Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Elements | Number of Bits per Element | Input Type | Output Type | Current - Output High, Low | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC TXRX NON-INV 3-ST 8BIT 24SSOP
|
pacchetto: 24-SSOP (0.209", 5.30mm Width) |
Azione3.216 |
|
1 | 8 | - | Push-Pull | 6mA, 6mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Surface Mount | 24-SSOP (0.209", 5.30mm Width) | 24-SSOP |
||
NXP |
IC BUFF NINE SCHMT TIG 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione5.520 |
|
9 | 1 | Schmitt Trigger | Open Drain | -, 4mA | 4.5 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.656 |
|
2 | 4 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SSOP
|
pacchetto: 20-SSOP (0.209", 5.30mm Width) |
Azione6.640 |
|
2 | 4 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione7.328 |
|
2 | 4 | - | Push-Pull | 16mA, 16mA | 1 V ~ 5.5 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione6.784 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione2.832 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC BUFF/DVR TRI-ST 6BIT 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.064 |
|
1 | 6 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC BUFF DVR TRI-ST HEX 16DIP
|
pacchetto: 16-DIP (0.300", 7.62mm) |
Azione3.552 |
|
2 | 2, 4 (Hex) | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Through Hole | 16-DIP (0.300", 7.62mm) | 16-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione4.512 |
|
1 | 8 | - | Push-Pull | 8mA, 8mA | 1 V ~ 3.6 V | -40°C ~ 125°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF INVERT 8BIT 5.5V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.808 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF INVERT 8BIT 5.5V 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione4.544 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUS TXRX TRI-ST 4BIT 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione7.616 |
|
1 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
NXP |
IC BUS TXRX TRI-ST 4BIT 14SOIC
|
pacchetto: 14-SOIC (0.154", 3.90mm Width) |
Azione5.808 |
|
1 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 14-SOIC (0.154", 3.90mm Width) | 14-SO |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione2.288 |
|
2 | 4 | - | Push-Pull | 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC TRANSCVR TRI-ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione6.192 |
|
1 | 8 | - | Push-Pull | 3mA, 24mA; 15mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF DVR TRI-ST 10BIT 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione4.896 |
|
1 | 10 | - | Push-Pull | 24mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC BUFF DVR TRI-ST 10BIT 24SOIC
|
pacchetto: 24-SOIC (0.295", 7.50mm Width) |
Azione7.296 |
|
1 | 10 | - | Push-Pull | 24mA, 64mA | 4.5 V ~ 5.5 V | 0°C ~ 70°C (TA) | Surface Mount | 24-SOIC (0.295", 7.50mm Width) | 24-SO |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione6.704 |
|
2 | 4 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF/DVR TRI-ST DUAL 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.648 |
|
2 | 4 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF INVERT 5.5V 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione2.704 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione7.952 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC BUFF/DVR TRI-ST 8BIT 20SOIC
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.920 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC TRANSCEIVER 3ST 8BIT 20DIP
|
pacchetto: 20-DIP (0.300", 7.62mm) |
Azione7.600 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Through Hole | 20-DIP (0.300", 7.62mm) | 20-DIP |
||
NXP |
IC TRANSCVR 3ST 8BIT 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.000 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC TRANSCVR 3ST 8BIT 24TSSOP
|
pacchetto: 24-TSSOP (0.173", 4.40mm Width) |
Azione6.640 |
|
1 | 8 | - | Push-Pull | 32mA, 64mA | 4.5 V ~ 5.5 V | -40°C ~ 85°C (TA) | Surface Mount | 24-TSSOP (0.173", 4.40mm Width) | 24-TSSOP |
||
NXP |
IC TXRX NON-INV 3-ST 8BIT 24DIP
|
pacchetto: 24-DIP (0.600", 15.24mm) |
Azione2.752 |
|
1 | 8 | - | Push-Pull | 7.8mA, 7.8mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 24-DIP (0.600", 15.24mm) | 24-DIP |
||
NXP |
IC BUFF HEX SCHM TRG 14DIP
|
pacchetto: 14-DIP (0.300", 7.62mm) |
Azione6.048 |
|
6 | 1 | Schmitt Trigger | Push-Pull | 5.2mA, 5.2mA | 2 V ~ 6 V | -40°C ~ 125°C (TA) | Through Hole | 14-DIP (0.300", 7.62mm) | 14-DIP |