Prodotti NXP

MRF5S9150HSR3

NXP

FET RF 68V 880MHZ NI-780

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 19.7dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.5A
• Power - Output: 33W
• Voltage - Rated: 68V
• Package / Case: NI-780
• Supplier Device Package: NI-780

pacchetto: NI-780

MRF5S21150HSR5

NXP

FET RF 65V 2.17GHZ NI-880S

• Transistor Type: LDMOS
• Frequency: 2.11GHz ~ 2.17GHz
• Gain: 12.5dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.3A
• Power - Output: 33W
• Voltage - Rated: 65V
• Package / Case: NI-880S
• Supplier Device Package: NI-880S

pacchetto: NI-880S

BB173LXX

NXP

DIODE VHF VAR CAP 32V SOD882

• Capacitance @ Vr, F: 2.75pF @ 28V, 1MHz
• Capacitance Ratio: 15
• Capacitance Ratio Condition: C1/C28
• Voltage - Peak Reverse (Max): 32V
• Diode Type: Single
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 2-XDFN
• Supplier Device Package: 2-DFN1006D (0.6x1.0)

pacchetto: 2-XDFN

BB201,215

NXP

DIODE VAR CAP DUAL 15V SOT-23

• Capacitance @ Vr, F: 25.5pF @ 8V, 1MHz
• Capacitance Ratio: 3.8
• Capacitance Ratio Condition: C1/C7.5
• Voltage - Peak Reverse (Max): 15V
• Diode Type: 1 Pair Common Cathode
• Q @ Vr, F: -
• Operating Temperature: -55°C ~ 125°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: TO-236-3, SC-59, SOT-23-3
• Supplier Device Package: TO-236AB (SOT23)

pacchetto: TO-236-3, SC-59, SOT-23-3

SSTU32865ET,557

NXP

IC BUFFER 1.8V 28BIT SOT802-1

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

pacchetto: 160-TFBGA

74HCT640DB,112

NXP

IC TRANSCEIVER 3ST 8BIT 20SSOP

• Logic Type: Transceiver, Inverting
• Number of Elements: 1
• Number of Bits per Element: 8
• Input Type: -
• Output Type: Push-Pull
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 20-SSOP (0.209", 5.30mm Width)
• Supplier Device Package: 20-SSOP

pacchetto: 20-SSOP (0.209", 5.30mm Width)

CGD1042,112

NXP

IC POWER DOUBLER 1GHZ SOT115

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: -
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

pacchetto: SOT-115J

SC26C92A1B,551

NXP

IC UART DUAL W/FIFO 44QFP

• Features: Configurable GPIO, Internal Oscillator, Timer/Counter
• Number of Channels: 2, DUART
• FIFO's: 8 Byte
• Protocol: -
• Data Rate (Max): 1Mbps
• Voltage - Supply: 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: -
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 44-QFP
• Supplier Device Package: 44-PQFP (10x10)

pacchetto: 44-QFP

TJA1046TKZ

NXP

IC TRANSCEIVER CAN HS 14HVSON

• Type: Transceiver
• Protocol: CAN
• Number of Drivers/Receivers: -
• Duplex: -
• Receiver Hysteresis: 300mV
• Data Rate: 5Mbps
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: -
• Mounting Type: Surface Mount
• Package / Case: 14-VDFN Exposed Pad
• Supplier Device Package: 14-HVSON (3x4.5)

pacchetto: 14-VDFN Exposed Pad

MC8640TVU1250HC

NXP

IC MPU MPC86XX 1.25GHZ 994FCCBGA

• Core Processor: PowerPC e600
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.25GHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (4)
• SATA: -
• USB: -
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 994-BCBGA, FCCBGA
• Supplier Device Package: 994-FCCBGA (33x33)

pacchetto: 994-BCBGA, FCCBGA

KMPC859TVR133A

NXP

IC MPU MPC8XX 133MHZ 357BGA

• Core Processor: MPC8xx
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 133MHz
• Co-Processors/DSP: Communications; CPM
• RAM Controllers: DRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10 Mbps (1), 10/100 Mbps (1)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 95°C (TA)
• Security Features: -
• Package / Case: 357-BBGA
• Supplier Device Package: 357-PBGA (25x25)

pacchetto: 357-BBGA

MC9328MX21VK

NXP

IC MPU I.MX21 266MHZ 289MAPBGA

• Core Processor: ARM926EJ-S
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: -
• RAM Controllers: SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: Keypad, LCD
• Ethernet: -
• SATA: -
• USB: USB 1.x (2)
• Voltage - I/O: 1.8V, 3.0V
• Operating Temperature: 0°C ~ 70°C (TA)
• Security Features: -
• Package / Case: 289-LFBGA
• Supplier Device Package: -

pacchetto: 289-LFBGA

MC908JL8MPE

NXP

IC MCU 8BIT 8KB FLASH 28DIP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI
• Peripherals: LED, LVD, POR, PWM
• Number of I/O: 15
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256 x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 13x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 28-DIP (0.600", 15.24mm)
• Supplier Device Package: 28-PDIP

pacchetto: 28-DIP (0.600", 15.24mm)

LPC2212FBD144,551

NXP

IC MCU 32BIT 128KB FLASH 144LQFP

• Core Processor: ARM7?
• Core Size: 16/32-Bit
• Speed: 60MHz
• Connectivity: EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 112
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 16K x 8
• Voltage - Supply (Vcc/Vdd): 1.65 V ~ 1.95 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

pacchetto: 144-LQFP

MC9S12DG128VPV

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: PWM, WDT
• Number of I/O: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 112-LQFP
• Supplier Device Package: 112-LQFP (20x20)

pacchetto: 112-LQFP

MK50DN512ZCLL10

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM, WDT
• Number of I/O: 59
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 34x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 100-LQFP
• Supplier Device Package: 100-LQFP (14x14)

pacchetto: 100-LQFP

MCHC908GR8CFAER

NXP

IC MCU 8BIT 7.5KB FLASH 32LQFP

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SCI, SPI
• Peripherals: LVD, POR, PWM
• Number of I/O: 21
• Program Memory Size: 7.5KB (7.5K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 384 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 6x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (7x7)

pacchetto: 32-LQFP

MC9S08SE8VTGR

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

• Core Processor: S08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: LIN, SCI
• Peripherals: LVD, POR, PWM
• Number of I/O: 14
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 512 x 8
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Supplier Device Package: 16-TSSOP

pacchetto: 16-TSSOP (0.173", 4.40mm Width)

MK81FN256VDC15

NXP

IC MCU 32BIT 256KB FLASH 121BGA

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: EBI/EMI, I2C, SPI, UART/USART, USB OTG
• Peripherals: DMA, I2S, LVD, POR, PWM
• Number of I/O: 85
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 256K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 17x16b, D/A 2x6b, 1x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 121-XFBGA
• Supplier Device Package: 121-MAPBGA (8x8)

pacchetto: 121-XFBGA

MC88915FN70R2

NXP

IC DRIVER CLK PLL 70MHZ 28-PLCC

• Type: Clock Driver, Fanout Distribution, Multiplexer
• PLL: Yes
• Input: TTL
• Output: CMOS, TTL
• Number of Circuits: 1
• Ratio - Input:Output: 3:8
• Differential - Input:Output: No/No
• Frequency - Max: 70MHz
• Divider/Multiplier: Yes/Yes
• Voltage - Supply: 4.75 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 28-LCC (J-Lead)
• Supplier Device Package: 28-PLCC (12.45x12.45)

pacchetto: 28-LCC (J-Lead)

MP3V5050VC6T1

NXP

IC PRESSURE SENSOR 8-SOP

• Pressure Type: Vacuum
• Operating Pressure: -7.25 PSI (-50 kPa)
• Output Type: Analog Voltage
• Output: 0.06 V ~ 2.82 V
• Accuracy: ±2.5%
• Voltage - Supply: 2.7 V ~ 3.3 V
• Port Size: Male - 0.13" (3.17mm) Tube
• Port Style: Barbless
• Features: Amplified Output, Temperature Compensated
• Termination Style: PCB
• Maximum Pressure: -29.01 PSI (-200 kPa)
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SMD, Gull Wing, Top Port
• Supplier Device Package: -

pacchetto: 8-SMD, Gull Wing, Top Port

PCF7921ATTM2AB1200

NXP

IC RF REMOTE WIRELESS 20-TSSOP

• Frequency: -
• Applications: -
• Modulation or Protocol: -
• Data Rate (Max): -
• Power - Output: -
• Current - Transmitting: -
• Data Interface: -
• Antenna Connector: -
• Memory Size: -
• Features: -
• Voltage - Supply: -
• Operating Temperature: -
• Package / Case: -

pacchetto: -

BSC9132QDS

NXP

DEV SYSTEM BSC9132

• Type: Cellular Development Platform
• Frequency: -
• For Use With/Related Products: BSC9132
• Supplied Contents: Board, Cables, Power Supply

pacchetto: -

T1013NXE7KQA

NXP

QORIQ 1XCPU 64-BIT PWR ARCH 1.

• Core Processor: -
• Number of Cores/Bus Width: -
• Speed: -
• Co-Processors/DSP: -
• RAM Controllers: -
• Graphics Acceleration: -
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: -
• Operating Temperature: -
• Security Features: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

MCIMX6X4CVM08AC

NXP

I.MX6SX ROM PERF ENHAN

• Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
• Number of Cores/Bus Width: 2 Core, 32-Bit
• Speed: 200MHz, 800MHz
• Co-Processors/DSP: Multimedia; NEON™ MPE
• RAM Controllers: LPDDR2, LVDDR3, DDR3
• Graphics Acceleration: Yes
• Display & Interface Controllers: Keypad, LCD, LVDS
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Package / Case: 529-LFBGA
• Supplier Device Package: 529-MAPBGA (19x19)

pacchetto: 529-LFBGA

UJA1136HW/5V0/S90Y

NXP

IC SBCS CAN HIGH SPEED 48HTQFP

• Applications: -
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

SAF7753HN-N207WK

NXP

CAR DISP

• Type: -
• Interface: -
• Clock Rate: -
• Non-Volatile Memory: -
• On-Chip RAM: -
• Voltage - I/O: -
• Voltage - Core: -
• Operating Temperature: -
• Mounting Type: -
• Package / Case: -
• Supplier Device Package: -

pacchetto: -

Request a Quote

MC35FS4505NAER2

NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

• Applications: System Basis Chip
• Current - Supply: -
• Voltage - Supply: 1V ~ 5V
• Operating Temperature: -40°C ~ 150°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP Exposed Pad
• Supplier Device Package: 48-HLQFP (7x7)

pacchetto: -

Request a Quote