Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
KINETIS E SERIES 16K FLASH 4K RA
|
pacchetto: 32-LQFP |
Azione5.072 |
|
32-Bit | 40MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 28 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b | Internal | -40°C ~ 125°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
pacchetto: 44-LQFP |
Azione6.816 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 37 | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 44-LQFP | 44-LQFP (10x10) |
||
NXP |
S08FL 8-BIT MCU S08 CORE 8KB F
|
pacchetto: 32-LQFP |
Azione4.864 |
|
8-Bit | 20MHz | SCI | LVD, PWM, WDT | 30 | 8KB (8K x 8) | FLASH | - | 768 x 8 | 4.5 V ~ 5.5 V | A/D 12x8b | Internal | -40°C ~ 85°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
S08QD 8-BIT MCU S08 CORE 4KB F
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione3.088 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 125°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
8-BIT MCU S08 CORE 4KB FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.848 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
8-BIT MCU HC08 CORE 4KB FLASH
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.936 |
|
8-Bit | 8MHz | - | LVD, POR, PWM | 13 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 6x10b | Internal | -40°C ~ 85°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
8-BIT MCU S08 CORE 2KB FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.832 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 125°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
8-BIT MCU S08 CORE 4KB FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione6.368 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 4KB (4K x 8) | FLASH | - | 256 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
8-BIT MCU S08 CORE 2KB FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione5.088 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16KB
|
pacchetto: 32-LQFP |
Azione6.576 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 28 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
pacchetto: 44-LQFP |
Azione5.824 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 37 | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 44-LQFP | 44-LQFP (10x10) |
||
NXP |
8-BIT MCU S08 CORE 2KB FLASH
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.832 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 85°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
S08QD 8-BIT MCU S08 CORE 2KB F
|
pacchetto: 8-SOIC (0.154", 3.90mm Width) |
Azione2.400 |
|
8-Bit | 16MHz | - | LVD, POR, PWM, WDT | 4 | 2KB (2K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x10b | Internal | -40°C ~ 105°C (TA) | - | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.160 |
|
32-Bit | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 22 | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | -40°C ~ 105°C (TA) | - | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
NXP |
KINETIS KE02: 20MHZ CORTEX-M0+ 5
|
pacchetto: 32-LQFP |
Azione3.472 |
|
32-Bit | 20MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 28 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 16x12b, D/A 2x6b | Internal | -40°C ~ 105°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
S08PT 8-BIT MCU S08 CORE 16KB
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione5.760 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
pacchetto: 16-WQFN Exposed Pad |
Azione7.744 |
|
32-Bit | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 32KB (32K x 8) | FLASH | - | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | -40°C ~ 105°C (TA) | - | 16-WQFN Exposed Pad | 16-QFN (3x3) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16 KB
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.664 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.128 |
|
32-Bit | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 22 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 125°C (TA) | - | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
NXP |
KINETIS KE04: 48MHZ CORTEX-M0+ 5
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione2.624 |
|
32-Bit | 48MHz | I²C, SPI, UART/USART | LVD, PWM, WDT | 18 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 10x12b, D/A 2x6b | Internal | -40°C ~ 105°C (TA) | - | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione3.616 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 18 | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
NXP |
S08PA 8-BIT MCU S08 CORE 16KB
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.096 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
pacchetto: 24-VFQFN Exposed Pad |
Azione4.576 |
|
32-Bit | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 22 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
NXP |
S08PA 8-BIT MCU S08 CORE 8KB F
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione5.632 |
|
8-Bit | 20MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 18 | 8KB (8K x 8) | FLASH | 256 x 8 | 2K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
KINETIS E 32-BIT MCU ARM CORTEX
|
pacchetto: 24-VFQFN Exposed Pad |
Azione6.288 |
|
32-Bit | 48MHz | I²C, LINbus, SPI, UART/USART | LVD, POR, PWM, WDT | 22 | 8KB (8K x 8) | FLASH | - | 1K x 8 | 2.7 V ~ 5.5 V | A/D 12x12b | Internal | -40°C ~ 105°C (TA) | - | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
NXP |
KINETIS KL03: 48MHZ CORTEX-M0+ U
|
pacchetto: 24-VFQFN Exposed Pad |
Azione2.960 |
|
32-Bit | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 22 | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | -40°C ~ 105°C (TA) | - | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
NXP |
FINISHED GOOD
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione4.208 |
|
8-Bit | 20MHz | I²C | LVD, POR, PWM, WDT | 14 | 8KB (8K x 8) | FLASH | - | 254 x 8 | 1.8 V ~ 5.5 V | A/D 12x10b | Internal | -40°C ~ 85°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
KINETIS L 32-BIT MCU ARM CORTEX
|
pacchetto: 16-WFQFN Exposed Pad |
Azione4.752 |
|
32-Bit | 48MHz | I²C, SPI, UART/USART | Brown-out Detect/Reset, LVD, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | - | 2K x 8 | 1.71 V ~ 3.6 V | A/D 7x12b | Internal | -40°C ~ 105°C (TA) | - | 16-WFQFN Exposed Pad | 16-QFN (3x3) |