Prodotti NXP

MRF6S24140HSR3

NXP

FET RF 68V 2.39GHZ NI-88OS

• Transistor Type: LDMOS
• Frequency: 2.39GHz
• Gain: 15.2dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.3A
• Power - Output: 28W
• Voltage - Rated: 68V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

pacchetto: NI-880S

BZX284-B68,115

NXP

DIODE ZENER 68V 400MW SOD2

• Voltage - Zener (Nom) (Vz): 68V
• Tolerance: ±2%
• Power - Max: 400mW
• Impedance (Max) (Zzt): 160 Ohms
• Current - Reverse Leakage @ Vr: 50nA @ 47.6V
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
• Operating Temperature: -65°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: SOD-110
• Supplier Device Package: SOD110

pacchetto: SOD-110

UBA2211BP/N1,112

NXP

IC CFL DRIVER 8DIP

• Type: CFL/TL Driver
• Frequency: 40.05kHz ~ 42.68kHz
• Voltage - Supply: 10.7 V ~ 13.8 V
• Current - Supply: -
• Current - Output Source/Sink: 1.35A
• Dimming: No
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Supplier Device Package: 8-DIP

pacchetto: 8-DIP (0.300", 7.62mm)

HEF4024BT,652

NXP

IC 7STAGE BINARY COUNTER 14SOIC

• Logic Type: Binary Counter
• Direction: Up
• Number of Elements: 1
• Number of Bits per Element: 7
• Reset: Asynchronous
• Timing: -
• Count Rate: 35MHz
• Trigger Type: Negative Edge
• Voltage - Supply: 4.5 V ~ 15.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 14-SO

pacchetto: 14-SOIC (0.154", 3.90mm Width)

74ABT648D,623

NXP

IC TRANSCEIVER 8BIT INV 24SOIC

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 32mA, 64mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 24-SO

pacchetto: 24-SOIC (0.295", 7.50mm Width)

PC33663BSEFR2

NXP

DUAL LINCELL 14SOIC

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: -
• Supplier Device Package: -
• Mounting Type: -

pacchetto: -

SL3FCS1001FV/DH,11

NXP

IC I-CODE SLI FCP2

• Applications: -
• Interface: -
• Voltage - Supply: -
• Package / Case: 2-FlipChip
• Supplier Device Package: FCP2
• Mounting Type: Surface Mount

pacchetto: 2-FlipChip

P5020NXN1QMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

pacchetto: 1295-BBGA, FCBGA

MPC8545VTAQGD

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.0GHz
• Co-Processors/DSP: Signal Processing; SPE
• RAM Controllers: DDR, DDR2, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

pacchetto: 783-BBGA, FCBGA

XPC850SRZT66BU

NXP

IC MPU MPC8XX 66MHZ 256BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 66MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1)
• SATA: -
• USB: USB 1.x (1)
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 256-BGA
• Supplier Device Package: 256-PBGA (23x23)

pacchetto: 256-BGA

MC860SRCVR50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 50MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: -40°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacchetto: 357-BBGA

MCHC711KS2CFNE4

NXP

IC MCU 8BIT 32KB OTP 68PLCC

• Core Processor: HC11
• Core Size: 8-Bit
• Speed: 4MHz
• Connectivity: SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: OTP
• EEPROM Size: 640 x 8
• RAM Size: 1K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 8x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 68-LCC (J-Lead)
• Supplier Device Package: 68-PLCC (25x25)

pacchetto: 68-LCC (J-Lead)

MC912DG128AVPVE

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: CPU12
• Core Size: 16-Bit
• Speed: 8MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number of I/O: 69
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 16x8/10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

pacchetto: 112-LQFP

S9S12XS256J0CAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: CAN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 12K x 8
• Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

pacchetto: 112-LQFP

MC9S08PA8VWJ

NXP

IC MCU 8BIT 8KB FLASH 20SOIC

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I2C, LIN, SPI, UART/USART
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 18
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 256 x 8
• RAM Size: 2K x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 12x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

pacchetto: 20-SOIC (0.295", 7.50mm Width)

SAC57D54HCVMO

NXP

IC MCU 32BIT 4MB FLASH 516MAPBGA

• Core Processor: ARM? Cortex?-A5, -M4, -M0+
• Core Size: 32-Bit Tri-Core
• Speed: 80MHz, 160MHz, 320MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I2C, LIN, SPI
• Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 2.3M x 8
• Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
• Data Converters: A/D 24x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 516-BGA
• Supplier Device Package: 516-MAPBGA (27x27)

pacchetto: 516-BGA

MPX4100AP1

NXP

PRESSURE SENSOR ABSOLUTE 6-SIP

• Pressure Type: Absolute
• Operating Pressure: 2.9 PSI ~ 15.23 PSI (20 kPa ~ 105 kPa)
• Output Type: Analog Voltage
• Output: 0.3 V ~ 4.9 V
• Accuracy: ±1.8%
• Voltage - Supply: 4.85 V ~ 5.35 V
• Port Size: Male - 0.19" (4.93mm) Tube
• Port Style: Barbed
• Features: Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: 58.02 PSI (400 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 6-SIP Module
• Supplier Device Package: -

pacchetto: 6-SIP Module

MMA5206NDIKGCWR2

NXP

ACCELEROMETER PSI5 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MMA6805AKW

NXP

ACCELEROMETER 16QFN

• Type: -
• Axis: -
• Acceleration Range: -
• Sensitivity (LSB/g): -
• Sensitivity (mV/g): -
• Bandwidth: -
• Output Type: -
• Voltage - Supply: -
• Features: -
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 16-QFN Exposed Pad
• Supplier Device Package: 16-QFN-EP (6x6)

pacchetto: 16-QFN Exposed Pad

TEA6843HL/V1,518

NXP

IC CAR RADIO TUNER 80-LQFP

• Frequency: AM, FM, WB
• Sensitivity: -
• Data Rate (Max): -
• Modulation or Protocol: AM, FM
• Applications: AM/FM Radio Receiver
• Current - Receiving: 90mA
• Data Interface: PCB, Surface Mount
• Memory Size: -
• Antenna Connector: PCB, Surface Mount
• Features: -
• Voltage - Supply: 2.5 V ~ 12 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-LQFP
• Supplier Device Package: 80-LQFP (12x12)

pacchetto: 80-LQFP

MC13821-1575EVK

NXP

KIT EVALUATION MC13821-1575

• Type: Amplifier
• Frequency: 1575.42MHz
• For Use With/Related Products: -
• Supplied Contents: -

pacchetto: -

MWE6IC9080NBR1

NXP

RF AMP LDMOS TO-272 960MHZ

• Frequency: 865MHz ~ 960MHz
• P1dB: 90W
• Gain: 28.8dB
• Noise Figure: -
• RF Type: GSM, EDGE
• Voltage - Supply: 28V
• Current - Supply: -
• Test Frequency: -
• Package / Case: TO-272-14 Variant, Flat Leads
• Supplier Device Package: TO-272 WB-14

pacchetto: TO-272-14 Variant, Flat Leads

MC35FS4500CAER2

NXP

FS4500

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: -1.0 V ~ 40 V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-LQFP (7x7)

pacchetto: 48-LQFP Exposed Pad

MC07XSF517BEK

NXP

IC SWITCH 54SOIC

• Switch Type: General Purpose
• Number of Outputs: 6
• Ratio - Input:Output: 1:1
• Output Configuration: High Side
• Output Type: N-Channel
• Interface: SPI
• Voltage - Load: 18V (Max)
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Current - Output (Max): 5.5A, 11A
• Rds On (Typ): 7 mOhm, 17 mOhm
• Input Type: -
• Features: Internal PWM
• Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 54-HSOP

pacchetto: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

LS1020AXE7MQB

NXP

LS1 32BIT ARM SOC 1.2GHZ DDR3/

• Core Processor: ARM® Cortex®-A7
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 1.2GHz
• Co-Processors/DSP: Multimedia; NEON™ SIMD
• RAM Controllers: DDR3L, DDR4
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: GbE (3)
• SATA: SATA 3Gbps (1)
• USB: USB 2.0 (1), USB 3.0 + PHY
• Voltage - I/O: -
• Operating Temperature: -40°C ~ 105°C
• Security Features: -
• Package / Case: 525-FBGA, FCBGA
• Supplier Device Package: 525-FCPBGA (19x19)

pacchetto: 525-FBGA, FCBGA

SPC5674KAVMS2

NXP

NXP 32-BIT MCU DUAL POWER ARCH

• Core Processor: e200z7d
• Core Size: 32-Bit Dual-Core
• Speed: 180MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: -
• Program Memory Size: 1.5MB (1.5M x 8)
• Program Memory Type: FLASH
• EEPROM Size: 64K x 8
• RAM Size: 384K x 8
• Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
• Data Converters: A/D 34x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 473-LFBGA
• Supplier Device Package: 473-MAPBGA (19x19)

pacchetto: 473-LFBGA

LPC5504JBD64K

NXP

IC MCU 32BIT 128KB FLASH 64HTQFP

• Core Processor: ARM® Cortex®-M33
• Core Size: 32-Bit Single-Core
• Speed: 96MHz
• Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
• Number of I/O: 45
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 80K x 8
• Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
• Data Converters: A/D 9x16b SAR
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-TQFP Exposed Pad
• Supplier Device Package: 64-HTQFP (10x10)

pacchetto: -

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MC33FS6505KAER2

NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

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