mm Width)	Azione6.192
PC33661PEF	NXP	ENHANCED LIN INTERFACE 8SOIC Applications: - Interface: - Voltage - Supply: - Package / Case: - Supplier Device Package: - Mounting Type: -	pacchetto: -	Azione7.696
PCA82C250T/N4,118	NXP	IC CAN TRANSCEIVER 5V HS 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 150mV Data Rate: - Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	pacchetto: 8-SOIC (0.154", 3.90mm Width)	Azione19.860
MCZ33897TEF	NXP	IC TXRX SGL WIRE CAN 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 500mV Data Rate: 83.33Kbps Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SOIC	pacchetto: 14-SOIC (0.154", 3.90mm Width)	Azione5.712
MPC8544ECVTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	pacchetto: 783-BBGA, FCBGA	Azione5.952
MPC8358ZUADDEA	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	pacchetto: 740-LBGA	Azione4.032
MPC8360ZUAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	pacchetto: 740-LBGA	Azione2.848
MPC8343CZQADD	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	pacchetto: 620-BBGA Exposed Pad	Azione3.280
MC68306CEH16B	NXP	IC MPU M683XX 16MHZ 132QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	pacchetto: 132-BQFP Bumpered	Azione5.728
MC7447AVS733NB	NXP	IC MPU MPC74XX 733MHZ 360FCCLGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 733MHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25x25)	pacchetto: 360-CLGA, FCCLGA	Azione7.152
MC68360AI25VL	NXP	IC MPU M683XX 25MHZ 240FQFP Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 240-BFQFP Supplier Device Package: 240-FQFP (32x32)	pacchetto: 240-BFQFP	Azione3.424
SPC5646CF0MLU1	NXP	IC MCU 32BIT 3MB FLASH 176LQFP Core Processor: e200z4d, e200z0h Core Size: 32-Bit Dual-Core Speed: 80MHz/120MHz Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 147 Program Memory Size: 3MB (3M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x10b/12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	pacchetto: 176-LQFP	Azione5.280
MC9S08AC60MFJE	NXP	IC MCU 8BIT 60KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	pacchetto: 32-LQFP	Azione6.048
MC9S08SH8MTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	pacchetto: 16-TSSOP (0.173", 4.40mm Width)	Azione7.884
MMA6823ALKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: ±50g Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	pacchetto: 16-QFN Exposed Pad	Azione2.160
MMA2206KEG	NXP	ACCELEROMETER 80G ANALOG 16SOIC Type: Analog Axis: X Acceleration Range: ±80g Sensitivity (LSB/g): - Sensitivity (mV/g): 20 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	pacchetto: 16-SOIC (0.295", 7.50mm Width)	Azione5.976
HTMS1301FTK/AF,115	NXP	RFID HITAG TRANSPONDER 2HVSON Style: Encapsulated Technology: Passive Frequency: 100kHz ~ 150kHz Memory Type: Read/Write Writable Memory: 1.76kb (User) Standards: ISO 11784, ISO 11785 Operating Temperature: - Size / Dimension: 1.45mm x 1.00mm x 0.50mm	pacchetto: -	Azione6.120
TJA1044VTKZ	NXP	IC TRANSCEIVER HALF 1/1 8HVSON Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 300mV Data Rate: 5Mbps Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Supplier Device Package: 8-HVSON (3x3)	pacchetto: 8-VDFN Exposed Pad	Azione3.616
MC908QVY4CDWER	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 14 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	pacchetto: -	Request a Quote
MIMXRT1175CVM8A	NXP	IC MCU 32BIT EXT MEM 289MAPBGA Core Processor: ARM® Cortex®-M4, Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 400MHz, 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Number of I/O: 13 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 2M x 8 Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	pacchetto: -	Request a Quote
MRF24G300HS-2UP	NXP	RF MOSFET GAN 48V NI780 Transistor Type: GaN Frequency: 2.4GHz ~ 2.5GHz Gain: 15.3dB Voltage - Test: 48 V Current Rating: - Noise Figure: - Current - Test: - Power - Output: 336W Voltage - Rated: 125 V Package / Case: NI-780S-4L Supplier Device Package: NI-780S-4L	pacchetto: -	Azione6
S9S12G96AVLHR	NXP	IC MCU 16BIT 96KB FLASH 64LQFP Core Processor: CPU12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	pacchetto: -	Request a Quote
S912ZVL64ACLF	NXP	S12Z CPU, 64K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	pacchetto: -	Request a Quote
FS32K116LIT0MFMR	NXP	IC MCU 32BIT 128MB FLASH 32VFQFN Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Number of I/O: 43 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 17K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	pacchetto: -	Request a Quote
SAF7755HV-N205W-SY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	pacchetto: -	Request a Quote

BUK951R8-40EQ

NXP

MOSFET N-CH 40V TO-220AB

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 40V
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Through Hole
Supplier Device Package: TO-220AB
Package / Case: TO-220-3

pacchetto: TO-220-3

Azione6.608

BB207,215

NXP

DIODE FM VAR CAP 15V SOT-23

Capacitance @ Vr, F: 26.3pF @ 8V, 1MHz
Capacitance Ratio: 3.3
Capacitance Ratio Condition: C1/C7.5
Voltage - Peak Reverse (Max): 15V
Diode Type: 1 Pair Common Cathode
Q @ Vr, F: -
Operating Temperature: -55°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

pacchetto: TO-236-3, SC-59, SOT-23-3

Azione2.304

1PS75SB45,135

NXP

DIODE ARRAY SCHOTTKY 40V SC75

Diode Configuration: 1 Pair Common Cathode
Diode Type: Schottky
Voltage - DC Reverse (Vr) (Max): 40V
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1V @ 40mA
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): -
Current - Reverse Leakage @ Vr: 10µA @ 40V
Operating Temperature - Junction: 150°C (Max)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

pacchetto: SC-75, SOT-416

Azione5.792

74AHC240D-Q100J

NXP

IC BUFFER/LINE DVR OCT 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 2 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

pacchetto: 20-SOIC (0.295", 7.50mm Width)

Azione6.192

PC33661PEF

NXP

ENHANCED LIN INTERFACE 8SOIC

Applications: -
Interface: -
Voltage - Supply: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

pacchetto: -

Azione7.696

PCA82C250T/N4,118

NXP

IC CAN TRANSCEIVER 5V HS 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 150mV
Data Rate: -
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

pacchetto: 8-SOIC (0.154", 3.90mm Width)

Azione19.860

MCZ33897TEF

NXP

IC TXRX SGL WIRE CAN 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 500mV
Data Rate: 83.33Kbps
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SOIC

pacchetto: 14-SOIC (0.154", 3.90mm Width)

Azione5.712

MPC8544ECVTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 783-BBGA, FCBGA

Azione5.952

MPC8358ZUADDEA

NXP

IC MPU MPC83XX 266MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

pacchetto: 740-LBGA

Azione4.032

MPC8360ZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

pacchetto: 740-LBGA

Azione2.848

MPC8343CZQADD

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

pacchetto: 620-BBGA Exposed Pad

Azione3.280

MC68306CEH16B

NXP

IC MPU M683XX 16MHZ 132QFP

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 16MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

pacchetto: 132-BQFP Bumpered

Azione5.728

MC7447AVS733NB

NXP

IC MPU MPC74XX 733MHZ 360FCCLGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 733MHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CLGA, FCCLGA
Supplier Device Package: 360-FCCLGA (25x25)

pacchetto: 360-CLGA, FCCLGA

Azione7.152

MC68360AI25VL

NXP

IC MPU M683XX 25MHZ 240FQFP

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 240-BFQFP
Supplier Device Package: 240-FQFP (32x32)

pacchetto: 240-BFQFP

Azione3.424

SPC5646CF0MLU1

NXP

IC MCU 32BIT 3MB FLASH 176LQFP

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b/12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

pacchetto: 176-LQFP

Azione5.280

MC9S08AC60MFJE

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

pacchetto: 32-LQFP

Azione6.048

MC9S08SH8MTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

pacchetto: 16-TSSOP (0.173", 4.40mm Width)

Azione7.884

MMA6823ALKGWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: ±50g
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

pacchetto: 16-QFN Exposed Pad

Azione2.160

MMA2206KEG

NXP

ACCELEROMETER 80G ANALOG 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±80g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 20
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

pacchetto: 16-SOIC (0.295", 7.50mm Width)

Azione5.976

HTMS1301FTK/AF,115

NXP

RFID HITAG TRANSPONDER 2HVSON

Style: Encapsulated
Technology: Passive
Frequency: 100kHz ~ 150kHz
Memory Type: Read/Write
Writable Memory: 1.76kb (User)
Standards: ISO 11784, ISO 11785
Operating Temperature: -
Size / Dimension: 1.45mm x 1.00mm x 0.50mm

pacchetto: -

Azione6.120

TJA1044VTKZ

NXP

IC TRANSCEIVER HALF 1/1 8HVSON

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 300mV
Data Rate: 5Mbps
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Supplier Device Package: 8-HVSON (3x3)

pacchetto: 8-VDFN Exposed Pad

Azione3.616

MC908QVY4CDWER

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 14
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

pacchetto: -

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MIMXRT1175CVM8A

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

Core Processor: ARM® Cortex®-M4, Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 400MHz, 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 13
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 2M x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters: A/D 20x12b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Supplier Device Package: 289-LFBGA (14x14)

pacchetto: -

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MRF24G300HS-2UP

NXP

RF MOSFET GAN 48V NI780

Transistor Type: GaN
Frequency: 2.4GHz ~ 2.5GHz
Gain: 15.3dB
Voltage - Test: 48 V
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: 336W
Voltage - Rated: 125 V
Package / Case: NI-780S-4L
Supplier Device Package: NI-780S-4L

pacchetto: -

Azione6

S9S12G96AVLHR

NXP

IC MCU 16BIT 96KB FLASH 64LQFP

Core Processor: CPU12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

pacchetto: -

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S912ZVL64ACLF

NXP

S12Z CPU, 64K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

pacchetto: -

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FS32K116LIT0MFMR

NXP

IC MCU 32BIT 128MB FLASH 32VFQFN

Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O: 43
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 17K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 13x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

pacchetto: -

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SAF7755HV-N205W-SY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

pacchetto: -

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