Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Sensor Type | Sensing Temperature | Accuracy | Topology | Output Type | Output Alarm | Output Fan | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC BUS I2C 8HWSON
|
pacchetto: - |
Azione2.848 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC BUS I2C 8SOIC
|
pacchetto: - |
Azione2.464 |
|
- | - | - | - | - | - | - | - | - | - | - | - |
||
NXP |
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.712 |
|
Internal | -40°C ~ 125°C | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | 2-Wire Serial, I2C/SMBUS | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |
||
NXP |
IC TEMPERATURE SENSOR DDR 8HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione6.352 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |
||
NXP |
IC TEMP SENSOR DDR 3.6V 8-HXSON
|
pacchetto: 8-XFDFN Exposed Pad |
Azione3.024 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-XFDFN Exposed Pad | 8-HXSON (2x3) |
||
NXP |
IC TEMP SENSOR DDR 3.3V 8-HXSON
|
pacchetto: 8-XFDFN Exposed Pad |
Azione5.472 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Comparator, Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-XFDFN Exposed Pad | 8-HXSON (2x3) |
||
NXP |
IC TEMP SENSOR DDR 8-TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione7.520 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
NXP |
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione5.040 |
|
Internal | -40°C ~ 125°C | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | 2-Wire Serial, I2C/SMBUS | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |
||
NXP |
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione7.824 |
|
Internal | -40°C ~ 125°C | ±3°C | ADC (Sigma Delta), Comparator, Register Bank | 2-Wire Serial, I2C/SMBUS | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |
||
NXP |
IC TEMP SENSOR DIMM 3.3V 8-HXSON
|
pacchetto: 8-XFDFN Exposed Pad |
Azione5.824 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Comparator, Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-XFDFN Exposed Pad | 8-HXSON (2x3) |
||
NXP |
IC TEMP SENSOR DIMM 8-HVSON
|
pacchetto: 8-VFDFN Exposed Pad |
Azione5.520 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Comparator, Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-VFDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TEMP SENSOR DIMM 8-TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione2.672 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Comparator, Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
NXP |
IC TEMP MONITOR 16SSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione7.664 |
|
Internal and External | 0°C ~ 125°C, External Sensor | ±3°C Local(Max), ±5°C Remote(Max) | ADC, Multiplexer, Register Bank | SMBus | Yes | No | 2.8 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-SSOP |
||
NXP |
IC TEMP MONITOR 16SSOP
|
pacchetto: 16-SSOP (0.154", 3.90mm Width) |
Azione4.352 |
|
Internal and External | 0°C ~ 125°C, External Sensor | ±3°C Local(Max), ±5°C Remote(Max) | ADC, Multiplexer, Register Bank | SMBus | Yes | No | 2.8 V ~ 5.5 V | 0°C ~ 125°C | Surface Mount | 16-SSOP (0.154", 3.90mm Width) | 16-SSOP |
||
NXP |
IC TEMP SENSOR I2C 8HVSON
|
pacchetto: 8-VFDFN Exposed Pad |
Azione3.440 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-VFDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TEMP SENSOR I2C 8TSSOP
|
pacchetto: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Azione3.216 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-TSSOP |
||
NXP |
IC TEMP SENSOR DDR 8-HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione72.858 |
|
Internal | -40°C ~ 125°C | ±4°C(Max) | ADC (Sigma Delta), Register Bank | I2C/SMBus | Yes | Yes | 1.7 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |
||
NXP |
IC TEMP SENSOR DIMM 8HWSON
|
pacchetto: 8-WFDFN Exposed Pad |
Azione35.688 |
|
Internal | -40°C ~ 125°C | ±3°C(Max) | ADC (Sigma Delta), Comparator, Register Bank | I2C/SMBus | Yes | Yes | 3 V ~ 3.6 V | -40°C ~ 125°C | Surface Mount | 8-WFDFN Exposed Pad | 8-HWSON (2x3) |