Immagine |
Numero di parte |
Produttore |
Descrizione |
pacchetto |
Azione |
Quantità |
Core Size | Speed | Connectivity | Peripherals | Number of I/O | Program Memory Size | Program Memory Type | EEPROM Size | RAM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione7.744 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione6.320 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione23.724 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione7.408 |
|
32-Bit Dual-Core | 500MHz | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG | DMA, LVD, WDT | - | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D Dual x 12b, D/A Dual x 12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione2.000 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione7.632 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione5.312 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione3.136 |
|
32-Bit Dual-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione2.288 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 364MAPBGA
|
pacchetto: 364-LFBGA |
Azione2.960 |
|
32-Bit Single-Core | 400MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 136 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 364-LFBGA | 364-MAPBGA (17x17) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione4.000 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione2.976 |
|
32-Bit Dual-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.536 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT ROMLESS 176LQFP
|
pacchetto: 176-LQFP Exposed Pad |
Azione5.040 |
|
32-Bit Single-Core | 266MHz | CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG | LCD, SAI | 115 | - | ROMless | - | 1.5MB | 3 V ~ 3.6 V | A/D 10x12b | Internal | -40°C ~ 85°C (TA) | - | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
NXP |
IC MCU 32BIT 1.5MB FLASH 208LQFP
|
pacchetto: 208-LQFP |
Azione3.312 |
|
32-Bit | 120MHz | CAN, I2C, LIN, SCI, SPI | DMA, POR, PWM, WDT | 177 | 1.5MB (1.5M x 8) | FLASH | 4K x 16 | 128K x 8 | 3 V ~ 5.5 V | A/D 43x10b/12b | Internal | -40°C ~ 105°C (TA) | - | 208-LQFP | 208-LQFP (28x28) |
||
NXP |
IC MCU 32BIT 768KB FLASH 144LQFP
|
pacchetto: 144-LQFP |
Azione4.000 |
|
32-Bit | 60MHz | CAN, EBI/EMI, LIN, SCI, SPI, UART/USART | DMA, POR, PWM, WDT | 80 | 768KB (768K x 8) | FLASH | - | 48K x 8 | 4.5 V ~ 5.25 V | A/D 32x12b | Internal | -40°C ~ 150°C (TA) | - | 144-LQFP | 144-LQFP (20x20) |
||
NXP |
IC MCU 32BIT ROMLESS 160MAPBGA
|
pacchetto: - |
Azione110.616 |
|
32-Bit | 140MHz | I2C, IDE, Memory Card, SPI, UART/USART | DMA, I2S, POR, Serial Audio, WDT | 47 | - | ROMless | - | 96K x 8 | 3 V ~ 3.6 V | A/D 4x12b | External | -20°C ~ 70°C (TA) | - | - | 160-MAPBGA (15x15) |
||
NXP |
IC MCU 16BIT 48KB FLASH 32LQFP
|
pacchetto: 32-LQFP |
Azione2.448 |
|
16-Bit | 25MHz | IrDA, LIN, SCI, SPI | LVD, POR, PWM, WDT | 16 | 48KB (48K x 8) | FLASH | 512 x 8 | 2K x 8 | 3.13 V ~ 5.5 V | A/D 2x10b | Internal | -40°C ~ 85°C (TA) | - | 32-LQFP | 32-LQFP (7x7) |
||
NXP |
IC MCU 8BIT 4KB FLASH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione2.080 |
|
8-Bit | 8MHz | - | LVD, POR, PWM | 13 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x8b | Internal | -40°C ~ 85°C (TA) | - | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC MCU 8BIT 4KB FLASH 16SOIC
|
pacchetto: 16-SOIC (0.295", 7.50mm Width) |
Azione6.768 |
|
8-Bit | 8MHz | - | LVD, POR, PWM | 13 | 4KB (4K x 8) | FLASH | - | 128 x 8 | 2.7 V ~ 5.5 V | A/D 4x8b | Internal | -40°C ~ 85°C (TA) | - | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |
||
NXP |
IC MCU 32BIT 256KB FLASH 80LQFP
|
pacchetto: 80-LQFP |
Azione7.488 |
|
32-Bit | 100MHz | CAN, I2C, LIN, SCI, SPI | Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT | 68 | 256KB (256K x 8) | FLASH | 2K x 8 | 32K x 8 | 3 V ~ 3.6 V | A/D 16x12b, 10x16b, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 80-LQFP | 80-LQFP (12x12) |
||
NXP |
IC MCU 8BIT 64KB OTP 44PLCC
|
pacchetto: 44-LCC (J-Lead) |
Azione5.072 |
|
8-Bit | 33MHz | EBI/EMI, UART/USART | POR, PWM, WDT | 32 | 64KB (64K x 8) | OTP | - | 1K x 8 | 2.7 V ~ 5.5 V | - | Internal | -40°C ~ 85°C (TA) | - | 44-LCC (J-Lead) | - |
||
NXP |
IC MCU 32BIT 16KB FLASH 20TSSOP
|
pacchetto: 20-TSSOP (0.173", 4.40mm Width) |
Azione6.224 |
|
32-Bit | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8 V ~ 3.6 V | - | Internal | -40°C ~ 105°C (TA) | - | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
NXP |
IC MCU 32BIT 16KB FLASH 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione3.232 |
|
32-Bit | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14 | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8 V ~ 3.6 V | - | Internal | -40°C ~ 105°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC MCU 32BIT 16KB FLASH 20SO
|
pacchetto: 20-SOIC (0.295", 7.50mm Width) |
Azione5.632 |
|
32-Bit | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 18 | 16KB (16K x 8) | FLASH | - | 4K x 8 | 1.8 V ~ 3.6 V | - | Internal | -40°C ~ 105°C (TA) | - | 20-SOIC (0.295", 7.50mm Width) | 20-SO |
||
NXP |
IC MCU 32BIT 8KB FLASH 16TSSOP
|
pacchetto: 16-TSSOP (0.173", 4.40mm Width) |
Azione6.624 |
|
32-Bit | 30MHz | I2C, SPI, UART/USART | Brown-out Detect/Reset, POR, PWM, WDT | 14 | 8KB (8K x 8) | FLASH | - | 2K x 8 | 1.8 V ~ 3.6 V | - | Internal | -40°C ~ 105°C (TA) | - | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
NXP |
IC MCU 32BIT 4MB FLASH 324TEBGA
|
pacchetto: 324-BBGA |
Azione7.472 |
|
32-Bit | 200MHz | CAN, EBI/EMI, SCI, SPI | DMA, POR, PWM | 32 | 4MB (4M x 8) | FLASH | - | 256K x 8 | 1.08 V ~ 1.32 V | A/D 64x12b | External | -40°C ~ 125°C (TA) | - | 324-BBGA | 324-TEPBGA (23x23) |
||
NXP |
IC MCU 32BIT 512KB FLASH 80LQFP
|
pacchetto: 80-LQFP |
Azione5.296 |
|
32-Bit | 50MHz | I2C, IrDA, SPI, UART/USART, USB, USB OTG | DMA, I2S, LVD, POR, PWM, WDT | 56 | 512KB (512K x 8) | FLASH | - | 64K x 8 | 1.71 V ~ 3.6 V | A/D 20x16b, D/A 1x12b | Internal | -40°C ~ 105°C (TA) | - | 80-LQFP | 80-LQFP (12x12) |