Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Number of Cores/Bus Width | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | SATA | USB | Voltage - I/O | Operating Temperature | Security Features | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione4.400 |
|
1 Core, 32-Bit | 667MHz | Security; SEC 3.0 | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC83XX 667MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione10.044 |
|
1 Core, 32-Bit | 667MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU M683XX 25MHZ 132QFP
|
pacchetto: 132-BQFP Bumpered |
Azione8.832 |
|
1 Core, 8/16-Bit | 25MHz | Communications; RISC CPM | DRAM | No | - | - | - | - | 5.0V | 0°C ~ 70°C (TA) | - | 132-BQFP Bumpered | 132-PQFP (24.13x24.13) |
||
NXP |
IC MPU ARM926EJ-S 236MAPBGA
|
pacchetto: 236-LFBGA |
Azione6.992 |
|
1 Core, 32-Bit | - | - | DDR, SDRAM | No | LCD | - | - | USB 2.0 OTG (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 236-LFBGA | 236-MAPBGA (9x9) |
||
NXP |
IC MPU MPC52XX 400MHZ 272BGA
|
pacchetto: 272-BBGA |
Azione8.952 |
|
1 Core, 32-Bit | 400MHz | - | DDR, SDRAM | No | - | 10/100 Mbps (1) | - | USB 1.1 (2) | 2.5V, 3.3V | 0°C ~ 70°C (TA) | - | 272-BBGA | 272-PBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione10.920 |
|
1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC82XX 400MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione4.320 |
|
1 Core, 32-Bit | 400MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione7.456 |
|
1 Core, 32-Bit | 400MHz | - | DDR | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU ARM926EJ-S 236MAPBGA
|
pacchetto: 236-LFBGA |
Azione8.784 |
|
1 Core, 32-Bit | - | - | DDR, SDRAM | No | LCD | - | - | USB 2.0 OTG (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | Cryptography | 236-LFBGA | 236-MAPBGA (9x9) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.960 |
|
2 Core, 32-Bit | 800MHz | Security; SEC 3.3 | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | 2.5V, 3.3V | 0°C ~ 125°C (TA) | Cryptography, Random Number Generator | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU MPC82XX 200MHZ 357BGA
|
pacchetto: 357-BBGA |
Azione15.228 |
|
1 Core, 32-Bit | 200MHz | - | SDRAM | No | - | - | - | - | 3.3V | 0°C ~ 105°C (TA) | - | 357-BBGA | 357-PBGA (25x25) |
||
NXP |
IC MPU MPC82XX 266MHZ 516BGA
|
pacchetto: 516-BBGA |
Azione15.540 |
|
1 Core, 32-Bit | 266MHz | Communications; RISC CPM, Security; SEC | DRAM, SDRAM | No | - | 10/100 Mbps (2) | - | USB 2.0 (1) | 3.3V | -40°C ~ 105°C (TA) | Cryptography, Random Number Generator | 516-BBGA | 516-FPBGA (27x27) |
||
NXP |
IC MPU I.MX53 800MHZ 529TEBGA-2
|
pacchetto: 529-FBGA |
Azione65.952 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR2, DDR2, DDR3 | Yes | Keypad, LCD | 10/100 Mbps (1) | SATA 1.5Gbps (1) | USB 2.0 (2), USB 2.0 + PHY (2) | 1.3V, 1.8V, 2.775V, 3.3V | -40°C ~ 125°C (TJ) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | 529-FBGA | 529-TEPBGA-2 (19x19) |
||
NXP |
IC MPU Q OR IQ 800MHZ 689TEBGA
|
pacchetto: 689-BBGA Exposed Pad |
Azione6.128 |
|
1 Core, 32-Bit | 800MHz | - | DDR2, DDR3 | No | - | 10/100/1000 Mbps (3) | - | USB 2.0 + PHY (2) | - | 0°C ~ 125°C (TA) | - | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) |
||
NXP |
IC MPU I.MX51 800MHZ 529BGA
|
pacchetto: 529-LFBGA |
Azione4.160 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, DDR2 | No | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 (3), USB 2.0 + PHY (1) | 1.2V, 1.875V, 2.775V, 3.0V | -20°C ~ 85°C (TC) | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | 529-LFBGA | 529-BGA Case 2017 (19x19) |
||
NXP |
IC MPU I.MX31 532MHZ 457MAPBGA
|
pacchetto: 457-LFBGA |
Azione4.160 |
|
1 Core, 32-Bit | 532MHz | Multimedia; GPU, IPU, MPEG-4, VFP | DDR | Yes | Keyboard, Keypad, LCD | - | - | USB 2.0 (3) | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V | -40°C ~ 85°C (TA) | Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory | 457-LFBGA | - |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione18.072 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU MPC83XX 400MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione24.624 |
|
1 Core, 32-Bit | 400MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | SATA 3Gbps (2) | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | 0°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione6.880 |
|
2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON? MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 125°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | 400-LFBGA | 400-MAPBGA (14x14) |
||
NXP |
IC MPU MPC8XX 66MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione5.008 |
|
1 Core, 32-Bit | 66MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 266MHZ 620BGA
|
pacchetto: 620-BBGA Exposed Pad |
Azione3.472 |
|
1 Core, 32-Bit | 266MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 620-BBGA Exposed Pad | 620-PBGA (29x29) |
||
NXP |
IC MPU I.MX6SX 1GHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione7.104 |
|
2 Core, 32-Bit | 200MHz, 1GHz | Multimedia; NEON? MPE | LPDDR2, LVDDR3, DDR3 | Yes | Keypad, LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -20°C ~ 105°C (TJ) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | 400-LFBGA | 400-MAPBGA (14x14) |
||
NXP |
IC MPU I.MX27 400MHZ 404MAPBGA
|
pacchetto: 404-LFBGA |
Azione46.944 |
|
1 Core, 32-Bit | 400MHz | Security; SAHARAH2 | DDR | Yes | Keypad, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (3) | 2.0V, 2.5V, 2.7V, 3.0V | -20°C ~ 85°C (TA) | Cryptography, Random Number Generator, RTIC, Secure Fusebox, Secure Memory | 404-LFBGA | - |
||
NXP |
IC MPU I.MX6SX 800MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione6.060 |
|
2 Core, 32-Bit | 200MHz, 800MHz | Multimedia; NEON? MPE | LPDDR2, LVDDR3, DDR3 | No | Keypad, LCD | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) | 1.8V, 2.5V, 2.8V, 3.15V | -40°C ~ 105°C (TA) | A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE | 400-LFBGA | 400-MAPBGA (14x14) |
||
NXP |
IC MPU I.MX35 532MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione4.576 |
|
1 Core, 32-Bit | 532MHz | Multimedia; GPU, IPU, VFP | LPDDR, DDR2 | Yes | Keypad, KPP, LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V | -40°C ~ 85°C (TA) | Secure Fusebox, Secure JTAG | 400-LFBGA | 400-MAPBGA (17x17) |
||
NXP |
IC MPU MPC8XX 50MHZ 256BGA
|
pacchetto: 256-BBGA |
Azione4.880 |
|
1 Core, 32-Bit | 50MHz | Communications; CPM | DRAM | No | - | 10 Mbps (1) | - | - | 3.3V | -40°C ~ 100°C (TA) | - | 256-BBGA | 256-PBGA (23x23) |
||
NXP |
IC MPU MPC83XX 267MHZ 516BGA
|
pacchetto: 516-BBGA Exposed Pad |
Azione7.296 |
|
1 Core, 32-Bit | 267MHz | - | DDR, DDR2 | No | - | 10/100/1000 Mbps (2) | - | USB 2.0 + PHY (1) | 1.8V, 2.5V, 3.3V | -40°C ~ 105°C (TA) | - | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) |
||
NXP |
IC MPU I.MX50 800MHZ 400MAPBGA
|
pacchetto: 400-LFBGA |
Azione8.088 |
|
1 Core, 32-Bit | 800MHz | Multimedia; NEON? SIMD | LPDDR, LPDDR2, DDR2 | Yes | LCD | 10/100 Mbps (1) | - | USB 2.0 + PHY (2) | 1.2V, 1.875V, 2.775V, 3.0V | 0°C ~ 70°C (TA) | Boot Security, Cryptography, Secure JTAG | 400-LFBGA | 400-MAPBGA (17x17) |