Prodotti NXP

MRFE6VS25GNR1

NXP

FET RF 133V 512MHZ TO-270-2

• Transistor Type: LDMOS
• Frequency: 512MHz
• Gain: 25.4dB
• Voltage - Test: 50V
• Current Rating: -
• Noise Figure: -
• Current - Test: 10mA
• Power - Output: 25W
• Voltage - Rated: 133V
• Package / Case: TO-270-2 Gull Wing
• Supplier Device Package: TO-270-2 GULL

pacchetto: TO-270-2 Gull Wing

BF511,215

NXP

JFET N-CH 20V 30MA SOT23

• Transistor Type: N-Channel JFET
• Frequency: 100MHz
• Gain: -
• Voltage - Test: 10V
• Current Rating: 30mA
• Noise Figure: 1.5dB
• Current - Test: 5mA
• Power - Output: -
• Voltage - Rated: 20V
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacchetto: TO-236-3, SC-59, SOT-23-3

PDTA115ES,126

NXP

TRANS PREBIAS PNP 500MW TO92-3

• Transistor Type: PNP - Pre-Biased
• Current - Collector (Ic) (Max): 20mA
• Voltage - Collector Emitter Breakdown (Max): 50V
• Resistor - Base (R1) (Ohms): 100k
• Resistor - Emitter Base (R2) (Ohms): 100k
• DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
• Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
• Current - Collector Cutoff (Max): 1µA
• Frequency - Transition: -
• Power - Max: 500mW
• Mounting Type: Through Hole
• Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
• Supplier Device Package: TO-92-3

pacchetto: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

74LVC11PW/AUJ

NXP

IC GATE AND 3CH 3-INP 14-TSSOP

• Logic Type: AND Gate
• Number of Circuits: 3
• Number of Inputs: 3
• Features: -
• Voltage - Supply: 1.65 V ~ 3.6 V
• Current - Quiescent (Max): 10µA
• Current - Output High, Low: 24mA, 24mA
• Logic Level - Low: 0.12 V ~ 0.8 V
• Logic Level - High: 1.08 V ~ 2 V
• Max Propagation Delay @ V, Max CL: 6.2ns @ 3.3V, 50pF
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Supplier Device Package: 14-TSSOP
• Package / Case: 14-TSSOP (0.173", 4.40mm Width)

pacchetto: 14-TSSOP (0.173", 4.40mm Width)

74LVTH574PW,118

NXP

IC D-TYPE POS TRG SNGL 20TSSOP

• Function: Standard
• Type: D-Type
• Output Type: Tri-State, Non-Inverted
• Number of Elements: 1
• Number of Bits per Element: 8
• Clock Frequency: 150MHz
• Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
• Trigger Type: Positive Edge
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Current - Quiescent (Iq): 190µA
• Input Capacitance: 4pF
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

74LVT16244BBQ,518

NXP

IC BUFFER/DVR 16BIT 3ST 60HUQFN

• Logic Type: Buffer, Non-Inverting
• Number of Elements: 4
• Number of Bits per Element: 4
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 60-UFQFN Dual Rows, Exposed Pad
• Supplier Device Package: 60-HUQFN (4x6)

pacchetto: 60-UFQFN Dual Rows, Exposed Pad

NX5DV4885EHF,115

NXP

IC VGA SWITCH 1OF2 DUAL 24HVQFN

• Type: VGA
• Applications: Notebook Computer
• Mounting Type: Surface Mount
• Package / Case: 24-VFQFN Exposed Pad
• Supplier Device Package: 24-HVQFN (4x4)

pacchetto: 24-VFQFN Exposed Pad

SC28L202A1DGG,129

NXP

IC DUART 3.3V-5.0V 56-TSSOP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 1, UART
• FIFO's: 256 Byte
• Protocol: RS485
• Data Rate (Max): 3.125Mbps
• Voltage - Supply: 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 56-TFSOP (0.240", 6.10mm Width)
• Supplier Device Package: 56-TSSOP

pacchetto: 56-TFSOP (0.240", 6.10mm Width)

MCZ33993EWR2

NXP

IC MULTIPLE SWITCH DETECT 32SOIC

• Applications: -
• Interface: SPI
• Voltage - Supply: 5.5 V ~ 26 V
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Mounting Type: Surface Mount

pacchetto: 32-SOIC (0.295", 7.50mm Width)

PCA9541APW/03,112

NXP

IC I2C 2:1 SELECTOR 16-TSSOP

• Applications: 2-Channel I2C Multiplexer
• Interface: I2C, SMBus
• Voltage - Supply: 2.3 V ~ 5.5 V
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP
• Mounting Type: Surface Mount

pacchetto: 16-TSSOP (0.173", 4.40mm Width)

MPC8533VTALFA

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500v2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 783-BBGA, FCBGA

MPC8545VUANG

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 800MHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 783-BBGA, FCBGA

MPC8347EVVAJF

NXP

IC MPU MPC83XX 533MHZ 672TBGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 533MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 672-LBGA
• Supplier Device Package: 672-TBGA (35x35)

pacchetto: 672-LBGA

P89V660FBC,557

NXP

IC MCU 8BIT 16KB FLASH 44TQFP

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 36
• Program Memory Size: 16KB (16K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 44-TQFP
• Supplier Device Package: 44-TQFP (10x10)

pacchetto: 44-TQFP

SPC5516EAVMG80

NXP

IC MCU 32BIT 1MB FLASH 208MAPBGA

• Core Processor: e200z0, e200z1
• Core Size: 32-Bit Dual-Core
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 144
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 208-BGA
• Supplier Device Package: 208-MAPBGA (17x17)

pacchetto: 208-BGA

SPC5634MF2MLQ80

NXP

IC MCU 32BIT 1.5MB FLASH 144LQFP

• Core Processor: e200z3
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: CAN, EBI/EMI, LIN, SCI, SPI, UART/USART
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 80
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 94K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacchetto: 144-LQFP

LPC2460FBD208,551

NXP

IC MCU 32BIT ROMLESS 208LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
• Number of I/O: 160
• Program Memory Size: -
• Program Memory Type: ROMless
• EEPROM Size: -
• RAM Size: 96K x 8
• Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 208-LQFP
• Supplier Device Package: 208-LQFP (28x28)

pacchetto: 208-LQFP

S9S08SG8E2MTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 40MHz
• Connectivity: I2C, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 16
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 20-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 20-TSSOP

pacchetto: 20-TSSOP (0.173", 4.40mm Width)

PCA8565BS/1,118

NXP

IC RTC CLK/CALENDAR I2C 10-HVSON

• Type: Clock/Calendar
• Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
• Memory Size: -
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I2C, 2-Wire Serial
• Voltage - Supply: 1.8 V ~ 5.5 V
• Voltage - Supply, Battery: -
• Current - Timekeeping (Max): 1.2µA ~ 5µA @ 2V ~ 5V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-VFDFN Exposed Pad
• Supplier Device Package: 10-HVSON (3x3)

pacchetto: 10-VFDFN Exposed Pad

NT3H2211W0FHKH

NXP

IC RFID NFC 13.56MHZ 8XQFN

• Type: RFID Transponder
• Frequency: 13.56MHz
• Standards: ISO 14443
• Interface: I2C
• Voltage - Supply: 3.6V
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-XFQFN Exposed Pad
• Supplier Device Package: 8-XQFN (1.6x1.6)

pacchetto: 8-XFQFN Exposed Pad

MC35FS6503NAE

NXP

FS6500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: 48-LQFP Exposed Pad

MC33PF3000A0ES

NXP

POWER MANAGEMENT IC I.MX7 PRE-

• Applications: i.MX Processors
• Current - Supply: -
• Voltage - Supply: 2.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 105°C
• Mounting Type: Surface Mount
• Package / Case: 48-VFQFN Exposed Pad
• Supplier Device Package: 48-QFN (7x7)

pacchetto: 48-VFQFN Exposed Pad

MC17XS6500BEKR2

NXP

HIGH-SIDE SWITCH 12V PENTA 17M

• Switch Type: -
• Number of Outputs: -
• Ratio - Input:Output: -
• Output Configuration: -
• Output Type: -
• Interface: -
• Voltage - Load: -
• Voltage - Supply (Vcc/Vdd): -
• Current - Output (Max): -
• Rds On (Typ): -
• Input Type: -
• Features: -
• Fault Protection: -
• Operating Temperature: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

S912ZVMC64F3WKH

NXP

S12Z CORE64K FLASHCAN64LQFP

• Core Processor: S12Z
• Core Size: 16-Bit
• Speed: 50MHz
• Connectivity: CANbus, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 31
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 512 x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
• Data Converters: A/D 9x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: -
• Package / Case: 64-LQFP Exposed Pad
• Supplier Device Package: 64-LQFP-EP (10x10)

pacchetto: 64-LQFP Exposed Pad

MC33FS8410G6KS

NXP

SAFETY POWER MANAGEMENT IC, QFN5

• Applications: System Basis Chip
• Current - Supply: 15mA
• Voltage - Supply: 60V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 56-VFQFN Exposed Pad
• Supplier Device Package: 56-HVQFN (8x8)

pacchetto: -

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LS1027ASN7HNA

NXP

IC MPU QORIQ 800MHZ 448FBGA

• Core Processor: ARM® Cortex®-A72
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 800MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3L SDRAM, DDR4 SDRAM
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: 1Gbps (1), 2.5Gbps (5)
• SATA: SATA 6Gbps (1)
• USB: -
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 448-BFBGA
• Supplier Device Package: 448-FBGA (17x17)

pacchetto: -

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S9S12G64J1VLC

NXP

IC MCU 16BIT 64KB FLASH 32LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 26
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 4K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacchetto: -

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A3I25X050NR1

NXP

RF MOSFET LDMOS 28V OM400-8

• Transistor Type: LDMOS (Dual)
• Frequency: 2.3GHz ~ 2.7GHz
• Gain: 28.8dB @ 2.59GHz
• Voltage - Test: 28 V
• Current Rating: 10µA
• Noise Figure: -
• Current - Test: 130 mA
• Power - Output: 5.6W
• Voltage - Rated: 65 V
• Package / Case: OM-400-8
• Supplier Device Package: OM-400-8

pacchetto: -

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